A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.

The present disclosure provides a modified resin composition, a preparation method and use thereof. The raw materials of the modified resin composition includes: 65 to 100 parts by mass of a matrix resin, 10 to 40 parts by mass of a phenoxy resin, 0.5 to 25 parts by mass of nano silicon dioxide, 2 to 15 parts by mass of a curing agent, 0 to 2 parts by mass of a curing accelerator, and 0 to 1 part by mass of a coupling agent. The modified resin composition has excellent toughness, excellent processability during mechanical punching process, a relatively low powder loss rate, and excellent bonding performance and heat resistance.

An epoxy resin composition used as a structural bonding agent is provided. Specifically, used is an epoxy resin composition containing an epoxy resin (A) having an epoxy equivalent of 500 to 10,000 g/eq represented by the formula (1) below:

##STR00001##

wherein, Ar is an aromatic ring, X is a structural unit having an alkylene chain, Y is a structural unit having a polyether chain, R.sub.11 and R.sub.12 are a glycidyl ether group or a 2-methylglycidyl ether group, R.sub.13 and R.sub.14 are a hydroxyl group, a glycidyl ether group, or a 2-methylglycidyl ether group, R.sub.15 and R.sub.16 are a hydrogen atom or a methyl group, m1 and m2 are 0 to 25, and m1+m21, p1 and p2 are 0 to 5, and q is 0.5 to 5, an epoxy resin (B) having an epoxy equivalent of 100 to 300 g/eq, and thermally expandable particles (C).

Provided are an adhesive composition and a film roll whereby blocking can be prevented and excellent temporary pressure bonding properties can be obtained. The adhesive composition of the present invention contains an epoxy resin, a latent curing agent, and an acrylic rubber having a carboxyl group or a glycidyl group, and the acrylic rubber phase-separates from the epoxy resin at a normal temperature and is compatible with the epoxy resin at a predetermined temperature higher than the normal temperature and lower than the curing temperature. Adhesive force is thereby reduced at the normal temperature, blocking can be prevented from occurring and excellent adhesive force can be obtained during temporary pressure bonding.

An object of the present invention is to provide a resin composition having excellent heat resistance and excellent thermal adhesiveness, so as to provide an electric insulating sheet having excellent heat resistance. In order to achieve the aforementioned object, the present invention provides a resin composition which contains a polyether sulfone resin and a resin having a specific melt viscosity, and contains at least a phenoxy resin other than the polyether sulfone resin.

The present invention relates to a curable composition that includes an oxyalkylene polymer A having an average of 4 to 8 terminal groups per molecule and having a reactive silicon group represented by: SiX.sub.aR.sub.3-a (1) (in which R is a monovalent organic group having 1 to 20 carbon atoms and represents an organic group other than a hydrolyzable group, and X represents a halogen atom, a hydroxyl group, or a hydrolyzable group; a is an integer from 1 to 3; when a is 2 or more, X groups may be the same as or different from each other, and when a is 1, R groups may be the same as or different from each other), wherein the terminal group has the reactive silicon group, an unsaturated group, an isocyanate group or an active hydrogen-containing group, and the oxyalkylene polymer A has a hydroxyl group equivalent molecular weight of 500 to 1,750 per terminal group.

An adhesive composition, containing an epoxy resin (A), an epoxy resin curing agent (B), a polymer component (C) and an inorganic filler (D), in which the inorganic filler (D) satisfies the condition (1) of (an average particle diameter (d50) is 0.1 to 3.5 ?m) and condition (2) of (a ratio of a particle diameter at 90% cumulative distribution frequency (d90) to the average particle diameter (d50) is 5.0 or less), and a proportion of the inorganic filler (D) in a total content of the epoxy resin (A), the epoxy resin curing agent (B), the polymer component (C) and the inorganic filler (D) is 20 to 70% by volume; a film-like adhesive and a production method thereof; and a semiconductor package and a production method thereof.

An adhesive composition and a film roll whereby blocking can be prevented and excellent temporary pressure bonding properties can be obtained. The adhesive composition of the present invention contains an epoxy resin, a latent curing agent, and an acrylic rubber having a carboxyl group or a glycidyl group, and the acrylic rubber phase-separates from the epoxy resin at a normal temperature and is compatible with the epoxy resin at a predetermined temperature higher than the normal temperature and lower than the curing temperature. Adhesive force is thereby reduced at the normal temperature, blocking can be prevented from occurring and excellent adhesive force can be obtained during temporary pressure bonding.

A sulfonyl-substituted polyphenylene-ether polymer having improved dielectric properties and methods for making the same. The sulfonyl-substituted PPE include sulfone-containing polyphenylene oxides (PPO) polymers having repeating units of the formulas:

##STR00001##

wherein each of R.sup.1 and R.sup.2 is H or an alkyl group containing from 1 to 4 carbon atoms, R.sup.3 is an alkylene group containing from 1 or 2 carbon atoms, R.sup.4 is selected from a group consisting of an alkyl group containing from 1 to 4 carbon atoms, an aryl group, and CF.sub.3, and X is a halogen atom. The subscript n is 0 or 1; the subscript m is 1 or 2, provided that when m is 2, R.sup.2 is H. A degree of polymerization ranges from about 5 to about 1,000, and a ratio of units having formula (1) to units having formula (2) of the sulfone-containing PPO polymer ranges from about 10:90 to about 90:10.

The present application relates to a curable composition. The curable composition of the present application exhibits excellent adhesion ability and liquid crystal orientation ability simultaneously before or after curing, so that it can be effectively applied to various optical uses.