Patent classifications
C08K5/13
POLYCARBONATE COMPOSITION AND MOLDED ARTICLES THEREOF
The present disclosure relates to a polycarbonate composition. The polycarbonate composition is a composition in which polyalkylene glycol end-capped with a specific compound is blended in polycarbonate together with two specific antioxidants in a predetermined amount, and can provide a molded article which has high light transmittance, is transparent and particularly has excellent long-term color stability.
POLYCARBONATE COMPOSITION AND MOLDED ARTICLES THEREOF
The present disclosure relates to a polycarbonate composition. The polycarbonate composition is a composition in which polyalkylene glycol end-capped with a specific compound is blended in polycarbonate together with two specific antioxidants in a predetermined amount, and can provide a molded article which has high light transmittance, is transparent and particularly has excellent long-term color stability.
ACID-FUNCTIONALIZED COPOLYMERS OF METHYL METHACRYLATE AND ACRYLIC RESIN COMPOSITIONS BASED THEREON
Acid-functionalized copolymers of methyl methacrylate having relatively high glass transition temperatures and molecular weights may be employed to manufacture articles having high light transmission values, low haze, high heat resistance, and high environmental stability, which are useful as optical protection films, zero-zero optical retardation films, and compensation films as well as lighting pipes and optical imaging lenses.
CURABLE RESIN COMPOSITION AND DISPLAY DEVICE
A curable resin composition contains quantum dots (A), a resin (B), a photopolymerizable compound (C), a photopolymerization initiator (D), an antioxidant (E), a leveling agent (F), and a solvent (G), wherein the resin (B) has a weight-average molecular weight in terms of polystyrene of less than 10000 and an acid value of 90 mg KOH/g or more and 150 mg KOH/g or less.
CURABLE RESIN COMPOSITION AND DISPLAY DEVICE
A curable resin composition contains quantum dots (A), a resin (B), a photopolymerizable compound (C), a photopolymerization initiator (D), an antioxidant (E), a leveling agent (F), and a solvent (G), wherein the resin (B) has a weight-average molecular weight in terms of polystyrene of less than 10000 and an acid value of 90 mg KOH/g or more and 150 mg KOH/g or less.
THERMOSETTING RESIN COMPOSITION AND PREPREG
A thermosetting resin composition and a prepreg are provided. The thermosetting resin composition includes a maleimide resin, a cyanate ester resin, and a crosslinking agent. The crosslinking agent is a silane-modified diallyl bisphenol compound whose structure is represented by Formula (1):
##STR00001##
In Formula (1), X is a linear or branched C1 to C6 alkyl, cycloalkyl, or sulfonyl group, R1 is a linear or branched C1 to C6 alkyl or aryl group, R2 is a C1 to C6 alkyl group, R3 is a functional group with a crosslinkable double bond, and n+m is a positive integer from 1 to 8.
THERMOSETTING RESIN COMPOSITION AND PREPREG
A thermosetting resin composition and a prepreg are provided. The thermosetting resin composition includes a maleimide resin, a cyanate ester resin, and a crosslinking agent. The crosslinking agent is a silane-modified diallyl bisphenol compound whose structure is represented by Formula (1):
##STR00001##
In Formula (1), X is a linear or branched C1 to C6 alkyl, cycloalkyl, or sulfonyl group, R1 is a linear or branched C1 to C6 alkyl or aryl group, R2 is a C1 to C6 alkyl group, R3 is a functional group with a crosslinkable double bond, and n+m is a positive integer from 1 to 8.
POLYESTER RESIN COMPOSITION, POLYESTER FILM, AND LAMINATE FOR ELECTRONIC DEVICE
The present disclosure relates to a polyester resin composition including a polyester resin including a diol residue and a dicarboxylic acid residue, wherein the diol residue includes a cyclohexanedimethanol residue and the dicarboxylic acid residue includes an isophthalic acid residue and a terephthalic acid residue, wherein an amount of the isophthalic acid residue is 0 to 20 mol % when a total amount of the dicarboxylic acid residue is considered as 100 mol %, wherein an amount of the cyclohexanedimethanol residue is 50 to 100 mol % when a total amount of the diol residue is considered as 100 mol %, wherein the polyester resin composition includes an antioxidant, and wherein the antioxidant includes a phenol-based antioxidant, a phosphorus-based antioxidant, and a sulfur-based antioxidant.
Thermosetting powder coating compositions having lower chalk-free temperature
Thermosetting powder coating compositions and processes for making the thermosetting powder coating compositions and processes for coating an article with the thermosetting powder coating compositions are disclosed. Cured thermosetting powder coating compositions are obtained by curing of the thermosetting powder coating compositions of the invention. Articles are provided having coated thereon the thermosetting powder coating compositions as well as to articles having coated and cured thereon the thermosetting powder coating compositions. The thermosetting powder coating compositions exhibit a substantially lower T.sub.chalk-free, that is a ΔT.sub.chalk-free which is in the range of from and including 5 up to and not including 10° C., wherein ΔT.sub.chalk-free=T.sub.chalk-free.sup.REF−T.sub.chalk-free.sup.A where T.sub.chalk-free.sup.A is the T.sub.chalk-free of a thermosetting powder coating composition according to the invention (TPCC-A) and T.sub.chalk-free.sup.REF is the T.sub.chalk-free of a thermosetting powder coating composition not according to the invention (TPCC-REF) that is comparable to TPCC-A.
Thermosetting powder coating compositions having lower chalk-free temperature
Thermosetting powder coating compositions and processes for making the thermosetting powder coating compositions and processes for coating an article with the thermosetting powder coating compositions are disclosed. Cured thermosetting powder coating compositions are obtained by curing of the thermosetting powder coating compositions of the invention. Articles are provided having coated thereon the thermosetting powder coating compositions as well as to articles having coated and cured thereon the thermosetting powder coating compositions. The thermosetting powder coating compositions exhibit a substantially lower T.sub.chalk-free, that is a ΔT.sub.chalk-free which is in the range of from and including 5 up to and not including 10° C., wherein ΔT.sub.chalk-free=T.sub.chalk-free.sup.REF−T.sub.chalk-free.sup.A where T.sub.chalk-free.sup.A is the T.sub.chalk-free of a thermosetting powder coating composition according to the invention (TPCC-A) and T.sub.chalk-free.sup.REF is the T.sub.chalk-free of a thermosetting powder coating composition not according to the invention (TPCC-REF) that is comparable to TPCC-A.