A liquid preparation for application to an inner side of a hollow body to produce a sliding layer on a packaging for pharmaceuticals or cosmetic products comprises the following constituents: a reactive silicone system for forming a silicone network of the sliding layer, a catalyst for catalyzing the cross-linking reaction of the reactive silicone system, at least one unreactive silicone oil, and at least one diluent. The diluent comprises a silicon-containing compound and a content of the at least one diluent in the preparation amounts to more than 45 percent by weight and less than 95 percent by weight in the preparation.

A curable silicone composition is disclosed herein. The curable silicone composition comprises: (A) an alkenyl group-containing organopolysiloxane comprising (A.sub.1) a linear organopolysiloxane having at least two alkenyl groups per molecule, and (A.sub.2) a resinous organopolysiloxane; (B) a silicon atom-bonded hydrogen atom-containing organopolysiloxane comprising (B.sub.1) a resinous organopolysiloxane, (B.sub.2) a linear or partially branched organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule, and having not less than 0.5 mass % of silicon atom-bonded hydrogen atoms, and (B.sub.3) a linear organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule, and having less than 0.5 mass % of silicon atom-bonded hydrogen atoms; and (C) a hydrosilylation reaction catalyst. The curable silicone composition can be cured to form a cured product generally exhibiting good elongation and tensile strength.

A curable silicone composition is disclosed herein. The curable silicone composition comprises: (A) an alkenyl group-containing organopolysiloxane comprising (A.sub.1) a linear organopolysiloxane having at least two alkenyl groups per molecule, and (A.sub.2) a resinous organopolysiloxane; (B) a silicon atom-bonded hydrogen atom-containing organopolysiloxane comprising (B.sub.1) a resinous organopolysiloxane, (B.sub.2) a linear or partially branched organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule, and having not less than 0.5 mass % of silicon atom-bonded hydrogen atoms, and (B.sub.3) a linear organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule, and having less than 0.5 mass % of silicon atom-bonded hydrogen atoms; and (C) a hydrosilylation reaction catalyst. The curable silicone composition can be cured to form a cured product generally exhibiting good elongation and tensile strength.

The diamond particle according to the present invention has an ionic conductivity Di represented by the following expression of 0.8 mS/m or lower:
Di=Ds−Dw
wherein Ds represents an ionic conductivity of an aqueous solution obtained by dissolving-out in a pressure cooker test carried out according to IEC68-2-66; and Dw represents an ionic conductivity of distilled water.

A polymerizable composition for 3D printing includes a photocurable polymer resin and metal diboride nanosheets. The resulting polymer nanocomposite includes a polymer matrix and metal diboride nanosheets dispersed throughout the polymer matrix. A method of synthesizing a nanomaterial-containing resin for 3D printing includes preparing a dispersion of metal diboride nanosheets in a solvent, and combining the dispersion with a liquid polymer resin to yield the nanomaterial-containing resin. A method of fabricating a nanocomposite structure from the nanomaterial-containing resin includes providing the nanomaterial-containing resin to a three-dimensional printer, forming a three-dimensional structure with the three-dimensional printer, and processing the three-dimensional structure to yield the nanocomposite structure.

A defoamer or anti-foam formulation and a process for preparing the same. The process includes in a first step, preparing branched organopolysiloxanes (A) by irradiating organopolysiloxanes (X) of the formula (1)

R.sup.1.sub.3-a(R.sup.2O).sub.aSi—[OSiR.sup.3.sub.2].sub.n—OSi(OR.sup.2).sub.aR.sup.1.sub.3-a   (1).

Where with high-energy radiation, the viscosity of the organopolysiloxanes (A) is at least 40% higher than the viscosity of the organopolysiloxanes (X). In a second step, the branched organopolysiloxanes (A) are treated with a filler (B) which is selected from precipitated and/or fumed silicas, and organopolysiloxane resins (C).

A defoamer or anti-foam formulation and a process for preparing the same. The process includes in a first step, preparing branched organopolysiloxanes (A) by irradiating organopolysiloxanes (X) of the formula (1)

R.sup.1.sub.3-a(R.sup.2O).sub.aSi—[OSiR.sup.3.sub.2].sub.n—OSi(OR.sup.2).sub.aR.sup.1.sub.3-a   (1).

Where with high-energy radiation, the viscosity of the organopolysiloxanes (A) is at least 40% higher than the viscosity of the organopolysiloxanes (X). In a second step, the branched organopolysiloxanes (A) are treated with a filler (B) which is selected from precipitated and/or fumed silicas, and organopolysiloxane resins (C).

A polypropylene composition comprising the following components in parts by weight: 40-99 parts of a polypropylene resin; 15-30 parts of an ethylene-α olefin copolymer; 0.2-1 part of an antimicrobial agent; and 1-3 parts of a polypropylene grafted polydimethylsiloxane is provided. By controlling a melt index of an elastomer, distribution of the modified polydimethylsiloxane and antimicrobial agent can be improved, thus improving antimicrobial and stain-resistant effects of the polypropylene composition.

A thermally conductive silicone potting composition that comprises, each in a preset amount, (A) an organopolysiloxane having at least two alkenyl groups per molecule and having a viscosity of 0.01-100 Pa.Math.s at 25° C., (B) an organopolysiloxane one end of which is blocked with an alkoxysilyl group, etc., (C) a crystalline silica having an average particle size of 0.1 μm or more and less than 5 μm, (D) a crystalline silica having an average particle size of 5 μm or more and less than 100 μm, (E) an organohydrogen siloxane having at least two SiH groups per molecule, and (F) a hydrosilylation reaction catalyst, wherein the mass ratio of (C)/(D) is from 3/1 to 1/10.

A photocurable silicone composition is disclosed. A cured product of the composition is also disclosed, as well as methods of forming the same. The photocurable silicone composition comprises: (A) a specific organopolysiloxane having alkenyl groups in a molecule; (B) a compound having at least two thiol groups in a molecule; (C) a photoradical initiator having a phosphorus atom; and (D) a specific hydroxyphenyl triazine compound. The composition exhibits excellent curability by LED lamp with wide UV-Visible range as well as metal-halide lamp, and cures to form a cure product exhibiting excellent resistance to light.