Patent classifications
C08K5/14
Perfluoro diacyl peroxide as polymerization initiator and polymer preparation method
A perfluorodiacyl peroxide represented by the following formula (1):
(C.sub.5F.sub.11COO).sub.2 (1).
Also disclosed is a solution containing the perfluorodiacyl peroxide, a polymerization initiator containing the perfluorodiacyl peroxide, a method for producing a polymer which includes polymerizing a radically polymerizable monomer with the perfluorodiacyl peroxide, and a perfluoroacyl chloride represent by the following formula (2):
C.sub.5F.sub.11COCl (2).
Silicone composition
Provided is a silicone composition that has high thermal conductivity and favorable adhesion. A silicone composition that contains (A) 50-99.9 parts by mass of an organopolysiloxane that has at least two aliphatic unsaturated hydrocarbon groups per molecule thereof and has a kinematic viscosity of 60-100,000 mm.sup.2/s at 25° C., (B) 0.1-50 parts by mass of a silicone resin that has at least one aliphatic unsaturated hydrocarbon group per molecule thereof (provided that the total of components (A) and (B) is 100 parts by mass), (C) an organohydrogen polysiloxane, (D) 0.01-10.0 parts by mass of an organic peroxide that has a ten-hour half-life temperature of at least 40° C. per 100 total parts by mass of components (A) and (B), and (E) 100-3,000 parts by mass of a thermally conductive filler that has a thermal conductivity of at least 10 W/(m.Math.° C.) per 100 total parts by mass of components (A) and (B).
Silicone composition
Provided is a silicone composition that has high thermal conductivity and favorable adhesion. A silicone composition that contains (A) 50-99.9 parts by mass of an organopolysiloxane that has at least two aliphatic unsaturated hydrocarbon groups per molecule thereof and has a kinematic viscosity of 60-100,000 mm.sup.2/s at 25° C., (B) 0.1-50 parts by mass of a silicone resin that has at least one aliphatic unsaturated hydrocarbon group per molecule thereof (provided that the total of components (A) and (B) is 100 parts by mass), (C) an organohydrogen polysiloxane, (D) 0.01-10.0 parts by mass of an organic peroxide that has a ten-hour half-life temperature of at least 40° C. per 100 total parts by mass of components (A) and (B), and (E) 100-3,000 parts by mass of a thermally conductive filler that has a thermal conductivity of at least 10 W/(m.Math.° C.) per 100 total parts by mass of components (A) and (B).
Silicone composition
Provided is a silicone composition that has high thermal conductivity and favorable adhesion. A silicone composition that contains (A) 50-99.9 parts by mass of an organopolysiloxane that has at least two aliphatic unsaturated hydrocarbon groups per molecule thereof and has a kinematic viscosity of 60-100,000 mm.sup.2/s at 25° C., (B) 0.1-50 parts by mass of a silicone resin that has at least one aliphatic unsaturated hydrocarbon group per molecule thereof (provided that the total of components (A) and (B) is 100 parts by mass), (C) an organohydrogen polysiloxane, (D) 0.01-10.0 parts by mass of an organic peroxide that has a ten-hour half-life temperature of at least 40° C. per 100 total parts by mass of components (A) and (B), and (E) 100-3,000 parts by mass of a thermally conductive filler that has a thermal conductivity of at least 10 W/(m.Math.° C.) per 100 total parts by mass of components (A) and (B).
LOW-TEMPERATURE-CURABLE CROSS-SECTION REPAIR MATERIAL, AND CROSS-SECTION REPAIRING METHOD USING THE SAME
Provided is a low-temperature-curable cross-section repair material which can be cured in a short period of time, even in extremely low temperature environments of −25° C., and which exhibits excellent workability and strength development. Also provided is a cross-section repairing method using the same. The low-temperature-curable cross-section repair material is characterized by: comprising 100 parts by of a radical polymerizable resin composition (A), 0.1-10 parts by of a hydroxyl group-containing aromatic tertiary amine (C-1), 0.1-10 parts by of an organic peroxide (D), and 1.0-500 parts by of an inorganic filler (E); and the radical polymerizable resin composition (A) comprising at least one type of radical polymerizable resin (A-1) selected from the group consisting of vinyl ester resins, urethane (meth)acrylate resins and polyester (meth)acrylate resins, and a radical polymerizable unsaturated monomer (A-2) having at least two or more (meth)acryloyl groups per molecule thereof.
ANTISEPTIC POLYMETHYLMETHACRYLATE BONE CEMENT
An antiseptic composition for use as bone cement, in particular an antiseptic polymethylmethacrylate bone cement. The composition can be cured and comprises a pharmacologically tolerable salt of a monoperoxy dicarboxylic acid, whereby the salt of the monoperoxy dicarboxylic acid can be dissolved from the composition in the presence of water. Preferably, the salt of the monoperoxy dicarboxylic acid in the composition is used in the form of a powder, whereby the powder has a mean particle size of not more than 250 μm. Preferably, the salt of the monoperoxy dicarboxylic acid, in solution at room temperature, is not degraded within 5 min by the catalase enzyme.
ANTISEPTIC POLYMETHYLMETHACRYLATE BONE CEMENT
An antiseptic composition for use as bone cement, in particular an antiseptic polymethylmethacrylate bone cement. The composition can be cured and comprises a pharmacologically tolerable salt of a monoperoxy dicarboxylic acid, whereby the salt of the monoperoxy dicarboxylic acid can be dissolved from the composition in the presence of water. Preferably, the salt of the monoperoxy dicarboxylic acid in the composition is used in the form of a powder, whereby the powder has a mean particle size of not more than 250 μm. Preferably, the salt of the monoperoxy dicarboxylic acid, in solution at room temperature, is not degraded within 5 min by the catalase enzyme.
Polymer composition comprising a polyethylene
The invention relates to a polymer composition comprising a polyethylene and a crosslinking agent, wherein the polymer composition contains a total amount of vinyl groups which is B vinyl groups per 1000 carbon atoms, and B.sub.1≤B, wherein B.sub.1 is 0.88, when measured prior to crosslinking according to method ASTM D624898; and wherein the crosslinking agent is present in an amount which Z wt %, based on the total amount (100 wt %) of the polymer composition, and Z≤Z.sub.2, wherein Z.sub.2 is 0.60, an article being e.g. a cable, e.g. a power cable, and processes for producing a polymer composition and an article; useful in different end applications, such as wire and cable (W&C) applications.
Polymer composition comprising a polyethylene
The invention relates to a polymer composition comprising a polyethylene and a crosslinking agent, wherein the polymer composition contains a total amount of vinyl groups which is B vinyl groups per 1000 carbon atoms, and B.sub.1≤B, wherein B.sub.1 is 0.88, when measured prior to crosslinking according to method ASTM D624898; and wherein the crosslinking agent is present in an amount which Z wt %, based on the total amount (100 wt %) of the polymer composition, and Z≤Z.sub.2, wherein Z.sub.2 is 0.60, an article being e.g. a cable, e.g. a power cable, and processes for producing a polymer composition and an article; useful in different end applications, such as wire and cable (W&C) applications.
Crosslinkable composition without antioxidant and beneficial methane formation with reduced crosslinking
The invention relates to a polymer composition comprising a polyethylene and a crosslinking agent, characterized in that the polymer composition contains a total amount of vinyl groups which is B vinyl groups per 1000 carbon atoms, and B.sub.1≤B, wherein B.sub.1 is 0.88, when measured prior to crosslinking according to method ASTM D6248-98; and in that the crosslinking agent is present in an amount which is Z wt %, based on the total amount (100 wt %) of the polymer composition, and Z≤Z.sub.2, wherein Z.sub.2 is 0.30, an article being e.g. a cable, e.g. a power cable, and processes for producing a polymer composition and an article; useful in different end applications, such as wire and cable (W&C) applications.