The present invention provides a photocurable composition containing an ultraviolet absorber, which has high photocurability and yields a cured material having a high cutting capacity against ultraviolet rays from the outside, a low yellow index, and colorlessness and transparency. The present invention relates to a sheet-shaped photocurable composition which includes the following components (A) to (D), and when a cured material obtained after photocuring the photocurable composition has a thickness of 150 m, a yellow index of the cured material is 4.0 or less and a light transmittance of the cured material at a wavelength of 385 nm is 5.0% or less: a component (A): a (meth)acrylate compound, a component (B): a film forming resin, a component (C): a photoinitiator, and a component (D): an ultraviolet absorber.

An anisotropic conductive film has a first insulating resin layer and a second insulating resin layer. The first insulating resin layer is formed of a photopolymerized resin, the second insulating resin layer is formed of a thermo-cationically or thermo-anionically polymerizable resin, a photo-cationically or photo-anionically polymerizable resin, a thermo-radically polymerizable resin, or a photo-radically polymerizable resin, and conductive particles for anisotropic conductive connection are disposed in a single layer on a surface of the first insulating resin layer on a side of the second insulating resin layer. The elastic modulus of the anisotropic conductive film as a whole is 0.13 MPa or more.

A resin composition includes the following components or a prepolymer thereof: (A) 100 parts by weight of an unsaturated CC double bond-containing polyphenylene ether resin; and (B) 10 parts by weight to 50 parts by weight of a compound of Formula (1), having a pH value of 10 or less. In Formula (1), n is an integer of 3 to 6, each Y and Z are independently selected from o-vinylphenoxy group and phenoxy group, and each Y and Z are not phenoxy group at the same time. The prepolymer is prepared by subjecting a mixture to a prepolymerization reaction, and the mixture at least comprises the component (A) and the component (B). An article is made from the resin composition. The article includes a prepreg, a resin film, a laminate or a printed circuit board and achieves improvements in one or more properties including resin filling uniformity, dissipation factor variation rate under heat, glass transition temperature, Z-axis ratio of thermal expansion, peeling strength and thermal resistance after moisture absorption.

##STR00001##

This invention relates to epoxy resin formulations for preforms to be used in molding processes, especially resin transfer molding processes and to methods for preparing the performs. The epoxy formulation is based on liquid or solid epoxy resins blended, with medium to high molecular weight, phenoxy resins. These formulations are highly compatible with epoxy curable injection resins, and more over are reacted in the polymeric matrix, without reducing the glass transition temperature (Tg) of the cured composite material.

This invention provides a polymer, which is preferably a polyether polymer, for use in coating compositions. Containers comprising the polymer and methods of making such containers are also provided. The invention further provides powder coating compositions including the polymer, which have utility in a variety of coating end uses, including, for example, valve and pipe coatings.

The present disclosure provides a resin composition for a metal substrate, and a resin varnish and a metal base copper-clad laminate comprising the same. The resin composition comprises 5-40% of a main resin and 60-95% of a thermally conductive filler when the total weight of the resin composition is calculated as 100%, wherein the main resin comprises 60-90% of a flexible epoxy resin having a structure as shown in Formula I and 10-40% of a phenoxy resin when the total weight of the main resin is calculated as 100%. The resin composition provided by the present disclosure has a low modulus, can alleviate the stress generated by thermal shocks and can withstand more than 1000 thermal cycles.

Metal food or beverage containers are coated with a polyether polymer containing at least two ether linkages in the polymer backbone. The polymer is substantially free of segments derived from bisphenol A and epoxides thereof, and is a reaction product of, or can be derived from, (i) an aryl- or heteroaryl-group-containing diepoxide that is not derived from a polyhydric phenol or a glycidyl ester and (ii) a polymer backbone extender that has two functional groups reactive with an epoxy group and which following reaction with the diepoxide provides at least one pendant aryl or heteroaryl group on the polymer backbone, or provides at least one divalent aryl or heteroaryl group in the polymer backbone and linked to the backbone via ether linkages.

Metal food or beverage containers are coated with a polyether polymer containing at least two ether linkages in the polymer backbone. The polymer is substantially free of segments derived from bisphenol A and epoxides thereof, and is a reaction product of, or can be derived from, (i) an aryl- or heteroaryl-group-containing diepoxide that is not derived from a polyhydric phenol or a glycidyl ester and (ii) a polymer backbone extender that has two functional groups reactive with an epoxy group and which following reaction with the diepoxide provides at least one pendant aryl or heteroaryl group on the polymer backbone, or provides at least one divalent aryl or heteroaryl group in the polymer backbone and linked to the backbone via ether linkages.

A polymer is provided, which is formed by reacting a diol having hydrogenated bisphenol group with a bis-epoxy compound. The diol having hydrogenated bisphenol group may have a chemical structure of ##STR00001##
wherein each of R.sup.1 is independently H or methyl, and m and n are independently integers of 1 to 4. The bis-epoxy compound can be ##STR00002##
or a combination thereof, wherein each of R.sup.2 is independently H or methyl, and each of R.sup.3 is independently H or methyl.

An adhesive composition is described comprising a tetrahydrofurfuryl (meth)acrylate copolymer; an epoxy resin; a polyether polyol; and a hydroxy-functional film-forming polymer. The adhesive may be used in structural and semi-structural bonding applications.