Provided is a composition for forming a plating base on which plating is applied without a pretreatment, especially any activation process for the plating base, conventionally believed to be necessary, as well as a thus-formed plating base and a method of forming a plating coat over the plating base. The plating base is a coating film formed by applying and drying a metal nanoparticle dispersion liquid or a metal nanoparticle dispersion ink in which metal nanoparticles are protected with a small amount of protecting agent. Thus, a metal film can be formed by plating without operations such as substrate cleaning or catalyst imparting and activating. Since it is not necessary to wash the substrate with acid or base solution or to heat-treat it at a high temperature, many variations of materials become available for the substrate.

A thermally conductive interface composition is interposed between a heat generating component and a heat dissipating component. To meet escalated heat dissipation for performance demanding devices, a thermally conductive interface composition comprises (A) A linear alkenyl organopolysiloxane containing a silicon-bonded alkenyl-terminated group or groups, (B) A branched alkenyl organopolysiloxane containing at least two silicon-bonded alkenyl groups, (C) thermally conductive fillers in a ternary particle size mixture, (D) An organohydrogenpolysiloxane containing at least two Si—H terminated groups, (E) An addition reaction catalyst, (F) A hydroxy group-containing siloxane, (G) Alkoxy group-containing siloxanes.

A thermally conductive interface composition is interposed between a heat generating component and a heat dissipating component. To meet escalated heat dissipation for performance demanding devices, a thermally conductive interface composition comprises (A) A linear alkenyl organopolysiloxane containing a silicon-bonded alkenyl-terminated group or groups, (B) A branched alkenyl organopolysiloxane containing at least two silicon-bonded alkenyl groups, (C) thermally conductive fillers in a ternary particle size mixture, (D) An organohydrogenpolysiloxane containing at least two Si—H terminated groups, (E) An addition reaction catalyst, (F) A hydroxy group-containing siloxane, (G) Alkoxy group-containing siloxanes.

The invention is based on the novel use of Aluminum Trihydroxide (ATH or Al(OH).sub.3) as a filler for Thermal Interface Materials (TIM).

The invention is based on the novel use of Aluminum Trihydroxide (ATH or Al(OH).sub.3) as a filler for Thermal Interface Materials (TIM).

Compositions are provided that comprise: (1) a polymer selected from the group consisting of: (A) an ethylene/α-olefin multiblock interpolymer; (B) a propylene based plastomer or elastomer; and (C) a mixture of (A) and (B); (2) from about 1 to about 75 weight percent filler based on the weight of the composition; and (3) an effective amount of tackifier.

Compositions are provided that comprise: (1) a polymer selected from the group consisting of: (A) an ethylene/α-olefin multiblock interpolymer; (B) a propylene based plastomer or elastomer; and (C) a mixture of (A) and (B); (2) from about 1 to about 75 weight percent filler based on the weight of the composition; and (3) an effective amount of tackifier.

A two-part curable composition which cures to form a thermally conductive cured product, including: (a) a first part including: (1) at least one metal catalytic component for catalyzing the cure reaction; (2) a non-reactive diluent component; (3) a wetting agent component; (4) a filler component; (5) a rheology modifier component; and (6) a pigment component; and (b) a second part including: (1) at least one silane terminated polyurethane polymer; (2) a moisture scavenger; (3) a non-reactive diluent component; (4) a filler component; and (5) a wetting agent component, wherein at least one of the filler components of the first-part and the second-part comprises a thermally conductive filler.

A two-part curable composition which cures to form a thermally conductive cured product, including: (a) a first part including: (1) at least one metal catalytic component for catalyzing the cure reaction; (2) a non-reactive diluent component; (3) a wetting agent component; (4) a filler component; (5) a rheology modifier component; and (6) a pigment component; and (b) a second part including: (1) at least one silane terminated polyurethane polymer; (2) a moisture scavenger; (3) a non-reactive diluent component; (4) a filler component; and (5) a wetting agent component, wherein at least one of the filler components of the first-part and the second-part comprises a thermally conductive filler.

A silyl protected diacrylamide compound is described. A method of forming such a compound includes mixing a silylation reagent with a hydroxylated diamine compound under first reactive conditions to form a product in a first solution, separating the product from the first solution, and mixing the product with acryloyl chloride under second reactive conditions in a second solution to form a silyl protected diacrylamide compound.