Certain embodiments are directed to resins comprising norbornene derivatives for use in structures such as radomes. In some examples, the radome comprises a dielectric constant of less than 2.7, a loss tangent of less than 0.003 and a moisture absorption of less than 1.5%.

The present invention relates to a polymer, composition, the forming of a sacrificial layer and a method for producing a semiconductor device comprising a step during which a pattern is made using a photoresist by the photolithography method.

An oligomer, composition, and composite material employing the same are provided. The oligomer can be a reaction product of a reactant (a) and a reactant (b). The reactant (a) is a reaction product of a reactant (c) and a reactant (d). The reactant (b) can be ##STR00001##
or a combination thereof, wherein a is 0 or 1, and R.sup.1 is independently hydrogen or ##STR00002##
and wherein b is 0-6; c is 0 or 1; and, d is 0-6. The reactant (c) is ##STR00003##
wherein R.sup.2 is C.sub.5-10 alkyl group. The reactant (d) is ##STR00004##
wherein e is 0-10.

This invention relates to a polybenzoxazine precursor and a method of preparing the same, and more particularly, to a polybenzoxazine precursor which includes benzoxazine obtained by reacting a phenol novolak resin with an aldehyde compound and allylamine and diaminodiphenylmethane as an amine compound, and to a method of preparing the same. The polybenzoxazine precursor may serve to prepare a hardened material having excellent thermal and electrical characteristics and dimensional stability. Accordingly, the polybenzoxazine precursor may be available for use in a copper clad laminate, a semiconductor encapsulant, a printed circuit board, an adhesive, a paint, and a mold.

The present teachings relate to curable linear polymers that can be used as active and/or passive organic materials in various electronic, optical, and optoelectronic devices. In some embodiments, the device can include an organic semiconductor layer and a dielectric layer prepared from such curable linear polymers. In some embodiments, the device can include a passivation layer prepared from the linear polymers described herein. The present linear polymers can be solution-processed, then cured thermally (particularly, at relatively low temperatures) and/or photochemically into various thin film materials with desirable properties.

The present invention relates to a norbornene-based crosslinked polymer containing at least one member selected from the group consisting of dicyclopentadiene-based monomer units, tetracyclododecene-based monomer units, and tricyclopentadiene-based monomer units in an amount of 50% by mass or more, wherein the norbornene-based crosslinked polymer has a glass transition temperature of 240 C. or higher. Further, the present invention relates to a method for producing a norbornene-based crosslinked polymer as defined above, including step (1): heating a blend containing at least one member of the above monomer components, and a metathesis polymerization catalyst to a temperature lower than a deactivation temperature of the metathesis polymerization catalyst to carry out a primary curing; and step (2): heating a cured product obtained in the step (1) to a temperature equal to or higher than the deactivation temperature of the above metathesis polymerization catalyst to carry out a secondary curing.

Arylcyclobutene polymers having improved physical properties, such as tensile strength, are provided. Compositions and methods for coating such arylcyclobutene polymers are also provided.

A method for producing a dicyclopentadiene-modified phenolic resin. The method including reusing a fluorine-based ion-exchange resin as a catalyst in a reaction between a phenol and a dicyclopentadiene, the fluorine-based ion-exchange resin having been used as a catalyst when a phenol and a dicyclopentadiene are allowed to react with each other to produce a first dicyclopentadiene-modified phenolic resin. In the method, the fluorine-based ion-exchange resin is washed with an organic solvent. The dicyclopentadiene-modified phenolic resin obtained by the method has a stable quality, has a high purity, and is inexpensive.

Polyarylene polymers formed from an aromatic dialkyne monomer having a solubility enhancing moiety and having relatively high weight average molecular weights and a relatively low polydispersity show improved solubility in certain organic solvents and are useful in forming relatively thick dielectric material layers in a single coating step.

Polyarylene oligomer compositions capable of curing at lower temperatures than conventional polyarylene oligomers are useful in forming dielectric material layers in electronics applications.