C08G73/22

Polybenzoxazole, Polyamide, Polyamide Solution, Insulating Material for High-Frequency Electronic Component, High-Frequency Electronic Component, High-Frequency Equipment, Insulating Material for Producing High-Frequency Electronic Component, Method for Producing Polyamide, Method for Producing Polybenzoxazole, Method for Producing Insulating Material for High-Frequency Electronic Component, and Diamine or Salt Thereof

Provided is a polybenzoxazole having a structural unit represented by General Formula [1]. In General Formula [1], R.sup.1 is a tetravalent organic group represented by General Formula [2], and R.sup.2 is a divalent organic group. In General Formula [2], two n’s are each independently an integer of 0 to 3, in a case where a plurality of R.sup.3′s are present, the plurality of R.sup.3′s each independently represent a monovalent substituent, and *1, *2, *3, and *4 each independently represent a bonding site, in which one of *1 and *2 is bonded to an oxygen atom in General Formula [1] and the other is bonded to a nitrogen atom in General Formula [1], and one of *3 and *4 is bonded to an oxygen atom in General Formula [1] and the other is bonded to a nitrogen atom in General Formula [1].

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Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts

The present invention is a polymer having a polyamide structural unit, a polyamide-imide structural unit, or a polyimide structural unit, selected from a polyamide, a polyamide-imide, a polyimide, a polyimide precursor, a polybenzoxazole, and a polybenzoxazole precursor, including a reaction product of a diamine containing at least one of a diamine shown by the following general formula (1) and a diamine shown by the following general formula (2), together with at least one of a tetracarboxylic dianhydride shown by the following general formula (3) as well as a dicarboxylic acid and a dicarboxylic halide shown by the following general formula (4). This provides a polymer which is soluble in a safe organic solvent used widely, and is usable as a base resin of a positive photosensitive resin composition that is soluble in an aqueous alkaline solution and capable of forming a fine pattern to give higher resolution. ##STR00001##

Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts

The present invention is a polymer having a polyamide structural unit, a polyamide-imide structural unit, or a polyimide structural unit, selected from a polyamide, a polyamide-imide, a polyimide, a polyimide precursor, a polybenzoxazole, and a polybenzoxazole precursor, including a reaction product of a diamine containing at least one of a diamine shown by the following general formula (1) and a diamine shown by the following general formula (2), together with at least one of a tetracarboxylic dianhydride shown by the following general formula (3) as well as a dicarboxylic acid and a dicarboxylic halide shown by the following general formula (4). This provides a polymer which is soluble in a safe organic solvent used widely, and is usable as a base resin of a positive photosensitive resin composition that is soluble in an aqueous alkaline solution and capable of forming a fine pattern to give higher resolution. ##STR00001##

CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR MANUFACTURING CURED FILM, SEMICONDUCTOR DEVICE, AND POLYMER PRECURSOR
20220002488 · 2022-01-06 · ·

There are provided a curable resin composition containing at least one polymer precursor selected from the group consisting of a polyimide precursor and a polybenzoxazole precursor, where the polymer precursor has a heterocyclic ring structure containing two or more nitrogen atoms and an acid value of the polymer precursor is 1 mmol/g or less, a cured film that is obtained by curing the curable resin composition, a laminate that includes the cured film, a method for manufacturing the cured film, and a semiconductor device including the cured film or the laminate, and a novel polymer precursor.

CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR MANUFACTURING CURED FILM, SEMICONDUCTOR DEVICE, AND POLYMER PRECURSOR
20220002488 · 2022-01-06 · ·

There are provided a curable resin composition containing at least one polymer precursor selected from the group consisting of a polyimide precursor and a polybenzoxazole precursor, where the polymer precursor has a heterocyclic ring structure containing two or more nitrogen atoms and an acid value of the polymer precursor is 1 mmol/g or less, a cured film that is obtained by curing the curable resin composition, a laminate that includes the cured film, a method for manufacturing the cured film, and a semiconductor device including the cured film or the laminate, and a novel polymer precursor.

Phthalonitrile Resins, Methods Of Making Same And Compositions Thereof
20230023657 · 2023-01-26 ·

The present disclosure provides a functionalized phthalonitrile monomer derived from a polyhydric phenol comprising at least one furan group or thiophene group and 4-nitrophthalonitrile. The functionalized phthalonitrile monomer may be used in various thermosetting compositions which can be cured to form thermoset polymers having excellent thermal and mechanical properties, such as high thermal stability, heat resistance, high char yield, and enhanced structural rigidity.

Phthalonitrile Resins, Methods Of Making Same And Compositions Thereof
20230023657 · 2023-01-26 ·

The present disclosure provides a functionalized phthalonitrile monomer derived from a polyhydric phenol comprising at least one furan group or thiophene group and 4-nitrophthalonitrile. The functionalized phthalonitrile monomer may be used in various thermosetting compositions which can be cured to form thermoset polymers having excellent thermal and mechanical properties, such as high thermal stability, heat resistance, high char yield, and enhanced structural rigidity.

Composition for sacrificial film, package, manufacturing method of package

A composition for a sacrificial film includes a polymer, a solvent, and a plasticize compound having an aromatic ring structure. A package includes a die, through insulating vias (TIV), an encapsulant, and a redistribution structure. The die includes a sensing component. The TIVs surround the die. The encapsulant laterally encapsulates the die and the TIVs. The redistribution structure is over the die, the TIVs, and the encapsulant. The redistribution structure has an opening exposing the sensing component of the die. A top surface of the redistribution structure is slanted.

Composition for sacrificial film, package, manufacturing method of package

A composition for a sacrificial film includes a polymer, a solvent, and a plasticize compound having an aromatic ring structure. A package includes a die, through insulating vias (TIV), an encapsulant, and a redistribution structure. The die includes a sensing component. The TIVs surround the die. The encapsulant laterally encapsulates the die and the TIVs. The redistribution structure is over the die, the TIVs, and the encapsulant. The redistribution structure has an opening exposing the sensing component of the die. A top surface of the redistribution structure is slanted.

3D STRUCTURES FOR CELL GROWTH

The present invention relates to a method for creating a three- dimensional structure for cell growth by creating a template of a polymer, applying a hydrogel support onto the template and removing the template. The present invention further provides a device for cell growth comprising a polymer template embedded in a hydrogel.