The present disclosure provides a polymerizable thermosetting composition comprising an acetylene-bearing benzoxazine compound and a phthalonitrile monomer. The composition can provide a low viscosity for RTM application and can fully cured at a much lower temperature than the phthalonitrile monomer. The cured thermoset polymers having excellent thermal and mechanical properties, such as high thermal stability, heat resistance, high char yield, and enhanced structural rigidity.

The present invention provides a liquid crystal alignment agent having high thermal stability and high solvent solubility, and a liquid crystal panel in which occurrence of ghosting and stain and a decrease in contrast are suppressed even under environments at high temperatures long period of time. The present invention is a liquid crystal alignment agent including a copolymer including a structure represented by a chemical formula (1) below, and a solvent. In the formula, X is a specified structure including a cyclic hydrocarbon group, Y.sup.1 is a specified structure including a cyclic hydrocarbon group, R.sup.1 represents a homogeneous alignment group, a homeotropic alignment group, or a photoreactive functional group, and Z.sup.1 and Z.sup.2 are the same or different, and represent an —NH— group, an —O— group, or a —S— group. ##STR00001##

The present invention provides a liquid crystal alignment agent having high thermal stability and high solvent solubility, and a liquid crystal panel in which occurrence of ghosting and stain and a decrease in contrast are suppressed even under environments at high temperatures long period of time. The present invention is a liquid crystal alignment agent including a copolymer including a structure represented by a chemical formula (1) below, and a solvent. In the formula, X is a specified structure including a cyclic hydrocarbon group, Y.sup.1 is a specified structure including a cyclic hydrocarbon group, R.sup.1 represents a homogeneous alignment group, a homeotropic alignment group, or a photoreactive functional group, and Z.sup.1 and Z.sup.2 are the same or different, and represent an —NH— group, an —O— group, or a —S— group. ##STR00001##

The present application provides a film containing: a compound (A) containing at least one selected from the group consisting of a maleimide compound and a citraconimide compound; an organic peroxide (B) containing at least one selected from the group consisting of organic peroxides represented by specific formulae; and an imidazole compound (C) represented by a specific formula.

The present application provides a film containing: a compound (A) containing at least one selected from the group consisting of a maleimide compound and a citraconimide compound; an organic peroxide (B) containing at least one selected from the group consisting of organic peroxides represented by specific formulae; and an imidazole compound (C) represented by a specific formula.

A reactive oligomer has a backbone derived from at least one of polyamideimide, polyimide, polyetherimide, polyaryletherketone, polyethersulfone, polyphenylene sulfide, polyamide, polyester, polyarylate, polyesteramide, polycarbonate, polybenzoxazole or polybenzimidazole and functionalized with at least one unreacted functional group capable of thermal chain extension and crosslinking after formation of the reactive oligomer, wherein the reactive oligomer has an M.sub.n of about 250 to about 10,000 g/mol, calculated using the Carothers equation. Compositions comprising the reactive oligomer have at least one other component that includes a second reactive oligomer, an oligomer lacking unreacted functional groups capable of thermal chain extension and crosslinking, a thermoplastic polymer, a thermoplastic polymer having the same backbone repeat units as the reactive oligomer, a filler, or an additive. A method of manufacture of an article comprises heating a composition comprising the reactive oligomer at a sufficient temperature and time to shape and crosslink the reactive oligomer, including additive manufacturing.

The present invention provides a resin composition which is highly sensitive and exhibits high chemical resistance even in the case of being baked at a low temperature of 250° C. or less and can suppress the generation of outgas after curing. The present invention is a resin composition which contains (a) an alkali-soluble resin containing polyimide, polybenzoxazole, polyamide-imide, a precursor of any one of these compounds and/or a copolymer of these compounds and (b) an alkali-soluble resin having a monovalent or divalent group represented by the following general formula (1) in a structural unit and in which the modification rate of a phenolic hydroxyl group in the alkali-soluble resin (b) is 5% to 50%. ##STR00001##
(In general formula (1), O represents an oxygen atom. R.sup.1 represents a hydrogen atom or a hydrocarbon group which has 1 to 20 carbon atoms and may be substituted and R.sup.2 represents an alkyl group having 1 to 5 carbon atoms. s and t each independently represent an integer from 0 to 3. Provided that (s+t)≥1. d represents an integer from 0 to 2. u represents an integer from 1 to 2, and * represents a chemical bond.)

In order to provide a resin composition excellent in pattern processability and film strength, a resin composition film, and a semiconductor device using these, there is provided a resin composition including (A) a polymer compound, (B) a cationic polymerizable compound, and (C) a cationic polymerization initiator, in which (A) the polymer compound has a carboxylic acid residue at a molecular chain terminal.

The method for manufacturing a photosensitive resin composition of the present invention is a method for manufacturing a photosensitive resin composition containing an amide bond-containing precursor having a repeating unit represented by General Formula (1), the method including a step of obtaining an activated carboxylic acid material by activating a carboxylic acid compound represented by General Formula (2) and a step of obtaining the amide bond-containing precursor by allowing an amine compound represented by General Formula (3) to act on the activated carboxylic acid material, in which at least either the step of obtaining an activated carboxylic acid material and the step of obtaining the amide bond-containing precursor is performed in a solvent containing a carbonyl group-containing heterocyclic compound.

##STR00001##

The purpose of the present invention is to provide a photosensitive resin composition that yields a cured film having exceptional heat resistance, elongation, chemical resistance, permittivity, and dielectric tangent while being curable under low-temperature heat treatments, the percentage of film remaining after development being exceptional. To solve the above problem, the photosensitive resin composition of the present invention has the following configuration. Specifically, a photosensitive resin composition that contains a resin (A) and a photopolymerization initiator (B), said resin (A): containing one or more structural units selected from the group consisting of specific structural units represented by formula (1), formula (3), and formula (5); and also containing one or more structural units selected from the group consisting of structural units represented by formula (2), formula (4), and formula (6).