The present invention provides a polymer film on array (PFA) material and a preparation method thereof. The PFA material includes a polymer film on array (PFA) resin, a polysiloxane resin dispersion liquid, and a solvent, wherein the PFA resin ranges from 1 to 25% by weight relative to a total weight of the PFA material, and the polysiloxane resin dispersion liquid ranges from 1 to 30% by weight relative to a total weight of the PFA material.

An object of the present invention is to provide an insulation sheet having high thermal conductivity in the in-plane direction.

The present invention provides an insulation sheet comprising insulating particles and a binder resin, wherein, for the entire cross-section of the sheet perpendicular to the in-plane direction, the insulation sheet contains 75 to 97% by area of the insulating particles, 3 to 25% by area of the binder resin, and 10% by area or less of the voids.

The present invention relates to aggregated boron nitride particles including hexagonal boron nitride primary particles aggregated, including a spacer type coupling agent. The thermally conductive resin composition of the present invention includes the aggregated boron nitride particles of the present invention. The heat dissipation member of the present invention includes the thermally conductive resin composition of the present invention. According to the present invention, aggregated boron nitride particles that can suppress the formation of voids in a heat dissipation member produced by mixing with a resin, a thermally conductive resin composition including the aggregated boron nitride particles, and a heat dissipation member using the thermally conductive resin composition can be provided.

The invention relates to polymeric-inorganic nanoparticle compositions and preparation processes thereof. The invention also relates to an additive and lubricant composition comprising these polymeric-inorganic nanoparticle compositions, as well as to the use of these polymeric-inorganic nanoparticle compositions in an oil lubricant formulation to improve tribological performance, in particular to improve anti-friction performance on metal parts.

A thermally conductive sheet includes a resin composition including a silicone rubber, and thermally conductive fillers that are anisotropic, the thermally conductive fillers being dispersed in the silicone rubber. A content of the thermally conductive fillers in the resin composition is 52% by volume or more and 75% by volume or less. Major axes of the thermally conductive fillers are oriented in a thickness direction of the thermally conductive sheet, and a ratio of a peak intensity of a (002) plane to a peak intensity of a (100) plane in a spectrum measured from the thickness direction by an X-ray diffraction method is 0.31 or less.

A resin composition includes 100 parts by weight of a fluorine-containing compound, which includes tetrafluoroethylene homopolymer, perfluoroalkoxy alkane polymer or a combination thereof; 2 parts by weight to 6 parts by weight of a butyral copolymer, which includes a unit of Formula (I), a unit of Formula (II) and a unit of Formula (III), wherein 1 is an integer of 40 to 250, m is an integer of 5 to 380, n is an integer of 55 to 2500, and wherein the butyral copolymer has a content of hydroxyl group of 21 mol % to 80 mol %; and 20 parts by weight to 150 parts by weight of an inorganic filler. The resin composition may achieve improvements in at least one of the following properties of the article made therefrom including dielectric constant, dissipation factor, X-axis coefficient of thermal expansion, weight loss percentage, tensile strength and comparative tracking index.

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A composition having: 30% to 35% by weight of a first polydimethylsiloxane having vinyl moieties, wherein at least 0.10% by weight of the first polydimethylsiloxane is attributed to the vinyl moieties; 20% to 25% by weight of a second polydimethylsiloxane having vinyl moieties, wherein at least 0.20% by weight of the second polydimethylsiloxane is attributed to the vinyl moieties; 7% to 10% by weight of a third polydimethylsiloxane having hydroxyl moieties, wherein at least 2.0% by weight of the third polydimethylsiloxane is attributed to the hydroxyl moieties; 22% to 35% by weight fumed silicon dioxide, wherein the fumed silicon dioxide has a surface area of at least 150 square meters per gram; 0.2% to 1.0% by weight a blowing agent; 0.15% to 0.5% by weight active boron; and 0.25% to 1.00% by weight active peroxide.

An electron package includes an interface member between an electronic component and a thermal dissipation member. The interface member is highly efficient in transmitting thermal energy and/or suppressing electromagnetic radiation, with a particle filler dispersion including a combination of substantially spherical particles and substantially platelet-shaped particles within dispersion attribute ranges.

Provided is a thermally conductive molded resin article that can be inexpensively mass-produced and that exhibits a low thermal resistance value as a result of reducing internal thermal resistance by high filling and reducing interfacial thermal resistance by improving cutting precision. The thermally conductive molded resin article is characterized by comprising a resin and thermally conductive fillers including a first thermally conductive filler and a second thermally conductive filler having a smaller particle size than the first thermally conductive filler. The thermally conductive molded resin article is also characterized in that: the first thermally conductive filler has an aspect ratio of 10 or more and is oriented approximately in the thickness direction of the thermally conductive molded resin article; the resin is a silicone resin, an acrylic rubber, or a fluororubber; and the second thermally conductive filler has a thermal conductivity surpassing 5 W/mK.

Pressure-sensitive adhesives (PSAs) and tapes comprising said PSAs are provided. The PSAs comprise at least one poly(meth)acrylate and at least 40% by volume, based on a total volume of the pressure-sensitive adhesive, of a mixture of at least two fillers. The mixture of at least two fillers comprises at least one filler Fi.sub.sph comprising or consisting of essentially spherical particles and the PSAs may conduct heat and/or provide electrical resistivity for electronic device or component applications.