Aspects of the present disclosure provide fluoropolymers and methods for forming and using such fluoropolymers. Fluoropolymers include polyfluorobenzoxazines and polyfluoroimides. Methods for forming polyphthalonitriles are also provided. The present disclosure is further directed to compositions containing one or more fluoropolymers and one or more metal oxides.

An addition reaction type polyimide resin molded body having a thickness of 5 mm or more, with a number of defects having a size of 0.5 mm or more present on the entire surface of the molded body being 1 per 100 cm.sup.2 or less. The addition reaction type polyimide resin molded body is formed by: holding a prepolymer of an addition reaction type polyimide resin at a temperature equal to or higher than a viscosity increase starting temperature of the addition reaction type polyimide resin and increasing a melt viscosity at a temperature lower by 10° C. than the viscosity increase starting temperature to 70 to 900 kPa.Math.s; grinding and mixing the addition reaction type polyimide resin to form a molding precursor; and shaping the molding precursor at a temperature equal to or higher than a heat-curing temperature of the addition reaction type polyimide resin.

An addition reaction type polyimide resin molded body having a thickness of 5 mm or more, with a number of defects having a size of 0.5 mm or more present on the entire surface of the molded body being 1 per 100 cm.sup.2 or less. The addition reaction type polyimide resin molded body is formed by: holding a prepolymer of an addition reaction type polyimide resin at a temperature equal to or higher than a viscosity increase starting temperature of the addition reaction type polyimide resin and increasing a melt viscosity at a temperature lower by 10° C. than the viscosity increase starting temperature to 70 to 900 kPa.Math.s; grinding and mixing the addition reaction type polyimide resin to form a molding precursor; and shaping the molding precursor at a temperature equal to or higher than a heat-curing temperature of the addition reaction type polyimide resin.

The present disclosure is directed to providing a support substrate for a display device capable of obtaining high transparency while accomplishing thinning and flexibility of an organic EL display device.

In view of the above, the present disclosure provides a support substrate for a display device including a TFT glass substrate having a thickness of 10 μm to 150 μm, and a polyimide resin layer having a thickness of 150 nm or less installed in contact with the TFT glass substrate.

The present disclosure is directed to providing a support substrate for a display device capable of obtaining high transparency while accomplishing thinning and flexibility of an organic EL display device.

In view of the above, the present disclosure provides a support substrate for a display device including a TFT glass substrate having a thickness of 10 μm to 150 μm, and a polyimide resin layer having a thickness of 150 nm or less installed in contact with the TFT glass substrate.

A polyamic acid solution includes a dianhydride and a diamine. The dianhydride includes pyromellitic dianhydride, the diamine includes a benzimidazole, the molar ratio of dianhydride monomer to diamine monomer is in a range of from 0.85:1 to 0.99:1, and the polyamic acid solution has a solids content in a range of from 10 to 25 weight percent and a viscosity in a range of from 300 to 3000 poise.

A polyimide film includes a polyimide in which a specific amount of molecular framework containing one or two silicon atoms in its main chain, wherein a total light transmittance measured in accordance with JIS K7361-1 is 85% or more; wherein a yellowness index calculated in accordance with JIS K7373-2006 is 30 or less; wherein a glass transition temperature is in a temperature range of from 150° C. to 400° C.; and wherein a tensile elastic modulus at 25° C. obtained by measuring a 15 mm×40 mm test piece at a tensile rate of 10 mm/min and a chuck distance of 20 mm in accordance with JIS K7127, is 1.8 GPa or more.

A photosensitive resin composition is also provided that includes a polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor; a photo-radical polymerization initiator; and a solvent, in which an acid value of an acid group contained in the polymer precursor and having a neutralization point in a pH range of 7.0 to 12.0 is in a range of 2.5 to 34.0 mgKOH/g, and either the polymer precursor contains a radically polymerizable group or the photosensitive resin composition includes a radically polymerizable compound other than the polymer precursor.

A polyimide composition, comprising a functionalized polyimide prepared from a substituted or unsubstituted C.sub.4-40 bisanhydride; a substituted or unsubstituted C.sub.1-40 organic diamine; and optionally an organic compound comprising at least two functional groups per molecule, wherein a first functional group is reactive with an anhydride group, an amine group, or a combination thereof, and the first functional group is different from a second functional group, wherein the functionalized polyimide comprises a reactive end group of the formula (C.sub.1-40 hydrocarbylene)-NH.sub.2, (C.sub.1-40 hydrocarbylene)-OH, (C.sub.1-40 hydrocarbylene)-SH, (C.sub.4-40 hydrocarbylene)-G, or a combination thereof, wherein G is an anhydride group, a carboxylic acid, a carboxylic ester, or a combination thereof, wherein the functionalized polyimide has a total reactive end group concentration of 50-1,500 μeq/g of the functionalized polyimide, and wherein the polyimide composition has 0.05-1,000 ppm of residual organic diamine, wherein the functionalized polyimide is obtained by precipitation from a solution using an organic anti-solvent or by devolatilization.

The present invention relates to polyetherimide polymers which can for example be used in lithographic processes for the photofabrication of three-dimensional (3D) articles. The invention further relates to compositions including these polyetherimide polymers. Still further, the invention relates to lithographic methods to form 3D articles or objects that incorporate the aforementioned polymer compositions.