The present invention relates to a heat separable two-layer adhesive system, to a process of adhesive debonding using the adhesive system and to a heat separable bonded composite body. In particular, the present invention relates to a heat separable two-layer adhesive system comprising an adhesive layer having conductive particles.

A resin composition suppresses unintended curing of a 2-methylene-1,3-dicarbonyl compound in the presence of conductive particles to facilitate the production of a paste including the 2-methylene-1,3-dicarbonyl compound for electronic components. The resin composition includes (a) at least one 2-methylene-1,3-dicarbonyl compound, (b) at least one type of conductive particles and (c) at least one monocarboxylic acid with a number of carbon atoms of 3 or more.

A resin composition suppresses unintended curing of a 2-methylene-1,3-dicarbonyl compound in the presence of conductive particles to facilitate the production of a paste including the 2-methylene-1,3-dicarbonyl compound for electronic components. The resin composition includes (a) at least one 2-methylene-1,3-dicarbonyl compound, (b) at least one type of conductive particles and (c) at least one monocarboxylic acid with a number of carbon atoms of 3 or more.

A resin composition suppresses unintended curing of a 2-methylene-1,3-dicarbonyl compound in the presence of conductive particles to facilitate the production of a paste including the 2-methylene-1,3-dicarbonyl compound for electronic components. The resin composition includes (a) at least one 2-methylene-1,3-dicarbonyl compound, (b) at least one type of conductive particles and (c) at least one monocarboxylic acid with a number of carbon atoms of 3 or more.

According to an aspect of the present disclosure, a heat-resistant coating composition includes: an inorganic filler which is iron (Fe)-based amorphous alloy powder having an amorphous phase and an average particle diameter of 0.5 μm to 15 μm; and a binder, where the coefficient of thermal expansion of the inorganic filler is lower than the coefficient of thermal expansion of the binder.

Disclosed are a magnetic coating material, a magnetic sheet, and a metal compatible tag that have excellent magnetic shielding characteristics against radio waves in the UHF band and do not interfere with a distribution process. A magnetic coating material includes a magnetic filler and a binder resin, wherein the magnetic filler is an Fe—Cr alloy, and wherein in a magnetic sheet formed from the magnetic coating material, complex relative permeability in 860 MHz to 960 MHz has a loss factor tan δ of 0.3 or less and a real part μ′ of 5 or more. Also, a magnetic coating material includes a magnetic filler and a binder resin, wherein the magnetic filler is an Fe—Cr alloy, and wherein a mass ratio of the magnetic filler to a solid content of the binder (mass of the magnetic filler/mass of the solid content of the binder) is from 70/30 to 95/5.

Disclosed are a magnetic coating material, a magnetic sheet, and a metal compatible tag that have excellent magnetic shielding characteristics against radio waves in the UHF band and do not interfere with a distribution process. A magnetic coating material includes a magnetic filler and a binder resin, wherein the magnetic filler is an Fe—Cr alloy, and wherein in a magnetic sheet formed from the magnetic coating material, complex relative permeability in 860 MHz to 960 MHz has a loss factor tan δ of 0.3 or less and a real part μ′ of 5 or more. Also, a magnetic coating material includes a magnetic filler and a binder resin, wherein the magnetic filler is an Fe—Cr alloy, and wherein a mass ratio of the magnetic filler to a solid content of the binder (mass of the magnetic filler/mass of the solid content of the binder) is from 70/30 to 95/5.

An inorganic nanomaterial for continuous formaldehyde removal includes the following components in part by mass: 20-30 parts of water, 0.1-0.3 parts of cellulose, 0.1-0.2 parts of a defoamer, 0.3-0.6 parts of a dispersant, 0.3-0.6 parts of a wetting agent, 20-25 parts of titanium dioxide, 5-10 parts of kaolin, 10-15 parts of heavy calcium, 30-40 parts of modified inorganic hybrid resin, 0.1-1 part of a film-forming additive, and 0.1-1 part of propylene glycol. After inorganic hybrid modification, an ammonia group is introduced, which can continuously and effectively decompose formaldehyde in the environment. A coating film not only has good anti-mildew, anti-algae, fire prevention, and heat insulation functions, but also has a continuous formaldehyde removal function. The formaldehyde removal efficiency is greater than 95%. The durability of formaldehyde purification effect is 90%.

An inorganic nanomaterial for continuous formaldehyde removal includes the following components in part by mass: 20-30 parts of water, 0.1-0.3 parts of cellulose, 0.1-0.2 parts of a defoamer, 0.3-0.6 parts of a dispersant, 0.3-0.6 parts of a wetting agent, 20-25 parts of titanium dioxide, 5-10 parts of kaolin, 10-15 parts of heavy calcium, 30-40 parts of modified inorganic hybrid resin, 0.1-1 part of a film-forming additive, and 0.1-1 part of propylene glycol. After inorganic hybrid modification, an ammonia group is introduced, which can continuously and effectively decompose formaldehyde in the environment. A coating film not only has good anti-mildew, anti-algae, fire prevention, and heat insulation functions, but also has a continuous formaldehyde removal function. The formaldehyde removal efficiency is greater than 95%. The durability of formaldehyde purification effect is 90%.

A thermal interface composition includes a polysiloxane component, a thermal conductive component, a curing agent, a curing accelerator, an organosilicon coupling agent, and a crosslinking agent having three or more epoxy groups. The polysiloxane component includes not lower than 50 wt % and lower than 100 wt % of a first polysiloxane and a second polysiloxane. The thermal conductive component includes not lower than 30 wt % and lower than 70 wt % of a first thermal conductive filler, not lower than 30 wt % and lower than 70 wt % of a second thermal conductive filler, and greater than 0 wt % and not greater than 40 wt % of a third thermal conductive filler. A method for preparing a thermal interface material is also disclosed.