Patent classifications
C08K3/105
Curable Fluoropolymer Compositions Comprising Metal Fluoride Particles and Articles Therefrom
Described herein is a curable fluoropolymer composition comprising: an amorphous fluoropolymer; and particles of a metal fluoride, wherein the particles are not substantially surface treated and wherein the metal of the metal fluoride comprises at least one of an alkaline earth metal, a Group III transition metals, and a Lanthanide metals. Also described are cured articles made with the curable fluoropolymer composition.
Curable Fluoropolymer Compositions Comprising Metal Fluoride Particles and Articles Therefrom
Described herein is a curable fluoropolymer composition comprising: an amorphous fluoropolymer; and particles of a metal fluoride, wherein the particles are not substantially surface treated and wherein the metal of the metal fluoride comprises at least one of an alkaline earth metal, a Group III transition metals, and a Lanthanide metals. Also described are cured articles made with the curable fluoropolymer composition.
SEMICONDUCTOR NANOPARTICLE COMPLEX DISPERSION LIQUID, SEMICONDUCTOR NANOPARTICLE COMPLEX, SEMICONDUCTOR NANOPARTICLE COMPLEX COMPOSITION AND SEMICONDUCTOR NANOPARTICLE COMPLEX CURED MEMBRANE
Provided is a semiconductor nanoparticle complex dispersion liquid in which semiconductor nanoparticles are dispersed in a polar dispersion medium at a high mass fraction, and in which high fluorescence quantum efficiency (QY) is maintained. A semiconductor nanoparticle complex dispersion liquid according to an embodiment includes a semiconductor nanoparticle complex dispersed in an organic dispersion medium, wherein: the semiconductor nanoparticle complex is composed of two or more ligands including an aliphatic thiol ligand and a polar ligand, and a semiconductor nanoparticle with the ligands coordinated to the surface thereof; the ligands are composed of an organic group and a coordinating group; the organic group of the polar ligand includes a hydrophilic functional group; and an SP value of the organic dispersion medium is 8.5 or more.
Conductive composites
Disclosed are conductive composites comprising a polymer, a conductor selected from metals and metal alloys, and a thickening agent.
Conductive composites
Disclosed are conductive composites comprising a polymer, a conductor selected from metals and metal alloys, and a thickening agent.
Preparation of Cerium (III) Carbonate Dispersion
The present invention relates to a composition comprising a polymer and cerium (III) carbonate. The composition is useful in coatings formulations that include pigments, dyes, or tints, or a combination thereof, to promote color retention and attenuate unwanted color formation in coatings formed from these formulations.
Composition based on a vinyl halide polymer
Composition comprising at least one vinyl halide polymer and 0.1 to 5% by weight, relative to the weight of the vinyl halide polymer, of at least one polymer of at least one acrylic ester obtained by polymerization in solution in a liquid medium comprising at least one chain transfer agent chosen among the C.sub.3-C.sub.20 hydrocarbons containing at least one secondary alcohol function. Process for its manufacture, article obtained starting from this composition and use of this composition for manufacturing sheets and films via calendaring or for manufacturing profiles by extrusion. Process for the manufacture of a polymer of at least one acrylic ester which can be used in the composition.
Composition based on a vinyl halide polymer
Composition comprising at least one vinyl halide polymer and 0.1 to 5% by weight, relative to the weight of the vinyl halide polymer, of at least one polymer of at least one acrylic ester obtained by polymerization in solution in a liquid medium comprising at least one chain transfer agent chosen among the C.sub.3-C.sub.20 hydrocarbons containing at least one secondary alcohol function. Process for its manufacture, article obtained starting from this composition and use of this composition for manufacturing sheets and films via calendaring or for manufacturing profiles by extrusion. Process for the manufacture of a polymer of at least one acrylic ester which can be used in the composition.
CONDUCTIVE PASTE AND METHOD FOR PRODUCING CONDUCTIVE FILM USING SAME
After there is prepared a conductive paste which contains fine copper particles having an average particle diameter of 1 to 100 nm, each of the fine copper particles being coated with an azole compound, such as benzotriazole, coarse copper particles having an average particle diameter of 0.3 to 20 μm, at least one of a polyvinylpyrrolidone (PVP) resin and a polyvinyl butyral (PVB) resin, a chlorine compound, and a glycol solvent, such as ethylene glycol, the total amount of the fine copper particles and the coarse copper particles being 50 to 90% by weight, and the weight ratio of the fine copper particles to the coarse copper particles being in the range of from 1:9 to 5:5, the conductive paste thus prepared is applied on a substrate by screen printing to be preliminary-fired by vacuum drying, and then, fired with light irradiation by irradiating with light having a wavelength of 200 to 800 nm at a pulse period of 500 to 2000 μs and a pulse voltage of 1600 to 3800 V to form a conductive film on the substrate.
MULTILAYER TAPE INCLUDING PLURALITY OF MAGNETIC METAL PARTICLES AND ELECTRONIC ASSEMBLY INCLUDING THE SAME
A multilayer tape according to an embodiment of the present disclosure includes: an adhesive layer including an epoxy; and an electromagnetic interference (EMI) absorption layer disposed on the adhesive layer and including a thermoset epoxy resin and a plurality of magnetic metal particles which are distributed in the thermoset epoxy resin, and the magnetic metal particles include iron, and a ratio of a gross weight of the plurality of magnetic metal particles to a gross weight of the EMI absorption layer is higher than bout 40%, and a peel strength of the adhesive layer and the EMI absorption layer after the adhesive layer is cured is about 5 times or more greater than a peel strength of the adhesive layer and the EMI absorption layer before the adhesive layer is cured.