A thermally conductive resin composition capable of maintaining high thermal conductivity and a thermally conductive sheet using the same. A thermally conductive resin composition contains: an addition reaction type silicone resin; a hindered phenol-based antioxidant; a thiol-based antioxidant; a dispersant having a hydrophilic functional group and a silicone chain; and a thermally conductive filler, wherein the thermally conductive resin composition contains 65 to 90% by volume of the thermally conductive filler.

A thermally conductive resin composition capable of maintaining high thermal conductivity and a thermally conductive sheet using the same. A thermally conductive resin composition contains: an addition reaction type silicone resin; a hindered phenol-based antioxidant; a thiol-based antioxidant; a dispersant having a hydrophilic functional group and a silicone chain; and a thermally conductive filler, wherein the thermally conductive resin composition contains 65 to 90% by volume of the thermally conductive filler.

The PSA sheet provided by this invention has a PSA layer. The PSA layer comprises particles P.sub.HRI. The particles P.sub.HRI present in the PSA layer has a mean particle diameter of less than 100 nm and a standard deviation of 20 nm or less. Here, the mean particle diameter and the standard deviation are determined from a number-based particle distribution by TEM analysis.

A curable composition includes, per 100 parts by mass of a curable compound, 0.1 to 10.0 parts by mass of a compound (A) including a structure represented by the following general formula (I), and 0.01 to 10.0 parts by mass of a base (B):

##STR00001##

where X represents a chalcogen atom, R.sup.1 and R.sup.2 each independently represent an alkyl group having 1 to 6 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, an aryl group, or an aralkyl group, and R.sup.3 and R.sup.4 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, an aryl group, or an aralkyl group.

The present invention relates to a polyolefin composition comprising (a) a hindered amine light stabilizer of formula (1) as defined herein, (b) a hydrotalcite or an inorganic oxide, and (c) a hydroxylamine stabilizer or an amine oxide stabilizer, a flame retardant article comprising such composition, and to the use of components (b) and (c) for reducing odor in a polyolefin composition comprising a component (a).

The present invention relates to a polyolefin composition comprising (a) a hindered amine light stabilizer of formula (1) as defined herein, (b) a hydrotalcite or an inorganic oxide, and (c) a hydroxylamine stabilizer or an amine oxide stabilizer, a flame retardant article comprising such composition, and to the use of components (b) and (c) for reducing odor in a polyolefin composition comprising a component (a).

An improved adhesive composition having increased insulative properties is provided. The adhesive composition having improved insulative properties includes a starch component; an alkaline component; sodium tetraborate; water; and a plurality of expandable microspheres. Products having improved insulation capabilities and methods of making the products having improved insulation capabilities are also provided. The present adhesive and products including the adhesive is environmentally friendly.

An improved adhesive composition having increased insulative properties is provided. The adhesive composition having improved insulative properties includes a starch component; an alkaline component; sodium tetraborate; water; and a plurality of expandable microspheres. Products having improved insulation capabilities and methods of making the products having improved insulation capabilities are also provided. The present adhesive and products including the adhesive is environmentally friendly.

A curable resin composition comprising: (a) 27 to 60 wt % of a liquid siloxane oligomer comprising polymerized units of formula R.sup.1.sub.mR.sup.2.sub.nSi(OR.sup.3).sub.4-m-n, wherein R.sup.1 is a C.sub.5-C.sub.20 aliphatic group comprising an oxirane ring fused to an alicyclic ring, R.sup.2 is a C.sub.1-C.sub.20 alkyl, C.sub.6-C.sub.30 aryl group, or a C.sub.5-C.sub.20 aliphatic group having one or more heteroatoms, R.sup.3 is a C.sub.1-C.sub.4 alkyl group or a C.sub.1-C.sub.4 acyl group, m is 0.1 to 2.0 and n is 0 to 2.0; (b) 35 to 66 wt % non-porous nanoparticles of silica, a metal oxide, or a mixture thereof, having an average particle diameter from 5 to 50 nm; and (c) 0.5 to 7 wt % of a cationic photoinitiator.

A curable resin composition comprising: (a) 27 to 60 wt % of a liquid siloxane oligomer comprising polymerized units of formula R.sup.1.sub.mR.sup.2.sub.nSi(OR.sup.3).sub.4-m-n, wherein R.sup.1 is a C.sub.5-C.sub.20 aliphatic group comprising an oxirane ring fused to an alicyclic ring, R.sup.2 is a C.sub.1-C.sub.20 alkyl, C.sub.6-C.sub.30 aryl group, or a C.sub.5-C.sub.20 aliphatic group having one or more heteroatoms, R.sup.3 is a C.sub.1-C.sub.4 alkyl group or a C.sub.1-C.sub.4 acyl group, m is 0.1 to 2.0 and n is 0 to 2.0; (b) 35 to 66 wt % non-porous nanoparticles of silica, a metal oxide, or a mixture thereof, having an average particle diameter from 5 to 50 nm; and (c) 0.5 to 7 wt % of a cationic photoinitiator.