A method for modifying the properties of balsa wood comprises infiltrating a protein ionic liquid comprising polymerized dopamine into delignified balsa wood. A method of making an optically active protective coating comprises mixing protein ionic liquid comprising polymerized dopamine with ethyl acetate-based or water-based nail polish. A method of making a thermoplastic having biological activity comprises melting a thermoplastic; and blending a protein ionic liquid with the thermoplastic; and cooling the thermoplastic protein ionic liquid blend to a solid state. The thermoplastic is a hot glue stick. The protein ionic liquid comprises antibodies, enzymes, or fluorescent proteins. A method of making a chymotrypsin protein ionic liquid/thermoplastic material comprises mixing cationized chymotrypsin and anions of poly(ethylene glycol) 4-nonylphenyl 3-sulfopropyl ether to form a chymotrypsin and anion complex; lyophilizing and melting the cationized chymotrypsin and anion complex to form a water-free ionic liquid; blending the chymotrypsin ionic liquid with molten hot glue/thermoplastic.

The present disclosure is directed to multiphase dispersions and nanaocomposites comprised of continuous matrix or binder and endohedrally impregnated cellular carbon filler. These nanocomposites may exhibit superior mechanical, electrical, thermal, or other properties, and may be used in a variety of products, including hierarchical fiber-reinforced composites with nanocomposite matrices.

The sublimable film formation composition of the present invention includes a sublimable substance and a solvent in which a saturation solubility of the sublimable substance is more than 10% by mass.

The sublimable film formation composition of the present invention includes a sublimable substance and a solvent in which a saturation solubility of the sublimable substance is more than 10% by mass.

A nanocomposite, comprising a carbonaceous perimorph, the perimorph comprising at least one cell. The cell comprises a cell wall possessing an average thickness of less than 100 nm and a morphology evolved from a template. The composite comprises an interior space having a morphology evolved from the template with a diameter between 10 nm and 1,000 nm, and one of a linear structure, a non-linear structure, and an infiltrated endomorph. The endomorph substantially fills the interior space of the perimorph.

This invention provides a method for creating a large-scale of amphiphilic particles. The method includes: adding nanoparticles into a polycarbonate-based solution, adding a surfactant into the solution while performing ultra-sonication to generate polymer precipitation, creating at least one microsphere with the nanoparticles embedded onto it, subjecting the exposed hemisphere of the embedded nanoparticles to a further amphiphilic particles related modification, and dissolving the at least one microsphere in a polycarbonate-based solution in order to free said embedded nanoparticles from the at least one microsphere.

Provided are a halogen-free phosphorus-free silicon resin composition, and prepreg and laminated board using the same, and printed circuit board, the silicon resin composition comprising the following components in parts by solid weight: 50-90 parts of an organic silicon resin, 20-80 parts of a vinyl-terminated silicon oil, 0.1-5 parts of a viscosity enhancing agent, 0-60 parts of a filler, 0.0001-0.5 parts of a catalyst, and 0.00001-0.1 parts of an inhibitor, a mole ratio between Si—H in a cross-linking agent and Si-Vi in the organic silicon resin being 1.0-1.7. The resin body of the resin composition is a thermosetting silicon resin, and the laminated board prepared thereby has good heat and flame resistance and an extremely low dielectric constant (Dk) and dielectric loss (Df).

Provided are a halogen-free phosphorus-free silicon resin composition, and prepreg and laminated board using the same, and printed circuit board, the silicon resin composition comprising the following components in parts by solid weight: 50-90 parts of an organic silicon resin, 20-80 parts of a vinyl-terminated silicon oil, 0.1-5 parts of a viscosity enhancing agent, 0-60 parts of a filler, 0.0001-0.5 parts of a catalyst, and 0.00001-0.1 parts of an inhibitor, a mole ratio between Si—H in a cross-linking agent and Si-Vi in the organic silicon resin being 1.0-1.7. The resin body of the resin composition is a thermosetting silicon resin, and the laminated board prepared thereby has good heat and flame resistance and an extremely low dielectric constant (Dk) and dielectric loss (Df).

A polymer dispersion is disclosed. The polymer dispersion includes a liquid crystal polymer powder, a polyamide acid, and a solvent. A solid content of the polymer dispersion includes the liquid crystal polymer powder and the polyamide acid. The liquid crystal polymer powder has a mass ratio of 20% to 30% in the solid content. The polyamide acid has a mass ratio of 70% to 80% in the solid content. The polyamide acid is obtained by mixing two kinds of diamines and two kinds of dianhydrides together, causing the diamines and the dianhydrides to be polymerized with each other. Both two kinds of diamines and two kinds of dianhydrides comprise a liquid crystal structure and a flexible structure respectively. A method of preparing the polymer dispersion, and a method for preparing a polymer composite film using the polymer dispersion are also disclosed.

Disclosed herein are various cable gel seal arrangements and thermoplastic gels useful therein. The thermoplastic gels are prepared from a composition including a styrene triblock copolymer, a styrene diblock copolymer, an oil extender, and an additive selected from poly(2,6-dimethyl-1,4-phenylene oxide), a C9 resin, poly(alpha-methylstyrene), a coumarone-indene resin, and combinations thereof, wherein the additive has a T.sub.g from about 95° C. to about 200° C. The thermoplastic gels advantageously exhibit low compression set.