A silicone pressure-sensitive adhesive composition is disclosed. The composition can be cured into a pressure-sensitive adhesive having a good release force against a release liner and a high peel force against several substrates. The silicone pressure-sensitive adhesive composition comprises: (A) a diorganopolysiloxane having on average at least 0.5 alkenyl groups with 2 to 12 carbon atoms per molecule; (B) an organopolysiloxane composed of R.sup.1.sub.3SiO.sub.1/2 and SiO.sub.4/2 units, wherein each R.sup.1 represents a monovalent hydrocarbon group with 1 to 12 carbon atoms, having a molar ratio (R.sup.1.sub.3SiO.sub.1/2 unit)/(SiO.sub.4/2 unit) of 0.6 to 1.7, and having a number average molecular weight (Mn) converted to standard polystyrene of from 1,700 to 3,000; (C) an organohydrogenpolysiloxane having on average at least two silicon-bonded hydrogen atoms per molecule; and (D) a hydrosilylation catalyst.

A silicone pressure-sensitive adhesive composition is disclosed. The composition can be cured into a pressure-sensitive adhesive having a good release force against a release liner and a high peel force against several substrates. The silicone pressure-sensitive adhesive composition comprises: (A) a diorganopolysiloxane having on average at least 0.5 alkenyl groups with 2 to 12 carbon atoms per molecule; (B) an organopolysiloxane composed of R.sup.1.sub.3SiO.sub.1/2 and SiO.sub.4/2 units, wherein each R.sup.1 represents a monovalent hydrocarbon group with 1 to 12 carbon atoms, having a molar ratio (R.sup.1.sub.3SiO.sub.1/2 unit)/(SiO.sub.4/2 unit) of 0.6 to 1.7, and having a number average molecular weight (Mn) converted to standard polystyrene of from 1,700 to 3,000; (C) an organohydrogenpolysiloxane having on average at least two silicon-bonded hydrogen atoms per molecule; and (D) a hydrosilylation catalyst.

An ink composition includes water, a resin, a coloring material, an alcohol (A) and a solvent (B). The alcohol (A) has a vapor pressure at 25° C. of 0.050 mmHg or greater and a solubility at 25° C. in 100 g of water of less than 3 g. The solvent (B) includes at least one selected from the group consisting of glycol ethers having a vapor pressure at 25° C. of less than 0.050 mmHg and a solubility at 25° C. in 100 g of water of 3 g or greater and alkanediols having a vapor pressure at 25° C. of less than 0.050 mmHg and a solubility at 25° C. in 100 g of water of 3 g or greater.

The present disclosure provides an adhesive composition. The adhesive composition contains (A) multi-stage latex polymer particles, (B) a linear diamine base, and (C) an ethoxylated surfactant. The (A) multi-stage latex polymer particles include (i) a first-stage polymer containing acrylic acid monomer and a first vinyl monomer, and (ii) a second-stage polymer containing a meth acrylic acid monomer and a second vinyl monomer, with the proviso that the second vinyl monomer is different than the meth acrylic acid monomer. The first-stage polymer is bound to the second-stage polymer.

The present disclosure provides an adhesive composition. The adhesive composition contains (A) multi-stage latex polymer particles, (B) a linear diamine base, and (C) an ethoxylated surfactant. The (A) multi-stage latex polymer particles include (i) a first-stage polymer containing acrylic acid monomer and a first vinyl monomer, and (ii) a second-stage polymer containing a meth acrylic acid monomer and a second vinyl monomer, with the proviso that the second vinyl monomer is different than the meth acrylic acid monomer. The first-stage polymer is bound to the second-stage polymer.

Presently described are bio-based hot-melt adhesive compositions including rosin acids or derivatives thereof and an amphiphilic agent that provide adhesives with a high softening point, improved heat resistance, low melt viscosity, and compatibility with hydrocarbon compositions including polyolefins and waxes used in hot-melt adhesives.

Presently described are bio-based hot-melt adhesive compositions including rosin acids or derivatives thereof and an amphiphilic agent that provide adhesives with a high softening point, improved heat resistance, low melt viscosity, and compatibility with hydrocarbon compositions including polyolefins and waxes used in hot-melt adhesives.

The present invention provides a conductive paste which leaves less fine undissolved matter when dissolved in an organic solvent and thus can be easily filtrated, which has excellent printability, and which can exhibit excellent surface smoothness after printing. Provided is a conductive paste used for forming an electrode of a multilayer ceramic capacitor, the conductive paste containing: a polyvinyl acetal resin; an organic solvent; and a conductive powder, the polyvinyl acetal resin having a wave number A (cm.sup.−1) of a peak within a range of 3,100 to 3,700 cm.sup.−1 in an IR absorption spectrum measured using an infrared spectrophotometer; and a hydroxy group content (mol %), the wavenumber A of the peak and the hydroxy group content satisfying relations of the following formulas (1) and (2):

[(3,470−A)/Hydroxy group content]≤5.0  (1)

(3,470−A)≤150  (2)

wherein A is a wavenumber which is lower than 3,470 cm.sup.−1 and at which a transmittance a (%) satisfying [100−(100−X)/2] is exhibited, where X (%) is s minimum transmittance of the peak within the wavenumber range of 3,100 to 3,700 cm.sup.−1.

The present invention provides a conductive paste which leaves less fine undissolved matter when dissolved in an organic solvent and thus can be easily filtrated, which has excellent printability, and which can exhibit excellent surface smoothness after printing. Provided is a conductive paste used for forming an electrode of a multilayer ceramic capacitor, the conductive paste containing: a polyvinyl acetal resin; an organic solvent; and a conductive powder, the polyvinyl acetal resin having a wave number A (cm.sup.−1) of a peak within a range of 3,100 to 3,700 cm.sup.−1 in an IR absorption spectrum measured using an infrared spectrophotometer; and a hydroxy group content (mol %), the wavenumber A of the peak and the hydroxy group content satisfying relations of the following formulas (1) and (2):

[(3,470−A)/Hydroxy group content]≤5.0  (1)

(3,470−A)≤150  (2)

wherein A is a wavenumber which is lower than 3,470 cm.sup.−1 and at which a transmittance a (%) satisfying [100−(100−X)/2] is exhibited, where X (%) is s minimum transmittance of the peak within the wavenumber range of 3,100 to 3,700 cm.sup.−1.

The present invention provides a conductive paste which leaves less fine undissolved matter when dissolved in an organic solvent and thus can be easily filtrated, which has excellent printability, and which can exhibit excellent surface smoothness after printing. Provided is a conductive paste used for forming an electrode of a multilayer ceramic capacitor, the conductive paste containing: a polyvinyl acetal resin; an organic solvent; and a conductive powder, the polyvinyl acetal resin having a wave number A (cm.sup.−1) of a peak within a range of 3,100 to 3,700 cm.sup.−1 in an IR absorption spectrum measured using an infrared spectrophotometer; and a hydroxy group content (mol %), the wavenumber A of the peak and the hydroxy group content satisfying relations of the following formulas (1) and (2):

[(3,470−A)/Hydroxy group content]≤5.0  (1)

(3,470−A)≤150  (2)

wherein A is a wavenumber which is lower than 3,470 cm.sup.−1 and at which a transmittance a (%) satisfying [100−(100−X)/2] is exhibited, where X (%) is s minimum transmittance of the peak within the wavenumber range of 3,100 to 3,700 cm.sup.−1.