C08K5/41

Photopolymerizable dental composites with rapid curing and low shrinkage stress
11673980 · 2023-06-13 · ·

Radically polymerizable material, which contains (a) 0.01 to 5 wt.-% of at least one transfer reagent, (b) 5 to 60 wt.-% of at least one multifunctional (meth)acrylate or a mixture of mono- and multifunctional (meth)acrylates, (c) 0.01 to 3.0 wt.-% of a mixture of at least one monomolecular and at least one bimolecular photoinitiator, (d) 30 to 90 wt.-% of at least one filler, and (e) optionally additive(s), wherein the material contains as transfer reagent (a) at least one allyl sulfone of Formula I and/or a vinyl sulfone ester of Formula II.

Polyimide precursor solution and method for producing porous polyimide film

A polyimide precursor solution includes: a polyimide precursor; a resin particle having 55% by weight or more of a structural unit derived from a styrene derivative; and a mixed solvent containing a first organic solvent (S1) and a second organic solvent (S2), wherein the polyimide precursor solution satisfies the following conditions (1) to (4), condition (1): a weight ratio (S1/S2) of the first organic solvent (S1) to the second organic solvent (S2) is from 50/50 to 90/10, condition (2): a HSP distance between the first organic solvent (S1) and the resin particle is 11 or more and less than 16, condition (3): a HSP distance between the second organic solvent (S2) and the resin particle is 16 or more, and condition (4): a HSP distance between the mixed solvent and the polyimide precursor is 12 or less.

Polyimide precursor solution and method for producing porous polyimide film

A polyimide precursor solution includes: a polyimide precursor; a resin particle having 55% by weight or more of a structural unit derived from a styrene derivative; and a mixed solvent containing a first organic solvent (S1) and a second organic solvent (S2), wherein the polyimide precursor solution satisfies the following conditions (1) to (4), condition (1): a weight ratio (S1/S2) of the first organic solvent (S1) to the second organic solvent (S2) is from 50/50 to 90/10, condition (2): a HSP distance between the first organic solvent (S1) and the resin particle is 11 or more and less than 16, condition (3): a HSP distance between the second organic solvent (S2) and the resin particle is 16 or more, and condition (4): a HSP distance between the mixed solvent and the polyimide precursor is 12 or less.

Sorbic acid ester containing coatings composition

The present invention is a composition comprising a solution or a dispersion of polymer particles, a sorbate ester or sorbamide curing agent, and a cure modulating additive for the curing agent. The curing agent is a sorbic acid ester or a sorbamide and the cure modulating agent is a reagent capable of accelerating or attenuating the rate of cure of the curing agent. The control of cure kinetics is important for speeding up cure rates where rates are too slow or by reducing cure rates where curing too rapidly results in undesirable color formation.

ADDITIVE COMPOSITION AND USE THEREOF, CONDENSATION POLYMER COMPOSITION, MOLDING COMPOUND AND MOLDING COMPOUNDS PRODUCED THEREFROM, AND MOLDED PARTS AND USE THEREOF

The invention relates to an additive composition with inorganic sulfites, organic derivatives of sulfurous acid and/or thiosulfates, and organic phosphorus compounds, said composition being capable of accelerating the hydrolytic decomposition of a thermoplastic condensation polymer upon working said additive composition into the condensation polymer. The invention additionally relates to a condensation polymer composition which is additivized with an additive composition according to the invention. The invention additionally relates to a method for the hydrolytic decomposition of a thermoplastic condensation polymer and to uses of the additive composition according to the invention and the thermoplastic condensation polymer composition.

ADDITIVE COMPOSITION AND USE THEREOF, CONDENSATION POLYMER COMPOSITION, MOLDING COMPOUND AND MOLDING COMPOUNDS PRODUCED THEREFROM, AND MOLDED PARTS AND USE THEREOF

The invention relates to an additive composition with inorganic sulfites, organic derivatives of sulfurous acid and/or thiosulfates, and organic phosphorus compounds, said composition being capable of accelerating the hydrolytic decomposition of a thermoplastic condensation polymer upon working said additive composition into the condensation polymer. The invention additionally relates to a condensation polymer composition which is additivized with an additive composition according to the invention. The invention additionally relates to a method for the hydrolytic decomposition of a thermoplastic condensation polymer and to uses of the additive composition according to the invention and the thermoplastic condensation polymer composition.

ADDITIVE COMPOSITION AND USE THEREOF, CONDENSATION POLYMER COMPOSITION, MOLDING COMPOUND AND MOLDING COMPOUNDS PRODUCED THEREFROM, AND MOLDED PARTS AND USE THEREOF

The invention relates to an additive composition with inorganic sulfites, organic derivatives of sulfurous acid and/or thiosulfates, and organic phosphorus compounds, said composition being capable of accelerating the hydrolytic decomposition of a thermoplastic condensation polymer upon working said additive composition into the condensation polymer. The invention additionally relates to a condensation polymer composition which is additivized with an additive composition according to the invention. The invention additionally relates to a method for the hydrolytic decomposition of a thermoplastic condensation polymer and to uses of the additive composition according to the invention and the thermoplastic condensation polymer composition.

Process for producing particles

A process for producing particles, the process including pulverizing particles of a compound represented by formula (I) with a median diameter (50% D) of over 100 μm by using a pulverizer in the presence of at least one member selected from the group consisting of silica, talc and clay, to obtain particles of the compound represented by formula (I) with a median diameter (50% D) of 100 μm or less, ##STR00001##
in formula (I), R.sup.1 and R.sup.2 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, or alternatively, R.sup.1 and R.sup.2 are inked to each other to form a ring together with the nitrogen atom to which they are bound, m represents an integer of 2 to 9, M.sup.n+ represents H.sup.+ or an n-valent metal ion, and n represents an integer of 1 or 2.

Process for producing particles

A process for producing particles, the process including pulverizing particles of a compound represented by formula (I) with a median diameter (50% D) of over 100 μm by using a pulverizer in the presence of at least one member selected from the group consisting of silica, talc and clay, to obtain particles of the compound represented by formula (I) with a median diameter (50% D) of 100 μm or less, ##STR00001##
in formula (I), R.sup.1 and R.sup.2 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, or alternatively, R.sup.1 and R.sup.2 are inked to each other to form a ring together with the nitrogen atom to which they are bound, m represents an integer of 2 to 9, M.sup.n+ represents H.sup.+ or an n-valent metal ion, and n represents an integer of 1 or 2.

Process for producing particles

A process for producing particles, the process including pulverizing particles of a compound represented by formula (I) with a median diameter (50% D) of over 100 μm by using a pulverizer in the presence of at least one member selected from the group consisting of silica, talc and clay, to obtain particles of the compound represented by formula (I) with a median diameter (50% D) of 100 μm or less, ##STR00001##
in formula (I), R.sup.1 and R.sup.2 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, or alternatively, R.sup.1 and R.sup.2 are inked to each other to form a ring together with the nitrogen atom to which they are bound, m represents an integer of 2 to 9, M.sup.n+ represents H.sup.+ or an n-valent metal ion, and n represents an integer of 1 or 2.