There is provided a porous polyimide film in which the pore distribution width A represented by the following formula is 1.15 or less, the average pore diameter is within a range of 0.50 μm to 3.0 μm, and the air permeation speed is 30 seconds or less:
A=(D.sub.84/D.sub.16).sup.1/2 wherein D.sub.16 is the pore diameter at 16% cumulation from the small diameter side of pores, and D.sub.84 is the pore diameter at 84% cumulation from the small diameter side of pores.

A material susceptible to dielectric heating has a base polymeric thermoplastic material (1) and a dielectric heating susceptor (2, 3) which increases susceptibility to heating by irradiation with electromagnetic, for example RF or microwave, radiation. The dielectric heating susceptor has a polymeric material (2) such as PVDF which is different from the base polymeric material and has a higher dielectric loss factor than the base polymeric material. The dielectric heating susceptor also comprises electrically polarisable entities such as carbon black dispersed within the base polymeric material without forming a conductive network. The two susceptor materials in combination with the base polymer are particularly effective together at improving susceptibility to electromagnetic radiation heating of the whole material.

Provided is a resin composition having excellent low water absorption, as well as a cured product, a prepreg, a metal foil-clad laminate, a resin sheet, and a printed wiring board. The resin composition contains a compound (A) represented by Formula (M1) and a compound (B) containing two or more unsaturated carbon-carbon double bonds, and in Formula (M1), A is a four- to six-membered alicyclic group:

##STR00001##

A resin composition includes: (A) 100 parts by weight of a thermosetting resin, which includes a vinyl-containing polyphenylene ether resin, a maleimide resin, or a combination thereof; (B) 15 parts by weight to 50 parts by weight of a sintered body formed by aluminum nitride and boron nitride; and (C) 180 parts by weight to 280 parts by weight of titanium dioxide. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

The present invention addresses the problem of providing a film for a film capacitor that has high heat resistance, self-healing properties, and excellent productivity, wherein the film has a resin layer A having a melting point of 180° C. or higher and/or a glass transition temperature of 130° C. or higher and a layer B thinner than the resin layer A in at least the outermost layer of the film, the oxygen content of the layer B is 1.0% by mass or more, when a dynamic friction coefficient is measured on the same surface of two outermost layer surfaces, the surface having a higher dynamic friction coefficient is defined as an a-plane and the surface having a smaller dynamic friction coefficient is defined as a b-plane, and when a dynamic friction coefficient between the a-planes is defined as μdaa, and a dynamic friction coefficient between the a-plane and the b-plane is defined as μdab, μdaa>μdab and μdab≤1.2 are satisfied.

Polymer foams based on polyetherimides (PEI) or blends of polyetherimides and polyether ether ketone (PEEK) meet the legal requirements demanded by the aviation industry for aircraft interiors and for aircraft exteriors too.

Problem: An object of the present invention is to provide a polyester film for a foldable display, the film having a hold angle in a bending direction of 155° or more and a maximum heat shrinkage at 150° C. of 1.5% or less (wherein the hold angle refers to an angle of a crease after fixing the film at room temperature for 72 hours in such a manner that a strain of 1.7% is applied to both surfaces of a bent portion of the film, and the bending direction refers to a direction that is orthogonal to a folding portion of a foldable display produced using the film.

Disclosed is a temperature measurement system including: a light source unit for receiving excitation light; a target material on which the temperature-sensitive film is attached in order to emit the received excitation light into emission light; a phosphorescence detector for extracting the emission light into a phosphorescence decay signal; and a temperature extraction unit for extracting temperature of the target material using the phosphorescence decay signal.

A resin composition includes 20 parts by weight to 45 parts by weight of a phosphorus-containing bismaleimide and 100 parts by weight of a thermosetting resin, wherein the phosphorus-containing bismaleimide has a structure of Formula (I); the thermosetting resin is selected from a vinyl-containing polyphenylene ether resin, a maleimide resin, a polyolefin resin, a prepolymer of maleimide resin, and a combination thereof. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including flame retardancy, outgassing properties, arc resistance, copper foil peeling strength, X-axis coefficient of thermal expansion, glass transition temperature and water absorption rate.

##STR00001##

Mesoporous poly (aryl ether ketone) articles are formed from blends of poly (aryl ether ketones) with pore forming additives by melt processing, and can be in the form of a monofilament, disc, film, microcapillary or other complex shapes. The method of formation provides for preparation of poly (aryl ether ketone) articles with high degree of surface area and uniform nanometer pore size. The preferred poly (aryl ether ketone)s are poly (ether ketone) and poly (ether ether ketone). The mesoporous articles formed by the method of the present invention are useful for a broad range of applications, including molecular separations and organic solvent filtration.