One of the objects the present invention to provide a cured product of a thermally conductive silicone composition having high thermal conductivity and excellent compressibility. A silicone composition comprising an organo(poly)siloxane and a thermally conductive filler, wherein the organo(poly)siloxane comprises at least one curable organo(poly)siloxane, the thermally conductive filler comprises (B-i) unsintered aluminum nitride having an average particle size of 20 μm or more and 120 μm or less and (B-ii) alumina having an average particle size of 0.1 μm or more and 5 μm or less, the (B-ii) alumina comprises spherical alumina with 25 to 80 mass % of the spherical alumina, based on a total mass of the component (B-ii), a proportion of the component (B-ii) is 25 to 50 mass %, based on a total mass of the components (B-i) and (B-ii), and a proportion of a volume of the thermally conductive filler is 80 to 90 volume %, based on a total volume of the silicone composition.

One of the objects the present invention to provide a cured product of a thermally conductive silicone composition having high thermal conductivity and excellent compressibility. A silicone composition comprising an organo(poly)siloxane and a thermally conductive filler, wherein the organo(poly)siloxane comprises at least one curable organo(poly)siloxane, the thermally conductive filler comprises (B-i) unsintered aluminum nitride having an average particle size of 20 μm or more and 120 μm or less and (B-ii) alumina having an average particle size of 0.1 μm or more and 5 μm or less, the (B-ii) alumina comprises spherical alumina with 25 to 80 mass % of the spherical alumina, based on a total mass of the component (B-ii), a proportion of the component (B-ii) is 25 to 50 mass %, based on a total mass of the components (B-i) and (B-ii), and a proportion of a volume of the thermally conductive filler is 80 to 90 volume %, based on a total volume of the silicone composition.

A silicone gel composition of the present invention contains the following components; A 100 parts by mass of an organopolysiloxane that is curable by an addition reaction; B. 0.01 to 10 parts by mass of an unsaturated hydrocarbon compound having one alkenyl group per molecule; and C. an addition reaction curing catalyst in a catalytic amount. The unsaturated hydrocarbon compound is at least one selected from the group consisting of an a-olefin that is liquid at room temperature (25° C.) and does not volatilize or decompose at 100° C. and α-methylstyrene. A silicone gel sheet of the present invention is obtained by molding the silicone gel composition into a sheet, and curing the sheet.

The present application relates to a plasma polymer thin film and a method for preparing the same, the plasma polymer thin film prepared using a first precursor material represented by the following Chemical Formula 1:

##STR00001##

(In Chemical Formula 1,

R.sub.1 to R.sub.9 are each independently H or a C.sub.1-C.sub.5 substituted or unsubstituted alkyl group, and when R.sub.1 to R.sub.9 are substituted, the substituent is an amino group, a hydroxyl group, a cyano group, a halogen group, a nitro group, or a methoxy group).

The present application relates to a plasma polymer thin film and a method for preparing the same, the plasma polymer thin film prepared using a first precursor material represented by the following Chemical Formula 1:

##STR00001##

(In Chemical Formula 1,

R.sub.1 to R.sub.9 are each independently H or a C.sub.1-C.sub.5 substituted or unsubstituted alkyl group, and when R.sub.1 to R.sub.9 are substituted, the substituent is an amino group, a hydroxyl group, a cyano group, a halogen group, a nitro group, or a methoxy group).

A method for producing a thermally conductive sheet S includes a step of obtaining a thermally conductive composition by mixing a reactive liquid resin, which forms a rubbery or gelatinous matrix when crosslinked, a volatile liquid having a boiling point 10° C. or more higher than a curing temperature of the reactive liquid resin, and a thermally conductive filler; a step of forming a molded body by crosslinking and curing the reactive liquid resin at a temperature 10° C. or more lower than the boiling point of the volatile liquid; and a step of evaporating the volatile liquid by heating the molded body, in which these steps are performed sequentially.

The invention described herein generally pertains to a composition that includes a silyl-terminated polymer having silyl groups linked to a polymer backbone via triazole. The silyl-terminated polymer is a reaction product of a functionalized polymer backbone and a functionalized silane. The polymer backbone includes a first functional group, which may be one of an azide or an alkyne. The functionalized silane includes a second functional group may also be one of an azide or an alkyne, but is also different from the first functional group. The functionalized polymer backbone is reacted with the functionalized silane in the presence of a metal catalyst.

Silicone optically clear adhesives compositions and films with pressure sensitive properties are described. The silicone optically clear adhesives compositions are thermal, UV curable, or UV-moisture dual curable. The silicone optically clear adhesives are suitable for sealing and bonding cover glasses, touch panels, diffusers, rigid compensators, heaters, and flexible films, polarizers and retarders in the optical display devices, and are particularly suitable in flexible and foldable displays.

An adhesive silicone composition having (A) a linear or branched organopolysiloxane having at least two alkenyl groups in a molecule (B) an organopolysiloxane comprising R.sup.2.sub.3SiO.sub.1/2 units and SiO.sub.4/2 units, wherein R.sup.2 is, independently of each other, a substituted or unsubstituted, monovalent hydrocarbon group having 1 to 10 carbon atoms, (C) an organohydrogenpolysiloxane having at least three hydrogen atoms each bonded to a silicon atom in a molecule and having no aryl group, and (E) an organohydrogenpolysiloxane having at least three hydrogen atoms each bonded to a silicon atom in a molecule and having an aryl group-containing organic group.

An adhesive silicone composition having (A) a linear or branched organopolysiloxane having at least two alkenyl groups in a molecule (B) an organopolysiloxane comprising R.sup.2.sub.3SiO.sub.1/2 units and SiO.sub.4/2 units, wherein R.sup.2 is, independently of each other, a substituted or unsubstituted, monovalent hydrocarbon group having 1 to 10 carbon atoms, (C) an organohydrogenpolysiloxane having at least three hydrogen atoms each bonded to a silicon atom in a molecule and having no aryl group, and (E) an organohydrogenpolysiloxane having at least three hydrogen atoms each bonded to a silicon atom in a molecule and having an aryl group-containing organic group.