In an antimicrobial substrate, a cured material of a binder containing a copper compound and a polymerization initiator is fixed onto a surface of a base material. At least a part of the copper compound is exposed on a surface of the cured material of the binder.

Provided is a resin composition which has good solubility and photocurability, further has good alkaline-developability when containing a photo initiator and a compound containing one or more carboxyl groups, and in addition, is capable of providing a resin sheet having suppressed tackiness; and a resin sheet, multilayer printed wiring board, and semiconductor device using the same. The resin composition of the present invention contains a particular bismaleimide compound (A), and at least two maleimide compounds (B) selected from the group consisting of six kinds of particular compounds which are different from this bismaleimide compound (A).

Acrylic and modacrylic fiber stabilized against sunlight The invention is related to increasing the resistance of acrylic fiber containing at least 85% acrylonitrile groups and modacrylic fibers containing at least 40% acrylonitrile groups and at least 40% vinylidene chloride groups, against UV light and surface heating caused by sunlight.

Acrylic and modacrylic fiber stabilized against sunlight The invention is related to increasing the resistance of acrylic fiber containing at least 85% acrylonitrile groups and modacrylic fibers containing at least 40% acrylonitrile groups and at least 40% vinylidene chloride groups, against UV light and surface heating caused by sunlight.

A package or container contains a biodegradable resin and a microcapsule including therein a decomposition accelerator for the biodegradable resin. The microcapsule includes an outer shell containing a resin composition having photodegradability.

A composition containing the following components: (a) a hydrosilylation catalyst comprising a metal-ligand complex, and (b) an inhibitor of the catalyst, wherein the inhibitor differs from the ligand of the metal-ligand complex and is represented by formula (I):

X—CHR—CO—Y  (I),

wherein —X represents —NO.sub.2, —S(═O)R, or R.sup.c.sub.2R.sup.aC—CO—; Y represents 2-furyl, —S(═O)R, —CN, —NO.sub.2, or —CR.sup.b.sub.xR.sup.d.sub.3-x; R.sup.a and R.sup.b is independently selected from the group consisting of —O—R, —O—CO—R, —CO—O—R, 2-furyl, —S(═O)R, —CN, —NO.sub.2, —F, —Cl, and —Br; each of R is independently selected from the group consisting of —H, optionally fluorinated C.sub.1-C.sub.8-alkyl, —F, —Cl, and —Br; each of R.sup.c and each of R.sup.d is independently selected from the group consisting of —H, optionally fluorinated C.sub.1-C.sub.8-alkyl, —F, —Cl, and —Br; and x is 0 or 1.

A composition containing the following components: (a) a hydrosilylation catalyst comprising a metal-ligand complex, and (b) an inhibitor of the catalyst, wherein the inhibitor differs from the ligand of the metal-ligand complex and is represented by formula (I):

X—CHR—CO—Y  (I),

wherein —X represents —NO.sub.2, —S(═O)R, or R.sup.c.sub.2R.sup.aC—CO—; Y represents 2-furyl, —S(═O)R, —CN, —NO.sub.2, or —CR.sup.b.sub.xR.sup.d.sub.3-x; R.sup.a and R.sup.b is independently selected from the group consisting of —O—R, —O—CO—R, —CO—O—R, 2-furyl, —S(═O)R, —CN, —NO.sub.2, —F, —Cl, and —Br; each of R is independently selected from the group consisting of —H, optionally fluorinated C.sub.1-C.sub.8-alkyl, —F, —Cl, and —Br; each of R.sup.c and each of R.sup.d is independently selected from the group consisting of —H, optionally fluorinated C.sub.1-C.sub.8-alkyl, —F, —Cl, and —Br; and x is 0 or 1.

Formaldehyde-free binder compositions are described that include an aldehyde or ketone, a reaction product between a polyamine and an organic anhydride, and an acidic compound. The acidic compound may be an organic acid, an acidic catalyst, or both. The acidic compound is supplied in quantities that lower the pH of the binder composition to about 5 or less. The binder compositions may be used in methods of binding fiberglass and the resulting fiberglass products have an improved tensile strength due to the addition of the acidic compound.

Formaldehyde-free binder compositions are described that include an aldehyde or ketone, a reaction product between a polyamine and an organic anhydride, and an acidic compound. The acidic compound may be an organic acid, an acidic catalyst, or both. The acidic compound is supplied in quantities that lower the pH of the binder composition to about 5 or less. The binder compositions may be used in methods of binding fiberglass and the resulting fiberglass products have an improved tensile strength due to the addition of the acidic compound.

A method of reducing the fouling in a process for the production of styrene, the method comprising: introducing an additive into a stream comprising styrene and byproduct divinyl benzene (DVB), wherein the additive comprises: at least one chemical compound comprising one or more functional groups selected from amines, alcohols, amino-alcohols, labile C—C, esters, carbamates, aldehydes, ketones, acids, acetates, benzoates, labile hydrogen, and combinations thereof, and having a boiling point greater than or equal to 170° C. and within 10, 20, 30, 40, 50, or 60° C. of the boiling point of divinyl benzene (DVB) (which is 195° C.), wherein the at least one chemical compound is active to inhibit divinyl benzene (DVB) crosslinking. A system for carrying out the method is also provided.