Disclosed herein are thermal interface material comprising liquid epoxy resin that is free of aromatic groups and high loading of aluminum trihydroxide and the use thereof in battery powered vehicles.

Disclosed herein are thermal interface materials (TIM) composition comprising: a) a non-reactive polyurethane prepolymer; b) about 70-95 wt % of aluminum trihydroxide (ATH); c) about 0.15-1.5 wt % of at least one silane terminated urethane prepolymer; and d) about 1-20 wt % of at least one plasticizer, with the total weight of the thermal interface material totaling to 100 wt %.

Disclosed herein are thermal interface materials (TIM) composition comprising: a) a non-reactive polyurethane prepolymer; b) about 70-95 wt % of aluminum trihydroxide (ATH); c) about 0.15-1.5 wt % of at least one silane terminated urethane prepolymer; and d) about 1-20 wt % of at least one plasticizer, with the total weight of the thermal interface material totaling to 100 wt %.

The invention relates to an aqueous resin dispersion D comprising a mixture of a hydrophilically modified epoxy-based resin P and a resole R, and a co-crosslinker E, to a process for the preparation of the aqueous resin dispersion D, and to a method of use thereof to prepare coating films to prevent corrosion of the coated substrate.

Thermosetting powder coating compositions and processes for making the thermosetting powder coating compositions and processes for coating an article with the thermosetting powder coating compositions are disclosed. Cured thermosetting powder coating compositions are obtained by curing of the thermosetting powder coating compositions of the invention. Articles are provided having coated thereon the thermosetting powder coating compositions as well as to articles having coated and cured thereon the thermosetting powder coating compositions. The thermosetting powder coating compositions exhibit a substantially lower T.sub.chalk-free, that is a ΔT.sub.chalk-free which is in the range of from and including 5 up to and not including 10° C., wherein ΔT.sub.chalk-free=T.sub.chalk-free.sup.REF−T.sub.chalk-free.sup.A where T.sub.chalk-free.sup.A is the T.sub.chalk-free of a thermosetting powder coating composition according to the invention (TPCC-A) and T.sub.chalk-free.sup.REF is the T.sub.chalk-free of a thermosetting powder coating composition not according to the invention (TPCC-REF) that is comparable to TPCC-A.

Provided is a polymerizable liquid (or “resin”) for producing three-dimensional objects by additive manufacturing, which may include one or more of: (a) a polyvinyl siloxane; (b) a polythiol crosslinker; (c) a photoinitiator (e.g., a free radical photoinitiator); (d) optionally, a urethane (meth)acrylate oligomer; (e) optionally, a reactive diluent; (f) optionally, but in some embodiments preferably, a pigment or dye; (g) optionally, but in some embodiments preferably, a reactive or non-reactive filler; and (h) optionally, an odor scavenger.

Provided is a polymerizable liquid (or “resin”) for producing three-dimensional objects by additive manufacturing, which may include one or more of: (a) a polyvinyl siloxane; (b) a polythiol crosslinker; (c) a photoinitiator (e.g., a free radical photoinitiator); (d) optionally, a urethane (meth)acrylate oligomer; (e) optionally, a reactive diluent; (f) optionally, but in some embodiments preferably, a pigment or dye; (g) optionally, but in some embodiments preferably, a reactive or non-reactive filler; and (h) optionally, an odor scavenger.

A method of continuously producing an ethylene-vinyl acetate copolymer in a polymerization vessel containing a reaction liquid containing ethylene, vinyl acetate, a polymerization initiator and methanol, the polymerization vessel being connected via piping to a heat exchanger circulating a coolant, the method includes the steps of: supplying ethylene, the polymerization initiator and methanol to the polymerization vessel; introducing pressurized gas containing ethylene present in a gas phase portion of the polymerization vessel into the heat exchanger; supplying vinyl acetate cooled to between −50° C. and 23° C. to an upper portion of the heat exchanger; flowing vinyl acetate down in the heat exchanger while absorbing ethylene; letting vinyl acetate dissolving ethylene out of a bottom portion of the heat exchanger and adding to the reaction liquid in the polymerization vessel; and taking the reaction liquid out of the polymerization vessel. This provides a method of efficiently removing heat during polymerization of an ethylene-vinyl acetate copolymer.

Embodiments in accordance with the present invention encompass polyamic acid or polyimide polymers containing a reactive maleimide end group as well as photosensitive compositions made therefrom which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. The negative images formed therefrom exhibit improved thermo-mechanical properties, among other property enhancements.

Embodiments in accordance with the present invention encompass polyamic acid or polyimide polymers containing a reactive maleimide end group as well as photosensitive compositions made therefrom which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. The negative images formed therefrom exhibit improved thermo-mechanical properties, among other property enhancements.