A crosslinked polyimide, a polyimide film and a method for preparing thereof, an organic light emitting diode (OLED) device. 4,40-diamino-400-N-carbazolyltriphenylamine and 1,2,4,5-cyclohexanetetracarboxylic dianhydride and a p-xylylenediamine crosslinker are introduced in the present invention. The introduction of a diamine monomer with a large volume of pendant groups increases an asymmetry of the polyimide, destroys a close structure of the polymer, and reduces crystallization properties of the polypolymer, thereby effectively increasing its transmissibility. At the same time, a cross-linked agent, p-xylylenediamine, is introduced, and the cross-linked agent widens a molecular chain spacing, so that the polyimide molecule has a larger free volume. At the same time, the formation of cross-linked is beneficial to reduce a polarizability of the molecule, thereby reducing a dielectric constant of the material. An OLED device with a novel low dielectric constant and high transmittance is prepared in this way.

The present application provides a film containing: a compound (A) containing at least one selected from the group consisting of a maleimide compound and a citraconimide compound; an organic peroxide (B) containing at least one selected from the group consisting of organic peroxides represented by specific formulae; and an imidazole compound (C) represented by a specific formula.

Provided are a flexible window film and a display apparatus comprising same, the flexible window film having a substrate layer, a buffer layer and a hard coating layer that are sequentially layered, wherein the buffer layer comprises, in a thickness direction, a first area in which the amount of an amide group gradually increases from the interface between the hard coating layer and the buffer layer, and a second area in which the amount of an amide group gradually decreases from the interface between the substrate layer and the buffer layer.

Provided a diamine compound, a polyimide precursor and a polyimide film using the same, and a use thereof. The diamine compound may be very useful as a monomer for manufacturing a polyimide film having excellent transparency, high heat resistance, and low retardation.

The invention generally relates to shape memory films that are tri-functionally crosslinked and that comprise multiple, non-terminal, phenylethynyl moieties. In addition, the present invention relates methods of fabricating such films. Due to the improved properties of such SMPs, the SMP designer can program in to the SMP thermomechanical property enhancements that make the SMP suitable, among other things, for advanced sensors, high temperature actuators, responder matrix materials and heat responsive packaging.

A polymer film is provided, the polymer film comprises a liquid crystal polymer, comprising a soluble liquid crystal polymer and an insoluble liquid crystal polymer; and a polyimide polymer, accounting for 5 wt % or more of the polymer film. A method for manufacturing the polymer film is also provided, the method for manufacturing the polymer film comprises steps: providing a liquid crystal polymer powder, a particle size of the liquid crystal polymer powder is 0.1 um to 20 um; providing a liquid crystal polymer glue, a solid content of which is greater than 3 wt %; providing a polyamic acid glue; mixing the liquid crystal polymer powder, the liquid crystal polymer glue and the polyamic acid glue into a mixed solution, the mixed solution is made into a gel film, and the gel film is baked at a temperature of 300° C. to form a polymer film.

Provided is an antistatic polyimide-based film. More particularly, as an antistatic polyimide-based film for a window cover for protecting a surface of a display device, a window cover film having a protective film formed on the polyimide-based film provides an improvement to a problem of not being used as a film for a display window cover because a portion of the protective film remains on a base layer or a hard coating layer without being peeled off due to static electricity in the protective film or the base layer, or a hard coating layer, or the hard coating layer is peeled off with some or all of the protective film when the protective film is peeled off.

The present invention provides a composition for forming a hard coat and a laminate using the same. The composition for forming a hard coat includes at least metal oxide fine particles; a hydrolysate of an organosilicon compound; an adhesion promoting component having an alkoxysilyl group; a curing catalyst; and a solvent, wherein by introducing, as the organosilicon compound, an organosilicon compound having a hydrocarbon group having (6 to 18) carbon atoms substituted with a glycidoxy group, and an organosilicon compound having a hydrocarbon group having (1 to 5) carbon atoms substituted with a glycidoxy group, even when applied to a flexible resin substrate, the composition for forming a hard coat has excellent adhesion and scratch resistance, and bending resistance (crack resistance) and surface hardness as well.

Provided is a polyimide having a repeating unit represented by the following Formula (1):

##STR00001##

wherein R.sup.1 represents a tetravalent group; R.sup.2 represents a divalent group; provided that at least one of R.sup.1's is represented by the following Formula (2); and among R.sup.2's, at least one group is represented by the following Formula (3), and at least one other group is represented by the following Formula (4):

##STR00002##

Disclosed herein are a polyimide film for graphite sheets and a graphite sheet manufactured using the same. The polyimide film is fabricated by imidizing a precursor composition including: a polyamic acid prepared by reacting a dianhydride monomer with a diamine monomer; and an organic solvent, wherein the diamine monomer includes about 30 mol % to about 70 mol % of 4,4′-methylenedianiline and about 30 mol % to about 70 mol % of 4,4′-oxydianiline based on the total number of moles of the diamine monomer, 4,4′-methylenedianiline and 4,4′-oxydianiline being present in total in an amount of about 85 mol % or more based on the total number of moles of the diamine monomer.