The invention provides protein adhesives, and methods of making and using such adhesives. The protein adhesives contain a protein-bonding agent and plant protein composition, such as an isolated water-soluble protein fraction or ground plant meal obtained from plant biomass. The protein-bonding agent can be an anhydride compound, carboxylic acid compound, carboxylate salt compound, or combinations thereof. The protein adhesives are useful in bonding together lignocellulosic materials and other types of materials.

A film includes a vinyl chloride-based resin, a modified epoxidized vegetable oil having a multimer mass content of 5 to 50 %, an aliphatic dibasic acid ester-based compound with not more than 10 carbon atoms having a molecular weight-average of 200 to 1000, and a polyester-based compound having a molecular weight-average of 3000 to 10000, in which a mixture of the modified epoxidized vegetable oil and the aliphatic dibasic acid ester-based compound is compounded in a mass ratio of 30 to 50 parts based on 100 parts of the vinyl chloride-based resin, a content of the modified epoxidized vegetable oil in the mixture of the modified epoxidized vegetable oil and the aliphatic dibasic acid ester-based compound is 30 to 70 % by mass, and the polyester-based compound is compounded in a mass ratio of 5 to 15 parts based on 100 parts of the vinyl chloride-based resin.

Process for functionalizing an ethylene-based (co)polymer comprising the step of contacting an ethylene-based (co)polymer at a temperature in the range 100-250 C. with an azide of formula (I) wherein Y is either (Ia) or (Ib) m is 0 or 1, n is 0 or 1, n+m=1 or 2, and X is a linear or branched, aliphatic or aromatic hydrocarbon moiety with 1-12 carbon atoms, optionally containing heteroatoms. ##STR00001##

Process for functionalizing an ethylene-based (co)polymer comprising the step of contacting an ethylene-based (co)polymer at a temperature in the range 100-250 C. with an azide of formula (I) wherein Y is either (Ia) or (Ib) m is 0 or 1, n is 0 or 1, n+m=1 or 2, and X is a linear or branched, aliphatic or aromatic hydrocarbon moiety with 1-12 carbon atoms, optionally containing heteroatoms. ##STR00001##

Process for functionalizing an ethylene-based (co)polymer comprising the step of contacting an ethylene-based (co)polymer at a temperature in the range 100-250 C. with an azide of formula (I) wherein Y is either (Ia) or (Ib) m is 0 or 1, n is 0 or 1, n+m=1 or 2, and X is a linear or branched, aliphatic or aromatic hydrocarbon moiety with 1-12 carbon atoms, optionally containing heteroatoms. ##STR00001##

Compositions comprising complexes of 1-methylcyclopropene and -cyclodextrin, and articles including the composition, are provided. Methods for using the compositions and articles in delaying the maturation of fruits, vegetables, and plants are also provided.

Compositions comprising complexes of 1-methylcyclopropene and -cyclodextrin, and articles including the composition, are provided. Methods for using the compositions and articles in delaying the maturation of fruits, vegetables, and plants are also provided.

An adhesive agent having excellent bonding properties with oxide films and excellent heat-dissipation properties and a connection structure using the same. The adhesive agent contains an epoxy compound, a cationic catalyst, and an acrylic resin containing acrylic acid and acrylic acid ester having a hydroxyl group. Acrylic acid in the acrylic resin reacts with the epoxy compound to generate connections between an island of acrylic resin and a sea of epoxy compound and roughen the surface of an oxide film to improve an anchor effect with the sea of epoxy compound; solder particles contained in the adhesive agent are melted to form metal bonding with an electrode, thereby enabling improvement in adhesive strength between the adhesive agent and the electrode and further improving heat dissipation from a surface of the metal bonding.

An adhesive agent having excellent bonding properties with oxide films and excellent heat-dissipation properties and a connection structure using the same. The adhesive agent contains an epoxy compound, a cationic catalyst, and an acrylic resin containing acrylic acid and acrylic acid ester having a hydroxyl group. Acrylic acid in the acrylic resin reacts with the epoxy compound to generate connections between an island of acrylic resin and a sea of epoxy compound and roughen the surface of an oxide film to improve an anchor effect with the sea of epoxy compound; solder particles contained in the adhesive agent are melted to form metal bonding with an electrode, thereby enabling improvement in adhesive strength between the adhesive agent and the electrode and further improving heat dissipation from a surface of the metal bonding.

Compound of Formula (1); wherein: Z.sup.w is an organic radical comprising w amino groups, in which w is a number and 5w3,000; A and B are independently oxy-C.sub.1-C.sub.20-alkylene carbonyl groups or oxy-C.sub.2-C.sub.20-alkenylene carbonyl groups derived from hydroxy carboxylic acids or lactones; T is hydrogen or RCO, where R is a C.sub.1-C.sub.50 hydrocarbyl group; Y is a C.sub.3-C.sub.4-alkylene radical linked to an amino group of Z.sup.w; Y is an ionic salt link between an amino group of Z.sup.w and the terminal carbonyl of (A).sub.r-(B).sub.p-T; r and p are independently numbers between 0 and 50 and r+p>2; s, m and v are numbers; 0.99ws+m2w; and 0.3ws+v2w are suitable as dispersants and milling aids. ##STR00001##