An object of the present invention is to provide an adhesive having sufficient adhesion strength during heat-curing when a lens holder and a substrate on which an imaging element is fixed are bonded in camera module assembly, and also having excellent adhesion strength and position accuracy after a high-temperature and high-humidity durability test after curing. The present invention relates to a resin composition comprises (a) a (meth)acrylate group-containing resin, (b) a specific polyfunctional thiol, and (c) a latent curing agent.

An object of the present invention is to provide an adhesive having sufficient adhesion strength during heat-curing when a lens holder and a substrate on which an imaging element is fixed are bonded in camera module assembly, and also having excellent adhesion strength and position accuracy after a high-temperature and high-humidity durability test after curing. The present invention relates to a resin composition comprises (a) a (meth)acrylate group-containing resin, (b) a specific polyfunctional thiol, and (c) a latent curing agent.

The present disclosure is directed to systems and methods for providing a dielectric layer on a semiconductor substrate capable of supporting very high density interconnects (i.e., ≥100 IO/mm). The dielectric layer includes a maleimide polymer in which a thiol-terminated functional group crosslinks with an epoxy resin. The resultant dielectric material provides a dielectric constant of less than 3 and a dissipation factor of less than 0.001. Additionally, the thiol functional group forms coordination complexes with noble metals present in the conductive structures, thus by controlling the stoichiometry of epoxy to polyimide, the thiol-polyimide may beneficially provide an adhesion enhancer between the dielectric and noble metal conductive structures.

The present invention relates to covalent adaptable networks (CANs) having exchangeable crosslinks that are able to undergo repeated covalent bond reshuffling through photo-activation at ambient temperatures. The invention provides covalent adaptable network forming compositions as well as methods of forming, remolding and recycling the CANs of the invention.

Provided is a polymerizable liquid (or “resin”) for producing three-dimensional objects by additive manufacturing, which may include one or more of: (a) a polyvinyl siloxane; (b) a polythiol crosslinker; (c) a photoinitiator (e.g., a free radical photoinitiator); (d) optionally, a urethane (meth)acrylate oligomer; (e) optionally, a reactive diluent; (f) optionally, but in some embodiments preferably, a pigment or dye; (g) optionally, but in some embodiments preferably, a reactive or non-reactive filler; and (h) optionally, an odor scavenger.

Provided is a polymerizable liquid (or “resin”) for producing three-dimensional objects by additive manufacturing, which may include one or more of: (a) a polyvinyl siloxane; (b) a polythiol crosslinker; (c) a photoinitiator (e.g., a free radical photoinitiator); (d) optionally, a urethane (meth)acrylate oligomer; (e) optionally, a reactive diluent; (f) optionally, but in some embodiments preferably, a pigment or dye; (g) optionally, but in some embodiments preferably, a reactive or non-reactive filler; and (h) optionally, an odor scavenger.

Provided is a polymerizable liquid (or “resin”) for producing three-dimensional objects by additive manufacturing, which may include one or more of: (a) a polyvinyl siloxane; (b) a polythiol crosslinker; (c) a photoinitiator (e.g., a free radical photoinitiator); (d) optionally, a urethane (meth)acrylate oligomer; (e) optionally, a reactive diluent; (f) optionally, but in some embodiments preferably, a pigment or dye; (g) optionally, but in some embodiments preferably, a reactive or non-reactive filler; and (h) optionally, an odor scavenger.

A photocurable silicone composition is disclosed. A cured product of the composition is also disclosed. The photocurable silicone composition comprises: (A) an organopolysiloxane having at least one aryl group with 6 to 12 carbons and at least one alkenyl group with 2 to 12 carbons in a molecule; (B) an organic compound having at least two ether bonds and at least one aliphatic carbon-carbon double bond in a molecule; (C) a thiol group-containing organic compound comprising; (C.sub.1) an organic compound having two thiol groups in a molecule, and (C.sub.2) an organic compound having at least three thiol groups in a molecule; and (D) a photoradical initiator. The composition generally suppresses crack and delamination of a cured product laminated between two substrates after thermal aging.

A photocurable silicone composition is disclosed. A cured product of the composition is also disclosed. The photocurable silicone composition comprises: (A) an organopolysiloxane having at least one aryl group with 6 to 12 carbons and at least one alkenyl group with 2 to 12 carbons in a molecule; (B) an organic compound having at least two ether bonds and at least one aliphatic carbon-carbon double bond in a molecule; (C) a thiol group-containing organic compound comprising; (C.sub.1) an organic compound having two thiol groups in a molecule, and (C.sub.2) an organic compound having at least three thiol groups in a molecule; and (D) a photoradical initiator. The composition generally suppresses crack and delamination of a cured product laminated between two substrates after thermal aging.

A photocurable silicone composition is disclosed. A cured product of the composition is also disclosed. The photocurable silicone composition comprises: (A) an organopolysiloxane having at least one aryl group with 6 to 12 carbons and at least one alkenyl group with 2 to 12 carbons in a molecule; (B) an organic compound having at least two ether bonds and at least one aliphatic carbon-carbon double bond in a molecule; (C) a thiol group-containing organic compound comprising; (C.sub.1) an organic compound having two thiol groups in a molecule, and (C.sub.2) an organic compound having at least three thiol groups in a molecule; and (D) a photoradical initiator. The composition generally suppresses crack and delamination of a cured product laminated between two substrates after thermal aging.