A curable composition containing an alkenyl phenol A, an epoxy-modified silicone B, and an epoxy compound C other than the epoxy-modified silicone B.

A curable composition containing an alkenyl phenol A, an epoxy-modified silicone B, and an epoxy compound C other than the epoxy-modified silicone B.

The two-part curable composition has excellent curability, and exhibits flexibility and adhesion durability. The two-part curable composition includes a first reagent containing at least a 2-cyanoacrylic acid ester and a second reagent containing at least a polymer having a hydrolyzable silyl group, in which an elastomer and a curing catalyst for the above polymer are each contained in at least one of the first and second reagents in predetermined amounts. A preferable curing catalyst is a compound having a metal element and an organic group bonded to the metal element via oxygen, or an acid having a pKa of 4 or lower at 25° C. Preferably, a curing accelerator for 2-cyanoacrylic acid ester is contained in at least one of the first and second reagents.

The two-part curable composition has excellent curability, and exhibits flexibility and adhesion durability. The two-part curable composition includes a first reagent containing at least a 2-cyanoacrylic acid ester and a second reagent containing at least a polymer having a hydrolyzable silyl group, in which an elastomer and a curing catalyst for the above polymer are each contained in at least one of the first and second reagents in predetermined amounts. A preferable curing catalyst is a compound having a metal element and an organic group bonded to the metal element via oxygen, or an acid having a pKa of 4 or lower at 25° C. Preferably, a curing accelerator for 2-cyanoacrylic acid ester is contained in at least one of the first and second reagents.

The present invention provides a resin composition for a printed wiring board comprising a cyanate compound (A) represented by following general formula (1):

##STR00001##

wherein n represents an integer of 1 or more; and an epoxy resin (B).

Described herein are fluoropolymer compositions comprising a compound of Formula I wherein X.sup.1 is selected from O or S; L is a divalent linking group comprising at least one aromatic ring; and X.sup.2 is selected from the group consisting of a hydroxyl group, an amino group, a thiol group, and a nitrile group. In one embodiment, the phthalonitrile-containing compound is used to crosslink a dehydrohalogenated polymer, and optionally with a polyhydroxy curative. In another embodiment, the phthalonitrile-containing compound is added to a composition comprising (i) a fluorinated elastomeric gum, wherein the fluorinated elastomeric gum comprises a fluoropolymer having a cure-site and (ii) a peroxide curing system. ##STR00001##

Described herein are fluoropolymer compositions comprising a compound of Formula I wherein X.sup.1 is selected from O or S; L is a divalent linking group comprising at least one aromatic ring; and X.sup.2 is selected from the group consisting of a hydroxyl group, an amino group, a thiol group, and a nitrile group. In one embodiment, the phthalonitrile-containing compound is used to crosslink a dehydrohalogenated polymer, and optionally with a polyhydroxy curative. In another embodiment, the phthalonitrile-containing compound is added to a composition comprising (i) a fluorinated elastomeric gum, wherein the fluorinated elastomeric gum comprises a fluoropolymer having a cure-site and (ii) a peroxide curing system. ##STR00001##

Described herein are fluoropolymer compositions comprising a compound of Formula I wherein X.sup.1 is selected from O or S; L is a divalent linking group comprising at least one aromatic ring; and X.sup.2 is selected from the group consisting of a hydroxyl group, an amino group, a thiol group, and a nitrile group. In one embodiment, the phthalonitrile-containing compound is used to crosslink a dehydrohalogenated polymer, and optionally with a polyhydroxy curative. In another embodiment, the phthalonitrile-containing compound is added to a composition comprising (i) a fluorinated elastomeric gum, wherein the fluorinated elastomeric gum comprises a fluoropolymer having a cure-site and (ii) a peroxide curing system. ##STR00001##

Provided are: a retardation-increasing agent that has excellent compatibility and, when incorporated into a resin film, is capable of not only adjusting the thickness-direction phase difference toward a positive direction but also imparting the film with high retardation; a cellulose-based resin composition comprising the retardation-increasing agent; and a film that is obtained from the cellulose-based resin composition and has excellent optical properties. The retardation-increasing agent comprises a compound represented by the following Formula (1) or (2):

##STR00001## (wherein, R.sup.1 to R.sup.10 each independently represent a hydrogen atom or the like); or

##STR00002## (wherein, R.sup.21 to R.sup.28 each independently represent a hydrogen atom or the like).

Provided are: a retardation-increasing agent that has excellent compatibility and, when incorporated into a resin film, is capable of not only adjusting the thickness-direction phase difference toward a positive direction but also imparting the film with high retardation; a cellulose-based resin composition comprising the retardation-increasing agent; and a film that is obtained from the cellulose-based resin composition and has excellent optical properties. The retardation-increasing agent comprises a compound represented by the following Formula (1) or (2):

##STR00001## (wherein, R.sup.1 to R.sup.10 each independently represent a hydrogen atom or the like); or

##STR00002## (wherein, R.sup.21 to R.sup.28 each independently represent a hydrogen atom or the like).