Provided herein is a curable granular silicone composition which has hot-melt properties, is particularly superior in flexibility and toughness at high temperatures from room temperature to about 150° C. in cured products such as overmolding, and provides a cured product that does not easily warp or become damaged even when integrally molded with an aluminum lead frame or the like. A curable granular silicone composition comprising: (A) organopolysiloxane resin microparticles having a curing reactive functional group; (B) a functional inorganic filler; and (C) a curing agent. The composition provides, upon curing, a cured material having a storage modulus at 25° C. and 150° C. of less than 2,000 MPa and less than 100 MPa, respectively, and a peak value of tan δ represented by the storage modulus/loss modulus (G′/G″), is 0.40 or more.

Provided herein is a curable granular silicone composition which has hot-melt properties, is particularly superior in flexibility and toughness at high temperatures from room temperature to about 150° C. in cured products such as overmolding, and provides a cured product that does not easily warp or become damaged even when integrally molded with an aluminum lead frame or the like. A curable granular silicone composition comprising: (A) organopolysiloxane resin microparticles having a curing reactive functional group; (B) a functional inorganic filler; and (C) a curing agent. The composition provides, upon curing, a cured material having a storage modulus at 25° C. and 150° C. of less than 2,000 MPa and less than 100 MPa, respectively, and a peak value of tan δ represented by the storage modulus/loss modulus (G′/G″), is 0.40 or more.

A silicone pressure sensitive adhesive composition is curable to form a silicone pressure sensitive adhesive. The silicone pressure sensitive adhesive composition can be coated on a substrate and cured to form a protective film. The protective film can be adhered to an anti-fingerprint coating on display glass, such as cover glass for a smartphone.

A silicone pressure sensitive adhesive composition is curable to form a silicone pressure sensitive adhesive. The silicone pressure sensitive adhesive composition can be coated on a substrate and cured to form a protective film. The protective film can be adhered to an anti-fingerprint coating on display glass, such as cover glass for a smartphone.

Photocurable poly(siloxane) formulations for making stereolithographic 3D-printed PDMS structures, stereolithographic 3D-printing methods for making PDMS structures, and stereolithographic 3D-printed PDMS structures. ##STR00001##

An aqueous dispersion comprising a silicone-acrylic polymer with reduced coagulum, a process of preparing the aqueous dispersion, and an aqueous coating composition comprising the aqueous dispersion and providing coatings with improved corrosion resistance.

An aqueous dispersion comprising a silicone-acrylic polymer with reduced coagulum, a process of preparing the aqueous dispersion, and an aqueous coating composition comprising the aqueous dispersion and providing coatings with improved corrosion resistance.

Curable silicone pressure sensitive adhesive compositions and films suitable for sealing and adhering substrates for optically clear electronic devices are described. The curable silicone pressure sensitive adhesive compositions are suitable as films or encapsulants for adhering electronic devices, e.g., LCD display, LED display, flexible display, touch screen, and flexible thin film photovoltaic module.

Curable silicone pressure sensitive adhesive compositions and films suitable for sealing and adhering substrates for optically clear electronic devices are described. The curable silicone pressure sensitive adhesive compositions are suitable as films or encapsulants for adhering electronic devices, e.g., LCD display, LED display, flexible display, touch screen, and flexible thin film photovoltaic module.

The present invention discloses a silicone rubber and a method for preparing it, and a phenolic modified silicone rubber resin and a method for preparing it. The structural formula of the silicone rubber is shown as follows:

##STR00001## Wherein x=70-80, y=10-20.

The structural formula of the phenolic-modified silicone rubber resin is shown as follows:

##STR00002## wherein n, x, y are degrees of polymerization, n=10-20, x=70-80, y=10-20. A method for preparing the phenolic-modified silicone rubber resin orderly comprises: adding 90-110 parts by mass of brominated phenolic resin and 180-220 parts of organic solvent into 100 parts by mass of silicone rubber, reacting at 70-80° C. for 24-48 h until the solution is clear and transparent; adding 9-11 parts by mass of capping agent, reacting for another 4-5 h to obtain a reaction liquid containing phenolic-modified silicone rubber resin. The phenolic-modified silicone rubber resin prepared in the present invention can solve the problem of easy pulverization in the ablation process of conventional silicone rubber and meanwhile has high mechanical properties.