A separation method for an adherend according to the present invention allows members to firmly bond to each other by recovery of adhesive force when a predetermined time elapses after a voltage has been applied and can easily separate the adherend by applying the voltage again, and a bonding method for an adherend according to the present invention allows members to firmly bond to each other by recovery of adhesive force when a predetermined time elapses after a voltage has been applied.

The invention relates to a pneumatic vehicle tire (1) of radial design having a carcass (4) and having components (9, 10) which adjoin the carcass (4), wherein thread-shaped elements (11) are arranged on at least one of the two surfaces of the carcass (4) and preferably serve to discharge occluded air between the carcass (4) and the adjoining components (9, 10) during the construction of the tire. In order to improve the electrical conductivity of the pneumatic vehicle tire (1), at least one thread-shaped element (11) has a coating which is electrically conductive and jointly forms an electrically conductive, thread-shaped element (12) which has an electrical resistance of <1×10.sup.7 Ohm/cm. The invention also relates to a method for manufacturing the electrically conductive coating.

To provide a film which is excellent in releasing property with respect to a resin sealed portion and excellent in low migration property and peeling property with respect to a semiconductor chip, a source electrode or a sealing glass and which is suitable as a mold release film for producing a semiconductor element having a part of the surface of a semiconductor chip, source electrode or sealing glass exposed. A film 1 which comprises a substrate 3 and an adhesive layer 5, wherein the storage elastic modulus at 180° C. of the substrate 3 is from 10 to 100 MPa, and the adhesive layer 5 is a reaction cured product of a composition for adhesive layer comprising a specific acrylic polymer and a polyfunctional isocyanate compound, wherein the number of moles M.sub.OH of hydroxy groups and the number of moles M.sub.COOH of carboxy groups, derived from the acrylic polymer, and the number of moles M.sub.NCO of isocyanate groups derived from the polyfunctional isocyanate compound, satisfy a specific relation, and which is suitable as a mold release film for producing a semiconductor element.

To provide a film which is excellent in releasing property with respect to a resin sealed portion and excellent in low migration property and peeling property with respect to a semiconductor chip, a source electrode or a sealing glass and which is suitable as a mold release film for producing a semiconductor element having a part of the surface of a semiconductor chip, source electrode or sealing glass exposed. A film 1 which comprises a substrate 3 and an adhesive layer 5, wherein the storage elastic modulus at 180° C. of the substrate 3 is from 10 to 100 MPa, and the adhesive layer 5 is a reaction cured product of a composition for adhesive layer comprising a specific acrylic polymer and a polyfunctional isocyanate compound, wherein the number of moles M.sub.OH of hydroxy groups and the number of moles M.sub.COOH of carboxy groups, derived from the acrylic polymer, and the number of moles M.sub.NCO of isocyanate groups derived from the polyfunctional isocyanate compound, satisfy a specific relation, and which is suitable as a mold release film for producing a semiconductor element.

Provided is a pressure-sensitive adhesive sheet for protecting a semiconductor element that appropriately protects a semiconductor wafer without reducing a yield. The pressure-sensitive adhesive sheet for protecting a semiconductor element includes: a pressure-sensitive adhesive layer; and a base material. The pressure-sensitive adhesive layer has a surface resistivity of 1.0×10.sup.11Ω/□ or less. After the pressure-sensitive adhesive layer and a silicon wafer have been bonded to each other, and have been left at rest at 50° C. for 24 hours, and the pressure-sensitive adhesive sheet has been peeled from the silicon wafer, a halogen element ratio with respect to a total element content of a surface of the silicon wafer that was bonded to the pressure-sensitive adhesive layer is 0.3 atomic % or less.

A resin composition for preventing fibers from unraveling according to the present invention comprises ethyl acrylate; poly acrylic amide; poly urethane; methyl acrylate; formaldehyde; antistatic agent; quaternary ammonium; maleic anhydride, and surfactant.

##STR00001##

A particulate material for powder bed fusion has specific particle size characteristics and includes a thermoplastic and a sulfonate salt having the structure (A), wherein Z is a phosphorus atom or a nitrogen atom; each occurrence of X is independently halogen or hydrogen provided that at least one X is halogen; b, d, and e are integers from zero to 12; c is 0 or 1 provided that when c is 1, d and e are not both zero; R.sup.11-13 are each independently C.sub.1-C.sub.12 hydrocarbyl; R.sup.14 is C.sub.1-C.sub.18 hydrocarbyl; and Y is selected from (B)—wherein R.sup.15 is hydrogen or C.sub.1-C.sub.12 hydrocarbyl. Also described is a method of powder bed fusion utilizing the particulate material.

There is provided an electrically peelable adhesive composition that is for forming an adhesive layer which has high adhesion and can be easily peeled off by applying a voltage for a short time even at a low voltage. In addition, there is provided an adhesive sheet including an adhesive layer formed of the composition that has high adhesion and can be easily peeled off by applying a voltage for a short time even at a low voltage, and a joined body of the adhesive sheet and an adherend. The electrically peelable adhesive composition of the invention includes a polymer and an ionic liquid, in which an anion of the ionic liquid is a bis(fluorosulfonyl)imide anion. A content of the ionic liquid is preferably 0.5 to 30 parts by weight with respect to 100 parts by weight of the polymer.

Provided herein is a pressure sensitive adhesive (PSA) that has balanced high shear and high peel strength. The PSA comprises a combination of epoxy and isocyanate crosslinkers and a polyacrylate tackifier.

In one embodiment, a composition comprising the reaction product of an olefin block copolymer, a silicone polymer, a blowing agent, and a crosslinking agent. Also, a unisole for an article of footwear comprising the foamed composition and having ground-engaging protrusions. The composition provides an optimized balance between coefficient of traction and durability.