A curable silicone rubber composition of the type referred to in industry as “self-adhesive” or as having “selective adhesion” (hereafter referred to as “curable self-adhesive silicone rubber compositions”). The curable self-adhesive silicone rubber compositions comprise: (A) one or more organopolysiloxanes containing at least 2 alkenyl groups and/or alkynyl groups per molecule and having a viscosity in a range of 1000 mPa.Math.s to 200,000 mPa.Math.s at 25° C.; (B) an organopolysiloxane containing at least 2 or 3 silicon-bonded hydrogen atoms per molecule; (C) at least one hydrosilylation catalyst; (D) at least one reinforcing and optionally one or more non-reinforcing fillers; (E) an adhesion promoter; and (F) an oligomer which has been found to surprisingly provide heat-humidity stabilization.

Provided are rapidly cross-linkable silicone foam compositions, kits, and methods for filling implanted medical devices in situ or in vivo, the implanted medical devices, including for example, body implants and tissue expanders, the compositions including a platinum divinyl disiloxane complex; a low viscosity vinyl terminated polydimethylsiloxane; a low viscosity hydride terminated polydimethylsiloxane; a silicone cross-linker; and a gas and/or gas-filled microcapsules, where the rapidly cross-linkable silicone foam composition has a viscosity of ≤150 cPs for ≥1 min. post-preparation and ≤300 cPs≤5 min. post-preparation, at ambient temperature.

A very thin filled silicone foam layer is formed from a composition that includes a curable polysiloxane composition including an alkenyl-substituted polyorganosiloxane, a hydride-substituted polyorganosiloxane, and a cure catalyst; a plurality of expanded polymer microspheres having a largest dimension of less than the thickness of the foam; and a filler composition, wherein each component of the filler composition has a largest dimension of less than the thickness of the foam, the filler composition comprising a particulate ceramic filler, a particulate calcium carbonate filler, or a particulate aluminosilicate clay filler having a plate morphology, or a particulate aluminosilicate clay filler having a hollow tubular morphology, a particulate polymeric silsesquioxane filler, or a particulate methyl-phenyl MQ filler, or a plurality of glass microspheres, or a particulate paraffin wax, or a combination thereof; wherein the curable filled composition has a viscosity of less than 400,000 centiStokes, or 100,000 to 350,000 centiStokes.

The present invention is a thermally conductive sheet comprising: a matrix comprising an organic polymer, and a carbon fiber X, the carbon fiber X being oriented in a thickness direction of the sheet, wherein a proportion of a carbon fiber (A) having a fiber length of 100 .Math.m or less is 40% or more and a proportion of a carbon fiber (B) having a fiber length of 200 .Math.m or more is 3 to 13% of the carbon fiber X. According to the present invention, a thermally conductive sheet in which the thermal resistance value is effectively reduced by polishing the surface, resulting in a sheet having a low thermal resistance value can be provided.

The invention relates to a new silicone foam which is air foamed and syntactic and to a process for manufacturing said silicone foam. The present invention also relates to an article such as a secondary battery pack comprising said silicone foam which is air foamed and syntactic and to a new recycling method comprising the steps of removing the said silicone foam from the article and then recycling or re-using components of said article.

The present invention relates to a method of making a composite material, the method comprising: (1) forming a Pickering emulsion comprising a continuous liquid phase, a discontinuous liquid phase, and a 2D material: wherein the discontinuous liquid phase comprises a polysiloxane and a curing agent; (2) leaving the Pickering emulsion formed in step (1) in a sealed system for sufficient time to at least partially cure the polysiloxane: and (3) allowing any remaining liquid to evaporate.

One of the purposes of the present invention is to provide an SiH group-containing polysiloxane emulsion composition having a less risk of expansion of a container due to the dehydrogenation reaction with time during storage, causing less deterioration in its performance, and having an excellent shelf life. Another purpose of the present invention is to provide an addition-curable silicone emulsion composition comprising the aforesaid emulsion composition and having excellent curability. Another purpose is to provide a cured film obtained by curing the aforesaid addition-curable silicone emulsion composition and having excellent light releasability from an adhesive. The present invention provides an emulsion composition comprising components (A), (B), (C) and (E): 100 parts by mass of (A) organohydrogenpolysiloxane having at least two hydrogen atoms each bonded to a silicon atom (i.e., SiH group) in one molecule, 0.1 to 20 parts by mass of (B) a nonionic surfactant, 0.01 to 50 parts by mass of (C) a buffer solution having a pH in a range of 4.0 to 6.0 at 25° C., and 30 to 10000 parts by mass of (E) water.

Provided is an adsorption temporary fixing sheet having a sufficient shear adhesive strength in a direction parallel to its surface, having a weak adhesive strength in a direction vertical to the surface, and having excellent antistatic performance. The adsorption temporary fixing sheet includes a foam layer including an open-cell structure, and has a surface resistivity of from 1.0×10.sup.4 to 1.0×10.sup.10Ω/□, wherein, when a silicon chip vertical adhesive strength of a surface of the foam layer after 18 hours at each of such different temperatures as −30° C., 23° C., or 80° C. is represented by V1, V2, or V3 (N/1 cm.sup.2), and when a silicon chip shearing adhesive strength of the surface of the foam layer after 18 hours at each of such different temperatures as −30° C., 23° C., or 80° C. is represented by H1, H2, or H3 (N/1 cm□), relationships of V1<H1, V2<H2, and V3<H3 are satisfied.

A curable silicone resin composition contains the following components (A) to (D): (A) an organopolysiloxane having two or more and less than six alkenyl groups per molecule each having 2 to 10 carbon atoms; (B) an organopolysiloxane shown by the following formula (1); (C) an organohydrogenpolysiloxane having two or more hydrogen atoms bonded to silicon atoms per molecule, and contained such that the component (C) has a hydrosilyl group in an amount of 0.1 to 4.0 mol per mol of all alkenyl groups bonded to silicon atoms in the curable silicone resin composition; and (D) a platinum group metal-based catalyst. The component (B) is in an amount of 0.1 to 50 mass % relative to a total mass of the components (A) and (B). This invention provides a curable silicone resin composition for forming a silicone resin cured product excellent in mechanical properties, shock absorption, and transparency.

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Solvent-swollen crosslinked silicone gels containing covalently bonded cyclodextrin groups are prepared by hydrosilylation. The swollen gels are storage stable, compatible with water and polar solvents, and display a significant water break effect.