Patent classifications
C08J2427/12
Fluorocarbon prepreg and resin composition thereof
A fluorocarbon resin composition is applicable to produce a prepreg for use in making a high-frequency circuit board, including a polytetrafluoroethylene resin; a fluorine-containing copolymer of poly fluoroalkoxy or fluorinated ethylene propylene; inorganic powders and an impregnation additive such as hydroxyethyl cellulose; resulted in that the prepreg is capable of increasing a plurality of times for proceeding impregnation-coating, the surface defects prone to occur on a fluorocarbon prepreg during drying, baking and sintering after impregnation are therefore improved at the same time.
Ethylene vinyl alcohol copolymer resin composition as well as films and multi-layer structures thereof
The instant disclosure relates to ethylene vinyl alcohol copolymer resin composition and/or pellets thereof including one or more fluorine-containing micro-particles. The ethylene vinyl alcohol copolymer resin compositions and/or pellets thereof may have a melting pressure of 1.7 to 7.0 MPa at a shear rate of 20 s.sup.1 and a melting point temperature of 190 C. EVOH films formed from the EVOH may have a Charpy impact strength of at least 2.3 KJ/m.sup.2 according to ISO 179-1 at 23 C. and an elongation at break of at least 17.8% according to ISO 527-2 at 23 C.
Polymer electrolyte film
The present invention provides a polymer electrolyte membrane having excellent strength, a small dimensional change, and a low membrane resistance. The polymer electrolyte membrane includes a porous film having pores and a polymer electrolyte contained in the pores. The porous film is obtained by copolymerizing tetrafluoroethylene and an ethylenic comonomer to provide polytetrafluoroethylene and then stretching the polytetrafluoroethylene. The porous film has an average pore size of greater than 0.20 m.
Ethylene vinyl alcohol copolymer resin composition as well as films and multi-layer structures thereof
The instant disclosure relates to ethylene vinyl alcohol copolymer resin composition and/or pellets thereof including one or more fluorine-containing micro-particles. The ethylene vinyl alcohol copolymer resin composition and/or pellets thereof may have a boron content of 10 to 450 ppm. EVOH films formed from the EVOH may have a Charpy impact strength of at least 2.5 KJ/m.sup.2 according to ISO 179-1 at 23 C. and an elongation at break of at least 18.2% according to ISO 527-2 at 23 C.
Copolymerized high temperature bonding component
A method for preparing a bonding component comprises mixing a first solution comprising an organofluorine monomer unit with a second solution comprising an organosilicon monomer unit to form, in-situ, a copolymer solution comprising a copolymer of an organofluorine polymer and an organosilicon polymer based on the organofluorine monomer unit and the organosilicon monomer unit. The method further comprises depositing the copolymer solution onto a body to form a film of the copolymer, and curing the film of the copolymer.
Porous films comprising metal-organic framework materials
The present invention relates to porous films comprising (A) from 51 wt.-% to 99.9 wt.-% based on the total weight of the film of at least one porous metal-organic framework material, the material comprising at least one at least bidentate organic compound coordinated to at least one metal ion; (B) from 0.1 wt.-% to 49 wt.-% based on the total weight of the film of at least one fibrillated fluoropolymer; and (C) 0 wt.-% to 48.9 wt.-% based on the total weight of the film of an additive component. The invention further relates to a composition for preparing such a film and its use.
Fluorocarbon resin composition and prepreg and copper foil substrate using the same
A fluorocarbon resin composition is applicable to produce high-frequency circuit boards including a polytetrafluoroethylene resin; a fluorine-containing copolymer such as poly fluoroalkoxy and fluorinated ethylene propylene; low molecular-weight PTFE micro-powders and inorganic powders; in particular the temperature of pressing copper foil substrates is lowered from 350 C. to 250 C. via a lowering temperature rate of 1 to 4 C./min to improve the crystallinity of the fluorocarbon resin composition as well as improve the copper foil substrate with a high thermal conductivity and a wide range of dielectric constant.
Ion-conducting membrane
An ion-conducting membrane includes: (i) a first ion-conducting layer including one or more first ion-conducting polymers; and (ii) a barrier layer including graphene-based platelets.
Sheets and method for producing sheets
It is an object of the present invention to provide a composite sheet, which achieves all of water repellency, water resistance, transparency and mechanical strength. The present invention relates to a sheet having a fiber layer and a coating layer on the fiber layer, wherein the fiber layer comprises ultrafine cellulose fibers having a fiber width of 1000 nm or less in an amount of 60% by mass or more, the haze of the sheet is 20% or less, and the water contact angle of the surface of the sheet on the side of the coating layer which is measured 30 seconds after completion of the dropping of distilled water is 70 degrees or more.
DECORATIVE FILM AND METHOD FOR PRODUCING DECORATIVE FILM-ATTACHED THREE DIMENSIONAL MOLDED PRODUCT
To provide a decorative film whereby formation of wrinkles is suppressed when attached to a three dimensional molded product in a stretched state, and a method for producing a decorative film-attached three dimensional molded product. The decorative film of the present invention is a decorative film having at least a base film and a top layer containing a fluorinated polymer, the top layer being disposed on one surface, wherein the surface reflection intensity Wa at a wavelength of from 0.1 to 0.3 mm and the surface reflection intensity Wb at a wavelength of from 0.3 to 1.0 mm, of the top layer as measured by using a wave scan apparatus in such a state that the decorative film is stretched by 1.5 times, are both at most 30.0.