The present invention provides a polyamide composite, including the following components: 20 to 80 parts of a polyamide resin; 1 to 30 parts of a red phosphorus flame retardant; 0.01 to 10 parts of trimethallyl isocyanurate; and the polyamide composite has a cross-linked structure between polyamide molecules. By adding trimethallyl isocyanurate (TMAIC) for irradiation cross-linking treatment, and by the red phosphorus flame retardant, not only the polyamide composite can meet the needs of flame retardant, but also glow-wire ignition temperature (GWIT) and comparative tracking index (CTI) have been improved.

The present invention provides a water-soluble polymer composition which is suppressed in decrease of the viscosity over time if formed into an aqueous solution that contains iron ions. A water-soluble polymer composition which contains a water-soluble polymer, a phenolic antioxidant and an inorganic salt other than a transition metal salt, wherein the content of the inorganic salt is from 0.001 part by mass to 10 parts by mass relative to 100 parts by mass of the water-soluble polymer.

The present invention provides a water-soluble polymer composition which is suppressed in decrease of the viscosity over time if formed into an aqueous solution that contains iron ions. A water-soluble polymer composition which contains a water-soluble polymer, a phenolic antioxidant and an inorganic salt other than a transition metal salt, wherein the content of the inorganic salt is from 0.001 part by mass to 10 parts by mass relative to 100 parts by mass of the water-soluble polymer.

The present invention provides a water-soluble polymer composition which is suppressed in decrease of the viscosity over time if formed into an aqueous solution that contains iron ions. A water-soluble polymer composition which contains a water-soluble polymer, a phenolic antioxidant and an inorganic salt other than a transition metal salt, wherein the content of the inorganic salt is from 0.001 part by mass to 10 parts by mass relative to 100 parts by mass of the water-soluble polymer.

Provided is a curable resin composition for obtaining a cured product that can satisfy both high heat resistance and high adhesiveness to metal, a cured product thereof, and methods of producing the curable resin composition and the cured product, and a semiconductor device using the cured product as a sealant. A curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, (D) a triazole-based compound, and optionally (E) a curing accelerator and (F) an inorganic filler, a cured product thereof, and methods of producing the curable resin composition and the cured product. A semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

Provided is a curable resin composition for obtaining a cured product that can satisfy both high heat resistance and high adhesiveness to metal, a cured product thereof, and methods of producing the curable resin composition and the cured product, and a semiconductor device using the cured product as a sealant. A curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, (D) a triazole-based compound, and optionally (E) a curing accelerator and (F) an inorganic filler, a cured product thereof, and methods of producing the curable resin composition and the cured product. A semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

The present disclosure is drawn to food contact compliant three-dimensional printing kits, materials, compositions, systems, and methods. In one example, a multi-fluid kit of food contact compliant agents for three-dimensional printing can include a food contact compliant fusing agent and a food contact compliant detailing agent. The food contact compliant fusing agent can include from about 70 wt% to about 96 wt% water, from about 3 wt% to about 10 wt% by solids weight of a food contact compliant carbon black dispersion, and from about 1 wt% to about 25 wt% of a food contact compliant water-soluble first co-solvent. The food contact compliant detailing agent can include from about 75 wt % to about 99 wt% water and from about 0.01 wt% to about 1 wt% of a food contact compliant chelating compound.

This invention relates to a curative composition and its use in curing epoxy resins and prepregs, adhesives and moulded materials derived therefrom. The curative composition comprises a clathrate comprising a host component and a guest component, the host comprising a carboxylic acid or ester compounds as defined or phenolphthalin and the guest comprising an imidazole or imidazoline component.

This invention relates to a curative composition and its use in curing epoxy resins and prepregs, adhesives and moulded materials derived therefrom. The curative composition comprises a clathrate comprising a host component and a guest component, the host comprising a carboxylic acid or ester compounds as defined or phenolphthalin and the guest comprising an imidazole or imidazoline component.

The invention concerns a stabilising composition, comprising: at least one antioxidant comprising one or more of: a phenolic antioxidant, a phosphite antioxidant, a sulphur-containing antioxidant, and an aminic antioxidant; and at least one buffering agent, wherein the buffering agent has the capacity to buffer in aqueous solution at a pH range from 4 to 8.