The present disclosure relates to new types of low oil bleeding thermal interface materials, such as thermal gap pad materials, which may be in the form of a thermally conductive gasket. In exemplary embodiments, a thermal interface material comprises a matrix material and a thermally conductive filler. The thermally conductive filler has particles which are approximately spherical in shape when observed using a scanning electron microscope, an average particle diameter (D50) of 2-120 μm, and an average degree of sphericity of 70-90%. According to the present disclosure, by using a quasi-spherical thermally conductive filler having a specific sphericity, oil bleeding can be prevented, mitigated, or reduced while achieving high thermal conductivity compared to the case of using a perfectly spherical or irregularly shaped thermally conductive filler.

The present disclosure relates to new types of low oil bleeding thermal interface materials, such as thermal gap pad materials, which may be in the form of a thermally conductive gasket. In exemplary embodiments, a thermal interface material comprises a matrix material and a thermally conductive filler. The thermally conductive filler has particles which are approximately spherical in shape when observed using a scanning electron microscope, an average particle diameter (D50) of 2-120 μm, and an average degree of sphericity of 70-90%. According to the present disclosure, by using a quasi-spherical thermally conductive filler having a specific sphericity, oil bleeding can be prevented, mitigated, or reduced while achieving high thermal conductivity compared to the case of using a perfectly spherical or irregularly shaped thermally conductive filler.

Polysilocarb formulations, cured and pyrolized materials, was well as articles and use for this material. In particular pyrolized polysilocarb ceramic materials and articles contain these materials where, the ceramic has from about 30 weight % to about 60 weight % silicon, from about 5 weight % to about 40 weight % oxygen, and from about 3 weight % to about 35 weight % carbon, and wherein 20 weight % to 80 weight % of the carbon is silicon-bound-carbon and 80 weight % to about 20 weight % of the carbon is free carbon.

Nanocomposite silicon and carbon compositions. These compositions can be made from polymer derived ceramics, and in particular, polysilocarb precursors. The nanocomposite can have non-voids or be nano-void free and can form larger macro-structures and macro-composite structures. The nanocomposite can contain free carbon domains in an amorphous SiOC matrix.

A photosensitive resin composition comprising (A) a vinyl ether compound, (B) an epoxy-containing silicone resin, and (C) a photoacid generator is provided. The composition enables pattern formation using radiation of widely varying wavelength, and the patterned film has high transparency, light resistance, and heat resistance.

A photosensitive resin composition comprising (A) a vinyl ether compound, (B) an epoxy-containing silicone resin, and (C) a photoacid generator is provided. The composition enables pattern formation using radiation of widely varying wavelength, and the patterned film has high transparency, light resistance, and heat resistance.

A thermally conductive resin composition capable of maintaining high thermal conductivity and a thermally conductive sheet using the same, a thermally conductive resin composition contains an addition reaction type silicone resin, a thermally conductive filler, an alkoxysilane compound, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to an alkoxysilane compound, and contains 55 to 85% by volume of the thermally conductive filler. A thermally conductive resin composition contains an addition reaction type silicone resin, an alkoxysilane compound, a thermally conductive filler, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to the alkoxysilane compound, and exhibits thermal conductivity of 5 W/m*K or more after curing.

An adhesive matrix and adhesive formulation are described. The adhesive matrix is comprised of a hydrophilic domain and a hydrophobic domain, and a therapeutically active agent contained in the matrix in a supersaturated, stable, condition. The hydrophilic domain and the hydrophobic domain are co-soluble in a solvent system, to provide a homogeneous blend in which the active agent is solubilized. The proportion of the hydrophilic domain and hydrophobic domain is selected to optimize, or maximize, solubility of active agent in the matrix.

The present teachings generally provide curable polysiloxane compositions including a base resin including a surface active polymer. Articles of manufacture including the curable polysiloxane compositions and slippery coatings and materials also are provided. The compositions may be used to provide slippery, lubricious, or repellent materials and coatings and may provide anti-fouling function. The compositions can provide anti-fouling or foul-release function on open surfaces, internal surfaces, membranes; to provide pinning free or low contact angle hysteresis surfaces; to provide homogeneous interface to suppress nucleation; to provide a barrier layer such as anti-corrosion; to provide anti-stain, anti-smudge, anti-fingerprint, anti-soil function.

The present invention is related to a curable composition for dental impression comprising: a curable base composition and a surfactant system comprising a first surfactant, which is at least one compound having the formula (I) and a second surfactant, which works synergistically with the second surfactant so as to permit the composition to surprisingly have a lower contact angle; these results are reached with relatively low concentrations of biodegradable surfactants.

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