C08G77/045

RESIN COMPOSITION HAVING STRONG ADHESION TO A DIELECTRIC LAYER

An optical device includes a dielectric substrate and a cured resin coating adhered to the substrate. The resin coating includes an organic component and an inorganic component. A surface portion of the resin coating includes greater than about 60 at. % inorganic component and less than about 40 at. % organic component, an intermediate portion includes between about 10 at. % and about 60 at. % inorganic component, and between about 40 at. % and about 90 at. % inorganic component, and a bottom portion includes less than about 10 at. % inorganic component and greater than about 90 at. % organic component. The resin coating has improved hard coat properties and excellent adhesion to a dielectric.

Thermoplastic resin composition and molded product manufactured therefrom

A thermoplastic resin composition of the present invention is characterized by comprising: a base resin containing a rubber-modified vinyl-based graft copolymer, a large-diameter rubber polymer having an average particle size of about 3 to about 8 μm, and an aromatic vinyl-based copolymer resin; and polyorganosilsesquioxane fine particles having an average particle size of about 0.1 to about 10 μm. The thermoplastic resin composition is excellent in low gloss, weather resistance, and the like.

Curable silicone composition, optical semiconductor device and a method of manufacturing the same

A curable silicone composition encapsulates, coats, or adheres an optical semiconductor element. The curable silicone composition can form a cured product with sufficiently low gas-permeability, and with little weight decrease and little change in hardness even on long-term exposure to high temperatures. The curable silicone composition comprises resinous organopolysiloxane that contains at least one (Ar.sub.2SiO.sub.2/2) unit, wherein Ar denotes an aryl group.

SOLVENTLESS PHOTOCURABLE LIQUID COMPOSITION, CURED PRODUCT THEREOF, OPTICAL FILLER CONTAINING SAME, AND DISPLAY DEVICE INCLUDING LAYER COMPRISING SAID CURED PRODUCT
20230107203 · 2023-04-06 ·

A photocurable liquid silicone composition, that has low viscosity that facilitates injection into a small gap, cures quickly by irradiating with a high energy beam such as ultraviolet light or the like, has a refractive index after curing that is high not only in a visible region but also in an infrared region, in which composition design is possible to provide an arbitrarily low dielectric constant, and is particularly useful as a material for a device using an infrared LED light source, is provided. The composition comprises: (A) one or more type of an organosilane or organopolysiloxane having on average one or more photoreactive functional groups and two or more monovalent functional groups selected from aromatic groups with 6 to 12 carbon atoms and aralkyl groups with 7 to 12 carbon atoms in a molecule and having 1 to 5 silicon atoms, and optionally further comprising (C) a curing catalyst.

Nanosized dendrimeric epoxy resin to prevent casing-casing annulus pressure issues

A method includes introducing an epoxy resin system to a wellbore defect in a wellbore. The epoxy resin system comprises a polyhedral oligomeric silsesquioxane (POSS) epoxy resin with at least one reactive group and a curing agent. The method includes maintaining the epoxy resin system in the wellbore such that a cured epoxy resin system product forms in the wellbore defect.

Invisible fingerprint coatings and process for forming same

A process for forming a fingerprint-resistant coating on a substrate comprising activating the substrate by exposure to a plasma, and then depositing on the activated substrate at least one alkyl backbone monolayer, and hydroxyl-polyhedral oligomeric silsesquioxane (OH-POSS) nanoparticles.

POSS modified polyacrylate fluoride-free waterproof agent and preparation method thereof

A POSS modified polyacrylate fluorine-free waterproofing agent includes following components: 1-10 wt % of a functionalized POSS monomer, 2-20 wt % of methyl methacrylate, 3-26 wt % of butyl acrylate, 1-10 wt % of a long-chain acrylate monomer, 0.5-3.5 wt % of an initiator, 0.5-4 wt % of a reactive cationic emulsifier, and 50-80 wt % of deionized water. A method of preparing a POSS modified polyacrylate fluorine-free waterproofing agent is also disclosed.

SILICONE ELASTOMER, COMPOSITION, AND OPTICAL COUPLING ELEMENT
20170369706 · 2017-12-28 ·

A silicone elastomer includes a plasticizer component formed by or containing oil or an oil blend. The oil or at least one oil of the oil blend has a viscosity that is equal to or less than 350 mm.sup.2/s. The oil or the at least one oil of the oil blend is, for example, a silicone oil.

High temperature debondable adhesive

A debondable adhesive composition comprising (A) the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, (B) a cross-linker for the hydrosilation reaction product, and (C) a metal catalyst and/or a radical initiator is provided.

COMPOSITION FOR ENHANCING THE PROPERTIES OF A SUBSTRATE AND METHOD FOR MAKING THE SAME
20170362133 · 2017-12-21 · ·

A surface treatment composition including polymeric complex nanoparticles used in a hydrophobic agent and siloxane complex nanoparticles used in a suspending agent thereof. The composition of the present invention is a solution comprising a plurality of components. The primary components are an acid mixture and a base mixture that are combined together in a manner to be described herein to produce a two-part liquid solution. The two parts, are combined together prior to application to a surface and allowed to cure on the surface.