A hard coat film includes a transparent resin film and a hard coat layer disposed on one surface thereof, the hard coat layer being composed of a cured product of a hard coat composition. The thickness of the hard coat layer 0.15 times or more the thickness of the transparent resin film. The hard coat composition has a negative cure shrinkage ratio. The absolute value of the amount of curl of the hard coat film cut into a 100 mm×100 mm square is 20 mm or less. The hard coat layer may contain a cured product of a polyorganosiloxane compound having an alicyclic epoxy group.

The present disclosure provides a modified starch composition. The modified starch composition includes starch with a terminal siloxane having 100 parts by weight, water having 30-70 parts by weight, and a polyol having 5-35 parts by weight. The present disclosure also provides a starch composite foam material and method for preparing the same.

A method of preparing condensation cross-linked particles in an emulsion includes combining a first linear reactant having two unsaturated carbon-carbon moieties, a second linear reactant having two Si—H moieties, and a third reactant having at least one condensable reactive group and having up to two unsaturated carbon-carbon moieties or Si—H moieties with the proviso that the third reactant has at least one unsaturated carbon-carbon moiety or S—H moiety. The first, second, and third reactants are combined in the presence of a hydrosilylation catalyst and a polar liquid to form an emulsion wherein the first, second, and third reactants react via a hydrosilylation reaction to form particles that have a linear backbone wherein the condensable reactive group is disposed thereon. The method also includes cross-linking the linear backbone via a condensation reaction to form the condensation cross-linked particles.

To provide a low dielectric constant siliceous film manufacturing composition capable of forming a low dielectric constant siliceous film with dispersed pores having excellent mechanical properties and stable electrical properties. [Means] The present invention provides a low dielectric constant siliceous film manufacturing composition comprising: a polysiloxane, a pore-generating material, a condensation catalyst generator, and a solvent.

A curable composition containing an alkenyl phenol A, an epoxy-modified silicone B, and an epoxy compound C other than the epoxy-modified silicone B.

The present invention is a thermal conductive silicone composition comprises (C) one or more aluminum nitride particles selected from an irregular-shaped, a round, and a polyhedral particles having an average particle size of 4 .Math.m or more and less than 50 .Math.m; (D) one or more aluminum nitride particles selected from an irregular-shaped, a round, and a polyhedral particles having an average particle size of 50 .Math.m or more and 150 .Math.m or less; and (E) an inorganic particle having an average particle size of 0.1 .Math.m or more and less than 4.0 .Math.m. This provides a thermal conductive silicone composition ensuring both high thermal conductivity and shift resistance.

A curable composition comprising a polymer A, a polymer B, and one or more fillers, wherein the polymer A includes organic molecules or siloxane molecules comprising two or more epoxy functional groups, and the polymer B includes an organic amine or a hybrid silicone amine.

Provided is a one part, dual curable composition comprising (A) a first acrylic functional polyorganosiloxane with at least one moisture curable functional group, (B) a second acrylic functional polyorganosiloxane, which may optionally contain a moisture curable functional group, and (C) a third functional polyorganosiloxane, which optionally contains an acrylic and moisture curable functional group. The combination of (A), (B), and (C) provides a composition that is both moisture curable and radiation curable and provides a material that is fast curing via the dual cure functionality and provides a cured material exhibiting a relatively low modulus, good adhesion, and optical clarity.

A one-pack type curable silicone gel composition which contains: 100 parts by mass of (A) a branched chain organopolysiloxane having a specific structure from 0.1 part by mass to 50 parts by mass of (B) a diorganopolysiloxane having both molecular chain ends blocked with diorganohydrogensiloxy groups; (C) a platinum-based catalyst; and (D) a phosphite compound represented by formula (3) ##STR00001##
(wherein R.sup.2 represents a monovalent aliphatic hydrocarbon group having 1 to 10 carbon atoms; and X represents a hydrogen atom or a methyl group) in such an amount that more than 3 molecules hut not more than 15 molecules of the phosphite compound represented by formula (3) are present per one platinum atom in component (C). This one-pack type curable silicone gel composition is stable in terms of characteristics and physical properties even if exposed to a temperature more than 50° C. for a long period of time.

Crosslinkable polycarbonate resins having improved properties are disclosed. The crosslinkable polycarbonate resins are formed from a reaction of at least a benzophenone, a first dihydroxy chain extender, and a carbonate precursor, and may include a second dihydroxy chain extender as well.