Process for preparing a reinforced rubber composition, said process comprising the step mixing, at a temperature of at least 120° C., at least the following compounds: (i) a rubber, (ii) at least one inorganic filler, (iii) at least one organic peroxide, and (iv) at least one anti-oxidant selected from phenolics, para-phenylidene diamines, and nitroxides.

A styrene resin having a syndiotactic structure, with an endothermic amount in a range of 175 to 260° C. of less than 30% based on the total endothermic amount, and a styrene resin composition containing 50 to 95% by mass of a thermoplastic resin composition and 5 to 50% by mass of a glass filler, the thermoplastic resin composition containing 100 parts by mass containing 80 to 100% by mass of a styrene resin having a syndiotactic structure and 0 to 20% by mass of a rubbery elastic material, 0.2 to 2.0 parts by mass of at least one kind of an antioxidant selected from a phenol-based antioxidant and a sulfur antioxidant, 1.5 to 5.0 parts by mass of at least one kind of a compound selected from a polyphenylene ether or a modified polyphenylene ether, and at least one kind selected from a nucleating agent or a release agent.

Components for articles of footwear and athletic equipment are provided including a high energy return foam having improved abrasion resistance. A variety of foams and foam components and compositions for forming the foams are provided. In some aspects, the foams and components including the foams can have exceptionally high energy return while also having improved durability and softness and an improved abrasion resistance. In particular, midsoles including the foams are provided for use in an article of footwear. Methods of making the compositions and foams are provided, as well as methods of making an article of footwear including one of the foam components. In some aspects, the foams and foam components can be made by injection molding or injection molding followed by compression molding.

The present invention relates to a composition including a chloroprene polymer, a molded body, and a method for producing a molded body, and the composition includes a chloroprene polymer (A), and a thiol compound (B) having 2 mercapto groups in a molecule. An amount of the thiol compound (B) is 1.5 to 20 parts by mass per 100 parts by mass of the chloroprene polymer (A).

The present invention relates to a composition including a chloroprene polymer, a molded body, and a method for producing a molded body, and the composition includes a chloroprene polymer (A), and a thiol compound (B) having 2 mercapto groups in a molecule. An amount of the thiol compound (B) is 1.5 to 20 parts by mass per 100 parts by mass of the chloroprene polymer (A).

The present invention relates to a composition including a chloroprene polymer, a molded body, and a method for producing a molded body, and the composition includes a chloroprene polymer (A), and a thiol compound (B) having 2 mercapto groups in a molecule. An amount of the thiol compound (B) is 1.5 to 20 parts by mass per 100 parts by mass of the chloroprene polymer (A).

The present invention relates to a latex composition, a molded body, and a method for producing a molded body, and the latex composition includes a chloroprene polymer (A), and a thiol compound (B) having 2 or more mercapto groups in a molecule.

The present invention relates to a latex composition, a molded body, and a method for producing a molded body, and the latex composition includes a chloroprene polymer (A), and a thiol compound (B) having 2 or more mercapto groups in a molecule.

Embodiments are generally directed to dielectric film with pressure sensitive microcapsules of adhesion promoter. An embodiment of an apparatus includes a dielectric film, the dielectric film including a dielectric material layer; a layer of pressure sensitive microcapsules on a first side of the dielectric material layer, the microcapsules including an adhesion promoter; and a cover material on the layer of microcapsules. The pressure sensitive microcapsules are to rupture upon application of a certain rupture pressure.

Embodiments are generally directed to dielectric film with pressure sensitive microcapsules of adhesion promoter. An embodiment of an apparatus includes a dielectric film, the dielectric film including a dielectric material layer; a layer of pressure sensitive microcapsules on a first side of the dielectric material layer, the microcapsules including an adhesion promoter; and a cover material on the layer of microcapsules. The pressure sensitive microcapsules are to rupture upon application of a certain rupture pressure.