Patent classifications
C08G77/54
Silicone structure-containing polymer, photosensitive resin composition, photosensitive resin coating, photosensitive dry film, laminate, and pattern forming process
A photosensitive resin composition comprising a silicone structure-containing polymer having crosslinking groups or crosslinking reaction-susceptible reactive sites in the molecule is coated onto a substrate to form a photosensitive resin coating which has improved substrate adhesion, a pattern forming ability, crack resistance, heat resistance, and reliability as protective film.
SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR SUPPORTING METAL COMPOUND ON SURFACE OF OBJECT TO BE TREATED, ARTICLE HAVING METAL COMPOUND-SUPPORTING COATING FILM, AND METHOD FOR PRODUCING SILICON-CONTAINING POLYMER
Provided are: a novel silicon-containing polymer capable of supporting a metal compound including a metal element; a film-forming composition including the silicon-containing polymer; a method for forming a coating film on the surface of an object to be treated using the film forming composition, and supporting a metal compound on the surface of the object to be treated by bringing the metal compound into contact with the coating film; an article including a coating film which contains said silicon-containing polymer and supports a metal compound; and a method for producing said silicon-containing polymer. This silicon-containing polymer contains, in a molecular chain, at least one among a polysiloxane chain or an oligosiloxane chain, and a polysilane chain or an oligosilane chain, wherein a cyano group-containing hydrocarbon group having 1-10 carbon atoms is introduced onto a silicon atom.
Silicous film forming composition comprising block copolymer and method for producing siliceous film using same
According to the present invention, a siliceous film forming composition, which is capable of filling trenches having narrow widths and high aspect ratios and forming a thick film, can be provided. A siliceous film forming composition comprising: (a) a block copolymer comprising a linear and/or cyclic block A having a polysilane skeleton comprising 5 or more silicon and a block B having a polysilazane skeleton comprising 20 or more silicon, and (b) a solvent.
Silicous film forming composition comprising block copolymer and method for producing siliceous film using same
According to the present invention, a siliceous film forming composition, which is capable of filling trenches having narrow widths and high aspect ratios and forming a thick film, can be provided. A siliceous film forming composition comprising: (a) a block copolymer comprising a linear and/or cyclic block A having a polysilane skeleton comprising 5 or more silicon and a block B having a polysilazane skeleton comprising 20 or more silicon, and (b) a solvent.
Dual-sided multi-layer adhesive
Dual-sided adhesive articles include a first crosslinked pressure sensitive adhesive layer with a first major surface and a second major surface, a second siloxane-based pressure sensitive adhesive layer with a first major surface and a second major surface, such that the first major surface of the second siloxane-based pressure sensitive adhesive layer is in contact with the second major surface of the first crosslinked pressure sensitive adhesive layer. The articles also include a release liner having a microstructured surface with an array of microstructures, where the microstructured surface is in contact with the second major surface of the second siloxane-based pressure sensitive adhesive layer. The microstructures of the microstructured surface of the second siloxane-based pressure sensitive adhesive layer are unstable when not in contact with the microstructured release liner, and disappear over time when in contact with a substrate.
Dual-sided multi-layer adhesive
Dual-sided adhesive articles include a first crosslinked pressure sensitive adhesive layer with a first major surface and a second major surface, a second siloxane-based pressure sensitive adhesive layer with a first major surface and a second major surface, such that the first major surface of the second siloxane-based pressure sensitive adhesive layer is in contact with the second major surface of the first crosslinked pressure sensitive adhesive layer. The articles also include a release liner having a microstructured surface with an array of microstructures, where the microstructured surface is in contact with the second major surface of the second siloxane-based pressure sensitive adhesive layer. The microstructures of the microstructured surface of the second siloxane-based pressure sensitive adhesive layer are unstable when not in contact with the microstructured release liner, and disappear over time when in contact with a substrate.
Photosensitive resin composition and pattern forming process
A white photosensitive resin composition comprising (A) an acid crosslinkable group-containing silicone resin, (B) a photoacid generator, and (C) a white pigment has a sufficient reflectivity, good reliability with respect to adhesion and crack resistance, resolution, flexibility, and light resistance.
CURABLE SILICONE-BASED COMPOSITIONS AND APPLICATIONS THEREOF
The present technology provides a curable silicone composition comprising a polymer A comprising one or more alkenyl functional groups; a polymer B comprising one or more hydride functional groups; and a filler, wherein at least one of polymer A and/or polymer B is a silicone polymer.
CURABLE SILICONE-BASED COMPOSITIONS AND APPLICATIONS THEREOF
The present technology provides a curable silicone composition comprising a polymer A comprising one or more alkenyl functional groups; a polymer B comprising one or more hydride functional groups; and a filler, wherein at least one of polymer A and/or polymer B is a silicone polymer.
COMPOSITION FOR FORMING SILICA LAYER, SILICA LAYER FORMED THEREFROM, AND ELECTRONIC DEVICE INCLUDING SILICA LAYER
Provided is a composition for forming a silica layer including a silicon-containing polymer, and a solvent, wherein the silicon-containing polymer has a weight average molecular weight (Mw) of 8,000 g/mol to 15,000 g/mol, and wherein a content of nitrogen atoms of the silicon-containing polymer measured by a kjeldahl titration method is 25 wt % to 30 wt % based on a total weight of the silicon-containing polymer.