Patent classifications
C08G77/20
WOUND DRESSINGS COMPRISING POLYSILOXANE-POLYGLYCEROL BLOCK COPOLYMERS AND METHODS OF MAKING AND USE THEREOF
Described herein are wound dressing comprising a silicone hydrogel composition and optionally an antimicrobial agent, and methods of making and use thereof. The silicone hydrogel compositions comprise an actinically-crosslinkable polysiloxane-polyglycerol block copolymer crosslinked with a crosslinker. The actinically-crosslinkable polysiloxane-polyglycerol block copolymer being derived from: a polysiloxane prepolymer comprising a polyglycerol side chain, the polyglycerol side chain comprising an ethylenically unsaturated group covalently linked thereto, wherein the ethylenically unsaturated group is actinically curable.
FUNCTIONAL SKIN COATING POLYMER
Film-forming polymers that contain covalently-attached or non-covalently bound light-filtering, e.g., UV-absorbing, compounds and their use as a skin-protectant coating, such as a sunscreen, are disclosed.
FUNCTIONAL SKIN COATING POLYMER
Film-forming polymers that contain covalently-attached or non-covalently bound light-filtering, e.g., UV-absorbing, compounds and their use as a skin-protectant coating, such as a sunscreen, are disclosed.
Silicone emulsion composition for forming rubber coating film, and method for manufacturing same
The silicone emulsion composition for forming a rubber coating film according to the present invention, including (A) an organopolysiloxane having at least two hydroxyl groups bonded to silicon atoms at terminal ends of the molecule in each molecule thereof, (B) an aminoalkyltrialkoxysilane represented by formula (1) ##STR00001##
(where R.sup.1 through R.sup.3 represent H or a univalent hydrocarbon group, R.sup.4 and R.sup.5 represent divalent hydrocarbon groups, R.sup.6 represents a univalent hydrocarbon group, and n is an integer 0 to 6), (C) a vinyltrialkoxysilane represented by formula (2):
CH.sub.2═CHSi(OR.sup.7).sub.3
(where R.sup.7 represents a univalent hydrocarbon group), (D) a surfactant, and (E) water and not containing an organic tin compound, is free of problems with storage stability or byproducts, and a rubber coating film can be formed thereby in a short time without the use of an organic tin compound.
Silicone emulsion composition for forming rubber coating film, and method for manufacturing same
The silicone emulsion composition for forming a rubber coating film according to the present invention, including (A) an organopolysiloxane having at least two hydroxyl groups bonded to silicon atoms at terminal ends of the molecule in each molecule thereof, (B) an aminoalkyltrialkoxysilane represented by formula (1) ##STR00001##
(where R.sup.1 through R.sup.3 represent H or a univalent hydrocarbon group, R.sup.4 and R.sup.5 represent divalent hydrocarbon groups, R.sup.6 represents a univalent hydrocarbon group, and n is an integer 0 to 6), (C) a vinyltrialkoxysilane represented by formula (2):
CH.sub.2═CHSi(OR.sup.7).sub.3
(where R.sup.7 represents a univalent hydrocarbon group), (D) a surfactant, and (E) water and not containing an organic tin compound, is free of problems with storage stability or byproducts, and a rubber coating film can be formed thereby in a short time without the use of an organic tin compound.
Multicomponent-curable thermally-conductive silicone gel composition, thermally-conductive member and heat dissipation structure
Provided is: a multicomponent curable thermally conductive silicone gel composition which has a high thermal conductivity, has excellent gap-filling ability and repairability, and has superior storage stability; a thermally conductive member comprising the composition; and a heat dissipating structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane; (C) a catalyst for hydrosilylation reaction; (D) a thermally conductive filler; (E) a silane-coupling agent or a hydrolysis condensation product thereof; and (F) a specific organopolysiloxane having a hydrolyzable silyl group at one end thereof. The thermally conductive silicone gel composition includes (I) a liquid composition that includes components (A), (C), (D), (E), and (F), but does not include component (B) and (II) a liquid composition that includes components (B), (D), (E), and (F), but does not include component (C) which are individually stored.
Electronic component or precursor thereof, and method for manufacturing same
An electronic component, or a precursor thereof, that comprises a curable organopolysiloxane composition or a cured product thereof is disclosed. The curable organopolysiloxane composition is generally curable through a hydrosilylation reaction and can be applied to at least one area by a microdroplet application device. The curable organopolysiloxane composition has a viscosity of no more than 2.0 Pa.Math.s at a strain rate of 1,000 (1/s), and a viscosity at a strain rate of 0.1 (1/s) being a value no less than 50.0 times the viscosity at a strain rate of 1,000 (1/s). In particular, the area of application generally is a substantially circular area that fits within a frame no more than 1000 μm in diameter, a linear area no more than 1000 μm in line width, or a pattern configured from a combination of these areas.
NON-CURABLE THERMALLY CONDUCTIVE PITUITOUS SILICONE MATERIAL
A non-curable thermally conductive material contains: (a) a matrix material containing: (i) 90 to 98 wt % of a non-functional non-crosslinked organosiloxane fluid having a dynamic viscosity of 50 to 350 centiStokes; and (ii) 2 to less than 10 wt % of a crosslinked hydrosilylation reaction product of an alkenyl terminated polydiorganosiloxane having a degree of polymerization greater than 300 and an organohydrogensiloxane crosslinker with 2 or more SiH groups per molecule where the molar ratio of SiH groups to alkenyl groups is 0.5 to 2.0; (b) greater than 80 wt % to less than 95 wt % thermally conductive filler dispersed throughout the matrix material; and (c) treating agents selected from alkyltrialkoxy silanes where the alkyl contains one to 14 carbon atoms and monotrialkoxy terminated diorganopolysiloxanes having a degree of polymerization of 20 to 110 and the alkoxy groups each contain one to 12 carbon atoms dispersed in the matrix material.
Polyorganosiloxane-containing graft copolymer powder, and resin composition using the same, and molded article formed of the same
An object of the present invention is to provide a polyorganosiloxane-containing graft copolymer powder capable of providing a resin composition and a molded article which are excellent in balance between colorability and mechanical properties such as impact resistance. The polyorganosiloxane-containing graft copolymer powder according to the present invention is a graft copolymer powder obtained by graft-polymerizing a mixture (B) of a vinyl monomer (b1) having an epoxy group and another vinyl monomer (b2) to a rubber (A) containing a polyorganosiloxane, wherein the content of the polyorganosiloxane (A1) contained in the rubber (A) is 12 to 50% by mass, the mass average particle diameter of the polyorganosiloxane-containing graft copolymer powder is 300 to 2000 nm, and the epoxy equivalent of the polyorganosiloxane-containing graft copolymer powder is 2500 to 7800 g/eq.
Bio-electrode composition, bio-electrode, and method for manufacturing a bio-electrode
The present invention provides a bio-electrode composition including a silsesquioxane bonded to a sulfonimide salt, wherein the sulfonimide salt is shown by the following general formula (1): ##STR00001##
wherein R.sup.1 represents a linear, branched, or cyclic alkylene group having 1 to 20 carbon atoms that may have an aromatic group, an ether group, or an ester group, or an arylene group having 6 to 10 carbon atoms; Rf represents a linear, branched, or cyclic alkyl group having 1 to 4 carbon atoms containing at least one fluorine atom; M.sup.+ is an ion selected from a lithium ion, a sodium ion, a potassium ion, and a silver ion. This can form a living body contact layer for a bio-electrode that is excellent in electric conductivity and biocompatibility, light-weight, manufacturable at low cost, and free from large lowering of the electric conductivity even though it is wetted with water or dried.