Thermoplastic resin composition comprising: (a1) at least one styrene-acrylonitrile copolymer component A1, (a2) at least one acrylonitrile styrene acrylate graft copolymer A2 as impact modifier, (a3) optionally at least one thermoplastic polymer A3 other than components A1 and A2, (b) at least one pigment B, (c) at least one hindered amine UV light stabilizer C, and (d) optionally further polymer additives D, other than components B and C, wherein the UV stabilizing component(s) present in the thermoplastic resin are only hindered amine UV light stabilizer(s) C.

An isocyanate composition according to the present invention contains: a difunctional or more-functional isocyanate compound; and 1.0 ppm by mass to 1.0×10.sup.4 ppm by mass, based on the isocyanate compound, of a compound having at least one unsaturated bond excluding unsaturated bonds constituting an aromatic ring, the compound being different from the isocyanate.

The present invention relates to an ethylene-vinyl alcohol copolymer composition, a single-layer film and a multilayer structure containing the same. Said ethylene-vinyl alcohol copolymer composition includes an ethylene-vinyl alcohol copolymer, an antioxidant, and a fluorine-containing compound; and the ratio of the antioxidant content to the fluorine content is 0.5 to 65. Thereby, the film containing said ethylene-vinyl alcohol copolymer composition not only has good heat resistance, but also can avoid the situation that a large number of gels are generated during the preparation process.

The present invention relates to an ethylene-vinyl alcohol copolymer composition, a single-layer film and a multilayer structure containing the same. Said ethylene-vinyl alcohol copolymer composition includes an ethylene-vinyl alcohol copolymer, an antioxidant, and a fluorine-containing compound; and the ratio of the antioxidant content to the fluorine content is 0.5 to 65. Thereby, the film containing said ethylene-vinyl alcohol copolymer composition not only has good heat resistance, but also can avoid the situation that a large number of gels are generated during the preparation process.

According to the present invention, a power module that has a base to which a power semiconductor device is bonded and a sealing body for sealing said base and in which the base and the sealing body are bonded with a primer layer interposed therebetween, said primer layer being formed of a cured product of a silicone-modified polyimide resin composition containing, for example, components (A) to (E) below, has high reliability because delamination of an epoxy sealing resin under high temperature conditions is suppressed. (A) Silicone-modified polyimide resin represented by formula (1)
Ee-Ff-Gg  (1)
E is represented by formula (2), F is represented by formula (3), G is a divalent group derived from diamine, f+e+g=100 mol %, the molar ratio f/(e+g) is 0.9-1.1, and e is 1-90 when the sum of e and g is 100. ##STR00001##
R.sup.A is a divalent hydrocarbon group, R.sup.1 and R.sup.2 are alkyl groups, R.sup.3 and R.sup.4 are monovalent aliphatic hydrocarbon groups, R.sup.5 and R.sup.6 are aryl groups or the like, m is an integer of 0-20, n is an integer of 1-20, o is an integer of 0-20, and m+n+o is an integer of 1-30.
-Im-X-Im-  (3)
Im is a cyclic group including a cyclic imide structure, and X is a single bond or the like. (Bc) Heat-decomposable radical initiator (C) Solvent (D) Antioxidant (E) Fumed silica.

A polyamide resin composition having excellent low-temperature impact resistance and surface property, a polyamide resin composition for rotational molding and a rotational molded article using the same. The polyamide resin composition includes a component (A) in an amount of a parts by weight, which is an aliphatic polyamide having a relative viscosity ηr of less than 2.6 as measured according to JIS K6920 under the conditions of 96 wt % of sulfuric acid, 1 wt % of the polymer concentration, and 25° C.; a component (B) in an amount of b parts by weight, which is a modified polyolefin having a density of 0.895 g/cm.sup.3 or less as measured according to ASTM D1505; and a component (C) in an amount of c parts by weight, which is a non-modified polyolefin having an MFR value of 3.0 to 30 g/10 min as measured in a load of 2.16 kg at 190° C., and the polyamide resin composition satisfies the following equations: 50≤c/(b+c)×100≤70, and 10≤(b+c)/(a+b+c)×100≤40.

A polyamide resin composition having excellent low-temperature impact resistance and surface property, a polyamide resin composition for rotational molding and a rotational molded article using the same. The polyamide resin composition includes a component (A) in an amount of a parts by weight, which is an aliphatic polyamide having a relative viscosity ηr of less than 2.6 as measured according to JIS K6920 under the conditions of 96 wt % of sulfuric acid, 1 wt % of the polymer concentration, and 25° C.; a component (B) in an amount of b parts by weight, which is a modified polyolefin having a density of 0.895 g/cm.sup.3 or less as measured according to ASTM D1505; and a component (C) in an amount of c parts by weight, which is a non-modified polyolefin having an MFR value of 3.0 to 30 g/10 min as measured in a load of 2.16 kg at 190° C., and the polyamide resin composition satisfies the following equations: 50≤c/(b+c)×100≤70, and 10≤(b+c)/(a+b+c)×100≤40.

The present invention provides a resin composition for injection molding that can provide a molded body having excellent thermal stability, excellent thermal fluidity, and high water pressure resistance without a heavy metal such as lead or tin. The present invention also provides a molded body including the resin composition for injection molding. Provided is a resin composition for injection molding containing: a chlorinated polyvinyl chloride; polyvinyl chloride; and a thermal stabilizer, the thermal stabilizer containing a calcium alkyl carboxylate and a zinc compound, the polyvinyl chloride having a degree of polymerization of 400 to 1,000, the resin composition containing the polyvinyl chloride in an amount of 1 to 30 parts by mass relative to 100 parts by mass of the chlorinated polyvinyl chloride.

The present invention provides a resin composition for injection molding that can provide a molded body having excellent thermal stability, excellent thermal fluidity, and high water pressure resistance without a heavy metal such as lead or tin. The present invention also provides a molded body including the resin composition for injection molding. Provided is a resin composition for injection molding containing: a chlorinated polyvinyl chloride; polyvinyl chloride; and a thermal stabilizer, the thermal stabilizer containing a calcium alkyl carboxylate and a zinc compound, the polyvinyl chloride having a degree of polymerization of 400 to 1,000, the resin composition containing the polyvinyl chloride in an amount of 1 to 30 parts by mass relative to 100 parts by mass of the chlorinated polyvinyl chloride.

A gel composition is herein disclosed. According to one embodiment, the composition comprises a (i) a styrenic block copolymer, (ii) an oil; and (iii) optional additives; wherein the styrenic block copolymer has a structure ABi or iAB, wherein A is a monoalkenyl arene block, B is a conjugated diene block, and i is an isoprene attachment. The isoprene attachment i is substantially unsaturated and the conjugated diene block B is substantially saturated. The gel composition before curing exhibits thixotropic behavior, with a viscosity ranging from about 5000 mPa.Math.s to about 30000 mPa.Math.s. at 25° C. and a shear rate of 20 s.sup.−1.