An epoxy resin exhibits a small change in volume after thermal history, is excellent in low thermal expansion and low moisture absorption, and has high heat resistance, in terms of a cured product obtained therefrom; a curable resin composition; a cured product which has all the above properties; a semiconductor encapsulating material; a semiconductor device; a prepreg; a circuit board; a buildup film; a buildup substrate; a fiber-reinforced composite material; and a molded article. The present invention is characterized by an epoxy resin, characterized by including as essential components, a cresol-naphthol co-condensed novolac type epoxy resin (A), a naphthol glycidyl ether compound (B), and one or more xanthene compounds (C) selected from the group of compounds represented by the following structural formulae (1) to (3), wherein the content of the xanthene compound(s) (C) is from 0.1% to 5.5% in terms of area ratio in a GPC measurement.

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Disclosed are a method for producing a laminate including a step of laminating a resin impregnated fiber reinforced composition layer on a metal member, wherein the method includes a step of forming a resin coating on the metal member and a step of laminating a resin impregnated fiber reinforced composition layer containing a resin impregnated fiber reinforced composition containing (I) 20 to 80% by mass of a polymer having a melting point and/or a glass transition temperature of 50 to 300° C., and (C) 20 to 80% by mass of a reinforcing fiber
(provided that the sum of the component (I) and the component (C) is taken as 100% by mass) via the above resin coating; and a laminate obtained by the method.

A cured article includes a cured thermoset resin matrix defining an article surface. Hollow glass microspheroids are dispersed in the cured thermoset resin matrix. A low profile additive package is dispersed in the cured thermoset resin matrix. A plurality of carbon fiber bundles are present and wet by the cured thermoset resin matrix. The matrix formed from a prepolymer and styrenic monomer. A free radical initiator is provided to cure the thermoset resin matrix and having limited decomposition products with a boiling point of between 160-210° C.; wherein the article emits less than 250 parts per million (ppm) of volatiles as measured after heating to 185° C. at a rate of 14° C./min and held for 1 minute.

This invention relates to an epoxy resin formulation containing a curative that can be cured at 150° C. to 95% cure in no more than 150 seconds, and can be cured at 120° C. to 95% cure in no more than 4 minutes. This results in a cured resin having a Tg no greater than 140° C. wherein the formulation further contains a mould release agent.

This invention relates to an epoxy resin formulation containing a curative that can be cured at 150° C. to 95% cure in no more than 150 seconds, and can be cured at 120° C. to 95% cure in no more than 4 minutes. This results in a cured resin having a Tg no greater than 140° C. wherein the formulation further contains a mould release agent.

A prepreg containing at least the following components [A]-[F], wherein the ratio Ne/Nd of the number of structures Ne of component [F] present in a range of outside 110% of the particle diameter of component [E] and the number of structures Nd of component [F] present in a range outside 110% of the particle diameter of component [D] is 0.25 or higher. [A]: Carbon fibers, [B] thermosetting resin, [C]: curing agent, [D]: particles composed mainly of thermoplastic resin having a primary particle number-average particle size of 5-50 μm, [E]: conductive particles different from component [D] and having a primary particle number-average particle size in the range of a specific expression, [F]: filler comprising a carbon material.

A fiber reinforced thermoplastic resin molded article includes (A) carbon fibers, (B) graphite and (C) a thermoplastic resin, wherein the carbon fibers (A), the graphite (B) and the thermoplastic resin (C) are contained in amounts of 1 to 30 parts by weight, 1 to 40 parts by weight and 30 to 98 parts by weight, respectively, relative to 100 parts by weight, of the carbon fibers (A), the graphite (B) and the thermoplastic resin (C), the weight average fiber length of the carbon fibers (A) is 0.3 to 3 mm and the specific gravity of the molded article is 1.1 to 1.9 g/cm.sup.3. The fiber reinforced thermoplastic resin molded article has excellent bending strength and heat conductivity.

A heat-dissipating plastic is provided. The heat-dissipating plastic according to an exemplary embodiment of the present invention is implemented by including a polymer matrix formed by including a main resin; and a carbon-based filler which is provided by being dispersed in the polymer matrix, and includes a fibrous carbon-based filler and a granular carbon-based filler.

According to the above, the heat-dissipating plastic has remarkably excellent heat dissipation characteristics due to the remarkably excellent thermal conductivity, and it has an effect that the mechanical strength is remarkably excellent even though it is designed to have remarkably excellent heat dissipation characteristics. Accordingly, the implemented heat-dissipating plastic can be widely applied in various technical fields where excellent heat-dissipating performance and mechanical strength are required at the same time.

A fiber reinforced thermoplastic resin molding material includes a thermoplastic resin; a resin impregnated reinforcing fiber filament obtained by impregnating reinforcing fibers with a resin having a melt viscosity at 200° C. lower than a melt viscosity of the thermoplastic resin; and a reinforcing fiber modifier having a melt viscosity at 200° C. lower than the melt viscosity of the thermoplastic resin and a difference in solubility parameter value from the thermoplastic resin equal to or larger than 1.0, the molding material including 50 to 98.9 parts by weight of the thermoplastic resin; 1 to 40 parts by weight of the reinforcing fiber; 0.1 to 10 parts by weight of the reinforcing fiber modifier; and 0.2 to 12 parts by weight of the resin relative to total 100 parts by weight of the thermoplastic resin, the reinforcing fiber, and the reinforcing fiber modifier.

A resin composition, comprising the following components: (a) a thermal-curable resin system, which has a dielectric loss (Df) of not higher than 0.004 at 10 GHz; and (b) an alkenyl phenoxy phosphazene component, wherein the amount of the component (b) is 1 wt % to 30 wt % based on the total weight of the resin system (a) and the component (b).