The invention comprises a butyl acetate-silicone formulation comprising (A) an organopolysiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule, (B) an organosilicon compound containing an average of at least two silicon-bonded hydrogen atoms per molecule; (C) a hydrosilylation catalyst; and a coating effective amount of (D) butyl acetate. The invention also comprises related silicone formulations made by removing a portion, or all, of (D) butyl acetate therefrom, and related cured products, methods, articles and devices.

There is provided herein a curable polysiloxane composition comprising a reactive polysiloxane having the general structural formula (I):

##STR00001##

as described herein. There is provided a method of making the polysiloxane. In addition, there is provided a curable composition including the polysiloxane.

The present invention relates to a process for producing and for regenerating siloxane hydrogen carrier compounds.

Provided are: a wafer processing temporary adhesive that is for temporarily adhering a wafer to a support and that comprises a thermosetting resin composition containing a non-functional organopolysiloxane; a wafer laminate; and a thin wafer manufacturing method.

The present invention relates to a process for producing high-purity hydrosilylation products, and also to the products that may be produced by this process and to the use thereof as surfactants.

A thermosetting silicone resin composition contains the following components (A-1) to (D): (A-1) an alkenyl group-containing linear organopolysiloxane; (A-2) a branched organopolysiloxane shown by (R.sup.1.sub.3SiO.sub.1/2).sub.a(R.sup.2.sub.3SiO.sub.1/2).sub.b(SiO.sub.4/2).sub.c (1); (B-1) a branched organohydrogenpolysiloxane shown by (HR.sup.2.sub.2SiO.sub.1/2).sub.d(R.sup.2.sub.3SiO.sub.1/2).sub.e(SiO.sub.4/2).sub.f (2); (B-2) a linear organohydrogenpolysiloxane shown by (R.sup.2.sub.3SiO.sub.1/2).sub.2(HR.sup.2SiO.sub.2/2).sub.x(R.sup.2.sub.2SiO.sub.2/2).sub.y (3); (C) an adhesion aid which is an epoxy group-containing branched organopolysiloxane; and (D) a catalyst containing a combination of a zero-valent platinum complex with a divalent platinum complex and/or a tetravalent platinum complex. This provides a thermosetting silicone resin composition which causes little contamination at a gold pad portion and has excellent adhesiveness to a silver lead frame.

Particles P and methods of making the same. The particles P are composed of a core K comprising crosslinked silicone elastomer composition X and of a shell H of silica S. Where the core K includes a reinforcing filler F which is selected from pyrogenic or precipitated hydrophobic silicas having DIN 66131 BET surface areas of at least 50 m.sup.2/g and also from carbon blacks and activated carbons and silicone resins.

In a heat-shielding film formed of addition-curing silicone resin containing organopolysiloxane, organopolysiloxane includes the combination of a plurality of units including at least a R.sup.1SiO.sub.3/2 unit (a T unit), a R.sup.2R.sup.3SiO.sub.2/2 unit (a D unit), and a R.sup.4R.sup.5R.sup.6SiO.sub.1/2 unit (a M unit) (in each unit, R.sup.1 to R.sup.6 is aliphatic hydrocarbon or hydrogen), and the molar ratio of the T unit, the D unit, and the M unit among all structural units is T:33.3 mol % to 71.4 mol %, D:11.1 mol % to 42.9 mol %, and M:7.0 mol % to 42.9 mol %.

In a heat-shielding film formed of addition-curing silicone resin containing organopolysiloxane, organopolysiloxane includes the combination of a plurality of units including at least a R.sup.1SiO.sub.3/2 unit (a T unit), a R.sup.2R.sup.3SiO.sub.2/2 unit (a D unit), and a R.sup.4R.sup.5R.sup.6SiO.sub.1/2 unit (a M unit) (in each unit, R.sup.1 to R.sup.6 is aliphatic hydrocarbon or hydrogen), and the molar ratio of the T unit, the D unit, and the M unit among all structural units is T:33.3 mol % to 71.4 mol %, D:11.1 mol % to 42.9 mol %, and M:7.0 mol % to 42.9 mol %.

A curable silicone-(meth)acrylate pressure sensitive composition is curable via hydrosilylation reaction to form a silicone-(meth)acrylate pressure sensitive adhesive with an initial adhesion. When the silicone-(meth)acrylate pressure sensitive adhesive is exposed to actinic radiation, the resulting silicone-(meth)acrylate adhesive has a subsequent adhesion, which is higher than the initial adhesion.