A process of forming a cross-linked electronically active hydrophilic co-polymer is provided and includes the steps of: a. mixing an intrinsically electronically active material and at least one compound of formula (I) with water to form an intermediate mixture; b. adding at least one hydrophilic monomer, at least one hydrophobic monomer, and at least one cross-linker to the intermediate mixture to form a co-monomer mixture; and c. polymerising the co-monomer mixture. Formula (I) is defined as: ##STR00001##
where R.sup.1 and R.sup.2 are independently optionally substituted C.sub.1-C.sub.6 alkyl and X.sup.− is an anion.

A process of forming a cross-linked electronically active hydrophilic co-polymer is provided and includes the steps of: a. mixing an intrinsically electronically active material and at least one compound of formula (I) with water to form an intermediate mixture; b. adding at least one hydrophilic monomer, at least one hydrophobic monomer, and at least one cross-linker to the intermediate mixture to form a co-monomer mixture; and c. polymerising the co-monomer mixture. Formula (I) is defined as: ##STR00001##
where R.sup.1 and R.sup.2 are independently optionally substituted C.sub.1-C.sub.6 alkyl and X.sup.− is an anion.

The present invention provides a methacrylic resin composition comprising 100 parts by mass of a methacrylic resin comprising 50 to 97% by mass of a methacrylic acid ester monomer unit (A), 3 to 30% by mass of a structural unit (B) having a ring structure in the backbone, and 0 to 20% by mass of an additional vinyl monomer unit (C) copolymerizable with a methacrylic acid ester monomer, and 0.001 to 0.2 parts by mass of a compound (D) having a predetermined structure, the methacrylic resin composition satisfying the following conditions (I) and (II):
(I): a weight-average molecular weight of the methacrylic resin composition as measured by gel permeation chromatography (GPC) is 65,000 to 300,000, and
(II): a mass ratio between the component (D) and the structural unit (B) having a ring structure in the backbone is 25≤(B)/(D)≤1000.

The present invention provides a methacrylic resin composition comprising 100 parts by mass of a methacrylic resin comprising 50 to 97% by mass of a methacrylic acid ester monomer unit (A), 3 to 30% by mass of a structural unit (B) having a ring structure in the backbone, and 0 to 20% by mass of an additional vinyl monomer unit (C) copolymerizable with a methacrylic acid ester monomer, and 0.001 to 0.2 parts by mass of a compound (D) having a predetermined structure, the methacrylic resin composition satisfying the following conditions (I) and (II):
(I): a weight-average molecular weight of the methacrylic resin composition as measured by gel permeation chromatography (GPC) is 65,000 to 300,000, and
(II): a mass ratio between the component (D) and the structural unit (B) having a ring structure in the backbone is 25≤(B)/(D)≤1000.

Provided is a pressure-sensitive adhesive sheet that can temporarily fix an adherend in a peelable manner, the pressure-sensitive adhesive sheet being free from requiring the application of high-output laser light at the time of the peeling of the adherend and being capable of eliminating the need for a step of washing the adherend after the peeling. The pressure-sensitive adhesive sheet of the present invention includes a pressure-sensitive adhesive layer containing a UV absorber and an active energy ray-curable pressure-sensitive adhesive, wherein the pressure-sensitive adhesive sheet has a transmittance of 50% or less for light having a wavelength of 355 nm. In one embodiment, the pressure-sensitive adhesive layer has a thickness of 20 μm or less. In one embodiment, the pressure-sensitive adhesive sheet has a visible light transmittance of 50% or more.

The present disclosure relates to a curing agent, an adhesive composition for a semiconductor device containing the curing agent, the adhesive composition exhibiting excellent adhesive strength and having excellent reliability because of being inhibited from cracking, an adhesive film for a semiconductor device, and a semiconductor package including the same.

The present disclosure relates to a curing agent, an adhesive composition for a semiconductor device containing the curing agent, the adhesive composition exhibiting excellent adhesive strength and having excellent reliability because of being inhibited from cracking, an adhesive film for a semiconductor device, and a semiconductor package including the same.

An anti-ozone protective composition for a crosslinked rubber article; is based on at least one chlorinated elastomer, at least one hydrocarbon solvent and at least one polar aprotic solvent. A rubber article comprises at least one elastomeric surface in contact with air, said surface being completely or partly coated with said composition.

An anti-ozone protective composition for a crosslinked rubber article; is based on at least one chlorinated elastomer, at least one hydrocarbon solvent and at least one polar aprotic solvent. A rubber article comprises at least one elastomeric surface in contact with air, said surface being completely or partly coated with said composition.

A material for three-dimensional printing including at least one of a functionalized silicone polymer, a functionalized silica particle, or a combination thereof; wherein the functionalized silicone polymer is functionalized with a member of the group consisting of a carboxylic acid, an amine, and combinations thereof; and wherein the functionalized silica particle is functionalized with a member of the group consisting of a carboxylic acid, an amine, and combinations thereof. A process for preparing the three-dimensional printing material. A process for three-dimensional printing use of the material.