Provided is a thermally conductive liquid composition containing a matrix resin (A) and thermally conductive inorganic particles (B). The matrix resin (A) accounts for 2 mass % or more and 8 mass % or less and the thermally conductive inorganic particles (B) account for 92 mass % or more and 98 mass % or less relative to 100 mass % of the thermally conductive liquid composition. The thermally conductive inorganic particles (B) include thermally conductive inorganic particles (B1) of 100 μm or more and 500 μm or less and thermally conductive inorganic particles (B2) of 0.01 μm or more and less than 100 μm. In the volume-based cumulative distribution curve, the thermally conductive inorganic particles (B1) account for 25 vol % or more and 50 vol % or less and the thermally conductive inorganic particles (B2) account for 50 vol % or more and 75 vol % or less relative to 100 vol % of the thermally conductive inorganic particles (B). Thus, the thermally conductive liquid composition has improved fluidity and is smoothly extruded from a discharge orifice of a small diameter while having high thermal conductivity.

The present application relates to a composition, a battery module and a battery pack. According to one example of the present application, the related manufacturing process can be improved and a battery module having excellent insulation can be provided.

The present application relates to an adhesive composition capable of fixing a battery cell in a battery module and a battery pack. According to one example of the present application, there is provided a two-component urethane-based adhesive composition which has excellent storage stability and processability and is capable of providing physical properties required in related uses in a short time.

The present application relates to a composition, a battery module and a battery pack. According to one example of the present application, it is possible to provide a battery module and a battery pack which have improved heat dissipation properties, adhesive force, adhesion reliability and processability as well as excellent power to volume.

A thermally conductive resin composition capable of maintaining high thermal conductivity and a thermally conductive sheet using the same. A thermally conductive resin composition contains: an addition reaction type silicone resin; a hindered phenol-based antioxidant; a thiol-based antioxidant; a dispersant having a hydrophilic functional group and a silicone chain; and a thermally conductive filler, wherein the thermally conductive resin composition contains 65 to 90% by volume of the thermally conductive filler.

An insulating filler composed of a mixed powder in which a hydrophobic fumed oxide powder having an average primary particle size D.sub.1, which is smaller than an average primary particle size D.sub.2, is adhered to the surface of a magnesium oxide powder and/or a nitride-based inorganic powder having the average primary particle size D.sub.2, wherein: the ratio D.sub.1/D.sub.2 of the average primary particle size D.sub.1 to the average primary particle size D.sub.2 is 6×10.sup.−5 to 3×10.sup.−3; the volume resistivity of the mixed powder is 1×10.sup.11 Ω.Math.m or more; and the content ratio of the hydrophobic fumed oxide powder in the mixed powder is 5-30 mass %. Also provided is an insulating material in which the above-mentioned insulating filler is contained in a resin molded body.

The present disclosure relates to an epoxy resin composition having a thermal conductivity of at least 5 W/m.Math.k, which has a sufficient thermal emission effect when implementing a multilayer circuit and can replace a ceramic substrate used in automobiles, home appliances, electric vehicles and the like, and to a heat dissipation circuit board using the same. The epoxy resin composition according to one embodiment of the present disclosure, the epoxy resin composition includes an epoxy resin, a curing agent and an inorganic filler. The inorganic filler may include alumina having a maximum particle diameter of less than 32 μm and aluminum nitride having a mean particle diameter of 0.5 to 1.0 μm, in an amount of 85 wt % or more. The epoxy resin composition includes an inorganic filler having a mean particle diameter of 1.0 μm to form an insulating layer having excellent thermal conductivity and withstand voltage properties, thereby providing a high heat dissipation circuit board that is superior compared to existing single layer circuit boards.

An aluminum nitride particle including at least a first truncated six-sided pyramid (1-a) and a second truncated six-sided pyramid (1-b), the aluminum nitride particle having a shape such that a lower base (3) of the first truncated six-sided pyramid (1-a) and a lower base (3) of the second truncated six-sided pyramid (1-b) face each other, the first truncated six-sided pyramid (1-a) and the second truncated six-sided pyramid (1-b) each having an upper base (2) with an area S1 of not less than 60 μm.sup.2 and not more than 4800 μm.sup.2, and each having a ratio (S1/S2) of the area S1 to an area S2 of the lower base (3) being not less than 0.5 and less than 1, the first truncated six-sided pyramid (1-a) and the second truncated six-sided pyramid (1-b) respectively having a height h1 and a height h2 each being not less than 5 μm and not more than 20 μm.

Provided is a thermally conductive composition that is capable of effectively suppressing pump out. Specifically provided is a thermally conductive composition that contains a base oil composition and an inorganic powder filler, wherein: the base oil composition contains a base oil, a thermoplastic resin that has a softening point of 50-150° C., and a thixotropic agent; and when shaped into a thermally conductive sheet of the thermally conductive composition at a temperature not less than the softening point of the thermoplastic resin, the type-A hardness (in compliance with JIS K 6253-3) of the thermally conductive sheet as measured using a durometer is 30-80.

A resin composition of the present invention comprises: a silicone resin or a silicone oil (A), a compound (B) having a particular structure, and a thermally conductive filler (C). According to the present invention, a resin composition having favorable thermally conductive properties and exhibiting small physical property changes at high temperatures can be provided.