A curable particulate silicone composition is disclosed. The composition comprises: (A) hot-melt silicone fine particles having a specific reactive functional group; (B) an inorganic filler; and (C) a curing agent. The content of component (B) is in the range of from 87 to 95 vol. % of the total composition. The curable particulate silicone composition provides a cured product having an average linear expansion coefficient of not greater than 15 ppm/° C. in a range of from 25° C. to 200° C. The curable particulate silicone composition provides a cured product having a very low average linear expansion coefficient over a wide temperature range when cured and is particularly suitable for overmold molding and the like.

A polydiorganosiloxane having both a silicon bonded aliphatically unsaturated group and a silicon bonded poly(meth)acrylate polymer or copolymer, and method for preparation of this polydiorganosiloxane are disclosed. The method preserves the aliphatically unsaturated groups when grafting the poly(meth)acrylate to the polydiorganosiloxane. This polydiorganosiloxane is useful in hydrosilylation reaction curable compositions, such as pressure sensitive adhesive compositions.

A polydiorganosiloxane having both a silicon bonded aliphatically unsaturated group and a silicon bonded poly(meth)acrylate polymer or copolymer, and method for preparation of this polydiorganosiloxane are disclosed. The method preserves the aliphatically unsaturated groups when grafting the poly(meth)acrylate to the polydiorganosiloxane. This polydiorganosiloxane is useful in hydrosilylation reaction curable compositions, such as pressure sensitive adhesive compositions.

A thermally conductive addition-curable silicone composition includes: a heat-treated mixture including (A) an organopolysiloxane having at least two alkenyl groups bonded to a silicon atom in one molecule, (B) an organohydrogenpolysiloxane having at least three hydrogen atoms bonded to a silicon atom in one molecule, and (C) aluminum oxide; (D) an organohydrogenpolysiloxane having at least two hydrogen atoms bonded to a silicon atom in one molecule; (E) a platinum-based metal catalyst; and (F) a cation-exchange type and/or both-ions-exchange type ion trap agent. A thermally conductive addition-curable silicone composition can be applied on electric and electronic components and in a module including a circuit substrate mounting these components thereon and can exhibit excellent stress relaxation property and thermal conductivity after cured. In addition, a method for producing the same.

A thermally conductive addition-curable silicone composition includes: a heat-treated mixture including (A) an organopolysiloxane having at least two alkenyl groups bonded to a silicon atom in one molecule, (B) an organohydrogenpolysiloxane having at least three hydrogen atoms bonded to a silicon atom in one molecule, and (C) aluminum oxide; (D) an organohydrogenpolysiloxane having at least two hydrogen atoms bonded to a silicon atom in one molecule; (E) a platinum-based metal catalyst; and (F) a cation-exchange type and/or both-ions-exchange type ion trap agent. A thermally conductive addition-curable silicone composition can be applied on electric and electronic components and in a module including a circuit substrate mounting these components thereon and can exhibit excellent stress relaxation property and thermal conductivity after cured. In addition, a method for producing the same.

Film-forming polymers that contain covalently-attached or non-covalently bound light-filtering, e.g., UV-absorbing, compounds and their use as a skin-protectant coating, such as a sunscreen, are disclosed.

Film-forming polymers that contain covalently-attached or non-covalently bound light-filtering, e.g., UV-absorbing, compounds and their use as a skin-protectant coating, such as a sunscreen, are disclosed.

Provided is: a multicomponent curable thermally conductive silicone gel composition which has a high thermal conductivity, has excellent gap-filling ability and repairability, and has superior storage stability; a thermally conductive member comprising the composition; and a heat dissipating structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane; (C) a catalyst for hydrosilylation reaction; (D) a thermally conductive filler; (E) a silane-coupling agent or a hydrolysis condensation product thereof; and (F) a specific organopolysiloxane having a hydrolyzable silyl group at one end thereof. The thermally conductive silicone gel composition includes (I) a liquid composition that includes components (A), (C), (D), (E), and (F), but does not include component (B) and (II) a liquid composition that includes components (B), (D), (E), and (F), but does not include component (C) which are individually stored.

An electronic component, or a precursor thereof, that comprises a curable organopolysiloxane composition or a cured product thereof is disclosed. The curable organopolysiloxane composition is generally curable through a hydrosilylation reaction and can be applied to at least one area by a microdroplet application device. The curable organopolysiloxane composition has a viscosity of no more than 2.0 Pa.Math.s at a strain rate of 1,000 (1/s), and a viscosity at a strain rate of 0.1 (1/s) being a value no less than 50.0 times the viscosity at a strain rate of 1,000 (1/s). In particular, the area of application generally is a substantially circular area that fits within a frame no more than 1000 μm in diameter, a linear area no more than 1000 μm in line width, or a pattern configured from a combination of these areas.

An electronic component, or a precursor thereof, that comprises a curable organopolysiloxane composition or a cured product thereof is disclosed. The curable organopolysiloxane composition is generally curable through a hydrosilylation reaction and can be applied to at least one area by a microdroplet application device. The curable organopolysiloxane composition has a viscosity of no more than 2.0 Pa.Math.s at a strain rate of 1,000 (1/s), and a viscosity at a strain rate of 0.1 (1/s) being a value no less than 50.0 times the viscosity at a strain rate of 1,000 (1/s). In particular, the area of application generally is a substantially circular area that fits within a frame no more than 1000 μm in diameter, a linear area no more than 1000 μm in line width, or a pattern configured from a combination of these areas.