An inorganic particle dispersion resin composition, containing: a resin; and inorganic particles, in which the inorganic particles include silica-covered aluminum nitride particles and alumina particles, and the silica-covered aluminum nitride particles include aluminum nitride particles and a silica film covering surfaces of the aluminum nitride particles. A total content of the inorganic particles is preferably in a range of greater than or equal to 60.0 volume % and less than or equal to 85.0 volume %.

One embodiment of the present invention relates to a resin composition or a method of producing a resin composition, and the resin composition includes 100 parts by volume of a resin (A), and 230 to 640 parts by volume of a filler (B) having an average particle diameter of 5 μm to 60 μm, wherein the filler (B) contains a filler (B-1) having a spherical shape with an average particle diameter of 0.1 μm or more and 0.7 μm or less and a filler (B-2) having a peak at least in a range of 0.9 μm to 3.0 μm in a particle size distribution measured by a laser diffraction method, and the proportion of the filler (B-1) is from 0.2 vol % to 5.0 vol % with respect to 100 vol % of the filler (B).

A method of making a thermal interface material includes: combining a powder of diamond particles having a nominal dimension of 1,000 nm or less with a volatile liquid hydrocarbon material to provide a diamond dispersion; and combining the diamond dispersion with a first mixture to provide the thermal interface material, wherein the first mixture includes a matrix material and particles of a first material have a nominal dimension in a range from 1 micron to 100 microns, and wherein the diamond particles compose 0.5 wt. % to 5 wt. % of the thermal interface material, the matrix material composes 10 wt. % or less of the thermal interface material, and the first material composes at least 40 wt. % of the thermal interface material.

A fluorine-containing elastomer composition for a heat dissipation material, including a fluorine-containing elastomer being VdF-based fluoroelastomer having a Mooney viscosity at 121° C. of 10 or lower and an insulating thermal conductive filler. Also disclosed is a sheet obtained by molding the fluorine-containing elastomer composition.

The present invention provides a thermally conductive composition in which the flexibility of the thermally conductive composition is not impaired, and even when cured into a thermally conductive molded body, good bendability, an excellent handling property, and excellent thermal conductivity are exhibited, and provides a molded body of the thermally conductive composition. A thermally conductive composition, in which a thermally conductive filler is contained in a polymer matrix, includes a methyl phenyl silicone, characterized in that the thermally conductive filler has an average particle size of 10 to 100 μm, the content of the thermally conductive filler in the thermally conductive composition is 70% to 90% by volume, and 30% to 80% by volume of the thermally conductive filler has a particle size of 40 μm or more. A thermally conductive molded body is formed of a cured body of the thermally conductive composition.

A thermally conductive composition includes a matrix resin, a curing catalyst, and thermally conductive particles. The thermally conductive particles include, with respect to 100 parts by mass of the matrix resin component, (a) 900 parts by mass or more of aluminum nitride with an average particle size of 50 μm or more, (b) 400 parts by mass or more of aluminum nitride with an average particle size of 5 μm or less, and (c) more than 0 parts by mass and 400 parts by mass or less of alumina with an average particle size of 6 μm or less. A cured product of the thermally conductive composition has a thermal conductivity of 12 W/m.Math.K or more and an Asker C hardness of 20 to 75. Thus, a thermally conductive composition having a hardness suitable for mounting to an electrical or electronic component and high thermal conductive properties, and a thermally conductive sheet using the thermally conductive composition are provided.

Aluminum nitride particles which are excellent in high thermal conductivity and useful as a filler for a heat dissipating material and which have good fluidity for improving the fillability, that is, spherical AlN particles containing Zr atoms with respect to Al atoms in an amount of a molar ratio Zr/Al=4.0×10.sup.−4 to 4.2×10.sup.−2, having an AlN conversion rate of 70.0% or more, and having a circularity of 0.85 to 1.00.

A composition contains: (a) curable silicone composition including: (i) a vinyldimethylsiloxy-terminated polydimethylpolysiloxane with a viscosity of 30 to 400 mPa*s; (ii) a SiH functional crosslinker; and (iii) a hydrosilylation catalyst; where the molar ratio of crosslinker SiH functionality to vinyl functionality is 0.5:1 to 1:1; (b) alkyl trialkoxysilane and/or a mono-trialkoxysiloxy terminated dimethylpolysiloxane treating agent; (c) filler mix containing: (i) 40 wt % or more of spherical and irregular shaped AlN particles, both having an average size of 30 micrometers or more, the spherical AlN fillers are 40-60 wt % of the weight of the AlN fillers; (ii) 25-35 wt % spherical Al.sub.2O.sub.3 particles with an average size of 1-5 micrometers; (iii) 10-15 wt % of additional thermally conductive filler with a 0.1-0.5 micrometer average size; and (iv) optionally, BN fillers having an average size greater than 20 micrometers; where filler mix is 90-97 wt % and wt % is relative to composition weight unless otherwise stated.

A thermally conductive composition containing a filler and a polymer component, wherein the filler includes a filler (A) surface-treated with a silylated castor oil derivative obtained by reacting isocyanate silane with a castor oil-based polyol.

A composition contains the following components: (a) 15 to 49.8 volume-percent of a first polysiloxane that is has a viscosity in a range of 50 centiStokes to 550 Stokes as determined according to ASTM D4283-98; (b) 0.2 to 5 volume-percent of an organoclay; (c) 50-74 volume-percent roundish or crushed thermally conductive fillers including: (i) 5 to 15 volume-percent small thermally conductive fillers having a median particle size in a range of 0.1 to 1.0 micrometers; (ii) 10 to 25 volume-percent medium thermally conductive fillers having a median particle size in a range of 1.1 to 5.0 micrometers; (iii) 25 to 50 volume-percent large thermally conductive fillers having a median particle size in a range of 5.1 to 50 micrometers; and (d) 0 to 5 volume-percent of an alkoxy functional linear polysiloxane different from the first polysiloxane and/or an alkoxy functional linear silane; where volume-percent values are relative to composition volume.