Patent classifications
C08K5/05
CURING CATALYST USED FOR CURING OF POLYMER, MOISTURE CURABLE COMPOSITION,AND METHOD FOR PRODUCING CURED PRODUCT
When considering the prior art, the objective of the present invention is to provide a curing catalyst which is highly safe and has a curing rate suitable for practical use. According to the present invention, provided is a curing catalyst [B] which is used for curing a polymer [A] having a reactive hydrolyzable silicon-containing group, the curing catalyst [B] containing a metal alkoxide [B1] and an ammonium hydroxide [B2], wherein: the metal alkoxide [B1] includes one or both of a titanium compound [B1a] represented by chemical formula (1) and another metal alkoxide [B1b]; the another metal alkoxide [B1b] is an alkoxide of a metal other than titanium; and the ammonium hydroxide [B2] is represented by chemical formula (2).
CURING CATALYST USED FOR CURING OF POLYMER, PRODUCTION METHOD FOR SAID CURING CATALYST, MOISTURE-CURABLE COMPOSITION, AND PRODUCTION METHOD FOR CURED ARTICLE
The purpose of the present invention is to provide a curing catalyst that is highly stable and has a practical curing speed. The present invention provides a curing catalyst [B] used for curing a polymer [A] that has a reactive hydrolyzable silicon-containing group. The curing catalyst [B] contains the reaction products of a metal alkoxide [B1] and an ammonium hydroxide [B2]. The metal alkoxide [B1] includes one or both of a titanium compound [B1a] that is represented by chemical formula (1), and another metal alkoxide [B1b]. The other metal alkoxide [B1b] is an alkoxide of a metal other than titanium, and the ammonium hydroxide [B2] is represented by chemical formula (2).
CURING CATALYST USED FOR CURING OF POLYMER, PRODUCTION METHOD FOR SAID CURING CATALYST, MOISTURE-CURABLE COMPOSITION, AND PRODUCTION METHOD FOR CURED ARTICLE
The purpose of the present invention is to provide a curing catalyst that is highly stable and has a practical curing speed. The present invention provides a curing catalyst [B] used for curing a polymer [A] that has a reactive hydrolyzable silicon-containing group. The curing catalyst [B] contains the reaction products of a metal alkoxide [B1] and an ammonium hydroxide [B2]. The metal alkoxide [B1] includes one or both of a titanium compound [B1a] that is represented by chemical formula (1), and another metal alkoxide [B1b]. The other metal alkoxide [B1b] is an alkoxide of a metal other than titanium, and the ammonium hydroxide [B2] is represented by chemical formula (2).
CURABLE SILICONE RESIN COMPOSITION, SILICONE RESIN CURED MATERIAL, DAM MATERIAL, ENCAPSULANT, AND SEMICONDUCTOR DEVICE
The present invention is a curable silicone resin composition, the composition containing a linear organopolysiloxane, where the linear organopolysiloxane consists solely of a linear organopolysiloxane that has a less than 70% change rate of a contact angle of the linear organopolysiloxane to an Au substrate, the change rate being shown by the following expression (I): [{(contact angle of the linear organopolysiloxane to the Au substrate 2 seconds after dropping the linear organopolysiloxane)−(contact angle of the linear organopolysiloxane to the Au substrate 60 seconds after dropping the linear organopolysiloxane)}/(contact angle of the linear organopolysiloxane to the Au substrate 2 seconds after dropping the linear organopolysiloxane)]*100(%) (I). This provides a curable silicone resin composition that causes little contamination of surrounding members, and in which bleed-out hardly occurs.
CURABLE SILICONE RESIN COMPOSITION, SILICONE RESIN CURED MATERIAL, DAM MATERIAL, ENCAPSULANT, AND SEMICONDUCTOR DEVICE
The present invention is a curable silicone resin composition, the composition containing a linear organopolysiloxane, where the linear organopolysiloxane consists solely of a linear organopolysiloxane that has a less than 70% change rate of a contact angle of the linear organopolysiloxane to an Au substrate, the change rate being shown by the following expression (I): [{(contact angle of the linear organopolysiloxane to the Au substrate 2 seconds after dropping the linear organopolysiloxane)−(contact angle of the linear organopolysiloxane to the Au substrate 60 seconds after dropping the linear organopolysiloxane)}/(contact angle of the linear organopolysiloxane to the Au substrate 2 seconds after dropping the linear organopolysiloxane)]*100(%) (I). This provides a curable silicone resin composition that causes little contamination of surrounding members, and in which bleed-out hardly occurs.
CATHODIC ELECTROCOATING COMPOSITION HAVING REDUCED VOLATILE ORGANIC COMPOUNDS
A cathodic electrocoating composition having reduced volatile organic compounds includes: an epoxy resin comprising; a film forming binder, and a cross-linking agent; a pigment paste; water; and about 0.01 to about 10 percent by weight of an oxo-alcohol, based on a total weight of the composition, wherein the resin composition is free of glycol ethers.
SILICONE RELEASE COATING COMPOSITIONS
A release coating composition comprises (A) an organopolysiloxane containing at least two (2) ethylenically unsaturated groups, (B) an organopolysiloxane containing at least 2 Si—H groups per molecule, and (C) a hydrosilylation catalyst. If the organopolysiloxane (A) contains only 2 ethylenically unsaturated groups, the organopolysiloxane (B) contains on average more than 2 Si—H groups per molecule. The composition further comprises (D1) a hydrosilylation inhibitor comprising a maleimide of the general formula (I):
##STR00001##
In formula (I), A.sup.3 represents a hydrogen atom or a hydrocarbyl or substituted hydrocarbyl group having 1 to 18 carbon atoms, and A.sup.1 and A.sup.2 each represent a hydrogen atom or a hydrocarbyl or substituted hydrocarbyl group having 1 to 18 carbon atoms. The composition yet further comprises (D2) a second hydrosilylation inhibitor selected from acetylenic compounds, ethylenically unsaturated isocyanates, acetylenically unsaturated silanes and unsaturated dicarboxylic acid diesters or a maleate compound or a mixture thereof.
SILICONE RELEASE COATING COMPOSITIONS
A release coating composition comprises (A) an organopolysiloxane containing at least two (2) ethylenically unsaturated groups, (B) an organopolysiloxane containing at least 2 Si—H groups per molecule, and (C) a hydrosilylation catalyst. If the organopolysiloxane (A) contains only 2 ethylenically unsaturated groups, the organopolysiloxane (B) contains on average more than 2 Si—H groups per molecule. The composition further comprises (D1) a hydrosilylation inhibitor comprising a maleimide of the general formula (I):
##STR00001##
In formula (I), A.sup.3 represents a hydrogen atom or a hydrocarbyl or substituted hydrocarbyl group having 1 to 18 carbon atoms, and A.sup.1 and A.sup.2 each represent a hydrogen atom or a hydrocarbyl or substituted hydrocarbyl group having 1 to 18 carbon atoms. The composition yet further comprises (D2) a second hydrosilylation inhibitor selected from acetylenic compounds, ethylenically unsaturated isocyanates, acetylenically unsaturated silanes and unsaturated dicarboxylic acid diesters or a maleate compound or a mixture thereof.
SILICONE RELEASE COATING COMPOSITION AND METHODS FOR THE PREPARATION AND USE OF SAME
A silicone release coating composition and method for its preparation and use are described. A release coating prepared by curing the silicone release coating composition has high immediate release force (>50 g/in). A release liner including the release coating is suitable for use as a transfer liner in processes for making composites articles, such as aircraft parts.
SILICONE RELEASE COATING COMPOSITION AND METHODS FOR THE PREPARATION AND USE OF SAME
A silicone release coating composition and method for its preparation and use are described. A release coating prepared by curing the silicone release coating composition has high immediate release force (>50 g/in). A release liner including the release coating is suitable for use as a transfer liner in processes for making composites articles, such as aircraft parts.