There are provided a thermosetting resin composition for a semiconductor package and a prepreg and a metal clad laminate using the same. More particularly, there are provided a thermosetting resin composition for a semiconductor package capable of improving desmear characteristics by using a cyanate based ester resin and a benzoxazine resin in a thermosetting resin composition based on an epoxy resin and improving chemical resistance by using a slurry type filler to have high heat resistance and reliability, and a prepreg and a metal clad laminate using the same.

A poly(amide-imide) copolymer that is a reaction product of a diamine represented by Chemical Formula 1, a tetracarboxylic acid dianhydride including a compound represented by Chemical Formula 2, and a compound represented by Chemical Formula 3: ##STR00001## wherein, in Chemical Formulae 1 to 4, R.sup.1 to R.sup.4, A, and X are the same as defined in the specification.

In a first aspect, a single layer polymer film includes 60 to 99 wt % of a crosslinked polyimide, having a gel fraction in the range of from 20 to 100% and a refractive index of 1.74 or less, and 1 to 40 wt % of a colorant. A surface of the single layer polymer film has been textured and has a maximum roughness (S.sub.pv) of 6 μm or more, an L* color of 30 or less and a 60° gloss of 15 or less. In a second aspect, a coverlay for a printed circuit board includes the single layer polymer film of the first aspect. In third and fourth aspects, processes are disclosed for forming a single layer polymer film including a crosslinked polyimide film including a dianhydride and a diamine.

Disclosed herein are a highly thick polyimide film that contains a reduced number of bubbles therein and exhibits high elasticity and high heat resistance, and a manufacturing method therefor. The polyimide film is obtained by imidizing a poly(amic acid) solution containing an acid dianhydride component including 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA), 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA), and pyromellitic dianhydride (PMDA), and a diamine component including 4,4′-oxydianiline (ODA), para-phenylenediamine (p-phenylenediamine, PPD), and 3,5-diaminobenzoic acid (DABA), and contains a phosphorus (P)-based compound.

Provided herein is a method for manufacturing a polyimide film, the method including the steps of: preparing a polyamic acid solution; preparing a polyamic acid composition by adding a dehydrating agent and an imidizing catalyst to the polyamic acid solution; and applying the polyamic acid to a support to form a film, followed by thermosetting the film in a heater, wherein the thermosetting step comprises a first heating step, a second heating step, and a third heating step, each of the first, the second, and the third step being carried out in a processing temperature range of 100° C. to 550° C.

An ionic hydrogel moisture-electric generator including a thin film comprising a first surface and a second surface opposite to the first surface; a first electrode electrically connected to the first surface of the thin film; a second electrode electrically connected to the second surface of the thin film; and a moisture impermeable barrier film disposed on the second surface of the thin film, wherein the thin film comprises a hydrogel comprising at least one hydrophilic polymer, an ionic species, and a solvent; the ionic species is an acid or a salt; and the solvent includes a hygroscopic liquid.

A transparent polyimide film, prepared from a copolymerized polyamide acid according to a chemical cyclization method, is provided. The copolymerized polyamide acid requires at least a semi-aromatic polyamide acid, and the semi-aromatic polyamide acid is formed by reacting cyclobutane-1,2,3,4-tetracarboxylic dianhydride (CBDA) and 2,2′-bis(trifluoromethyl)diaminodiphenyl (TFMB). The molar number of dianhydrides of the semi-aromatic polyamide acid is more than 20% of the total molar number of anhydrides of the copolymerized polyamide acid, so that the transparent polyimide film has a light transmittance greater than 80%, a chroma b* less than 5, and a CTE less than 35 ppm/° C.

Provided are a slurry composition having a low thixotropy and a superior handling property; a cured product of this slurry composition; and a substrate, film and prepreg using such cured product, the substrate, film and prepreg exhibiting excellent mechanical properties and a low relative permittivity and dielectric tangent. The slurry composition has a thixotropic ratio of not higher than 3.0, and comprises: (A) a cyclic imide compound having, per molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, and at least two cyclic imide groups; (B) spherical silica fine particles and/or alumina fine particles having an average particle size of 0.05 to 20 μm when measured by a laser diffraction method; (C) a silane coupling agent capable of reacting with the components (A) and (B); and (D) an organic solvent.

Disclosed herein are a polyimide film for graphite sheets, a method of fabricating the same, and a graphite sheet fabricated using the same. The polyimide film is fabricated by imidizing a polyamic acid formed by reaction between a dianhydride monomer and a diamine monomer, wherein the reaction is carried out in the presence of a metal compound and the polyamic acid forms a chelate with metal ions.

Disclosed herein is a polyimide film that is obtained by imidizing a polyamic acid solution containing two or more dianhydride components selected from the group consisting of 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA), 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA), and pyromellitic dianhydride (PMDA), and a diamine component including m-tolidine and p-phenylenediamine (PPD) and has a glass transition temperature (Tg) of 320° C. or higher, a moisture absorption rate of 0.4% or less, and a dielectric dissipation factor (Df) of 0.004 or less.