A piezoelectric polyvinylidene fluoride (PVDF) material, a method for manufacturing the same, and a fingerprint recognition module are provided. The polyvinylidene PVDF material includes PVDF, a first solvent, a second solvent, a fluorosurfactant, and an inducing material. Material of the inducing material is one of carbon nanotubes, carbon black, and gold nanorods. Because of the high anisotropy of the inducing material, molecular orientation of the PVDF material is induced, thereby improving piezoelectric performance of the piezoelectric PVDF material. Problems of conventional piezoelectric PVDF materials, which are used in ultrasonic fingerprint recognition modules, such as poor piezoelectric performance and high-energy loss are improved.

A composition for inhibiting oxidation including an anionic, hydrophilic, water soluble polymer, wherein the polymer is chosen from the group consisting of anionic polyacrylamide, methylcellulose, xanthan gum, guar gum, and lignin sulfonate, an anionic surfactant, a co-solvent, and water is herein disclosed.

A composition for inhibiting oxidation including an anionic, hydrophilic, water soluble polymer, wherein the polymer is chosen from the group consisting of anionic polyacrylamide, methylcellulose, xanthan gum, guar gum, and lignin sulfonate, an anionic surfactant, a co-solvent, and water is herein disclosed.

A curable composition includes: a near infrared absorbing compound that includes a cation having an absorption in a near infrared range and an anion; a salt of an anion that is a component other than the near infrared absorbing compound and has a conjugate acid pKa of −8 or lower; and a curable compound.

A curable composition includes: a near infrared absorbing compound that includes a cation having an absorption in a near infrared range and an anion; a salt of an anion that is a component other than the near infrared absorbing compound and has a conjugate acid pKa of −8 or lower; and a curable compound.

A curable composition includes: a near infrared absorbing compound that includes a cation having an absorption in a near infrared range and an anion; a salt of an anion that is a component other than the near infrared absorbing compound and has a conjugate acid pKa of −8 or lower; and a curable compound.

A PEDOT:PSS film having enhanced thermoelectric properties is doped with DMSO and a binary secondary dopant, such as PEO. The composition of such film causes the ratios of PEDOT in bipolaron states to be increased. As a result, the Seebeck coefficient, the electrical conductivities, and power factor of the film are increased, thereby increasing the efficiency of the film. Thus, a thermoelectric device that uses the film is able to achieve enhanced operating performance.

A PEDOT:PSS film having enhanced thermoelectric properties is doped with DMSO and a binary secondary dopant, such as PEO. The composition of such film causes the ratios of PEDOT in bipolaron states to be increased. As a result, the Seebeck coefficient, the electrical conductivities, and power factor of the film are increased, thereby increasing the efficiency of the film. Thus, a thermoelectric device that uses the film is able to achieve enhanced operating performance.

Anaerobic curing formulations for sealing and/or blocking screws, nuts, bolts and screw or sealing caps are described. The sealing formulation comprises at least one acrylic resin and phenoxy-polyethoxy sulphate. The self-locking formulation comprises at least one diacrylate, an acrylic resin, a microencapsulated polymerisation initiator and a microencapsulated polymerisation accelerator. A method is described for coating a polymerization accelerator to obtain a microencapsulated polymerisation accelerator.

Anaerobic curing formulations for sealing and/or blocking screws, nuts, bolts and screw or sealing caps are described. The sealing formulation comprises at least one acrylic resin and phenoxy-polyethoxy sulphate. The self-locking formulation comprises at least one diacrylate, an acrylic resin, a microencapsulated polymerisation initiator and a microencapsulated polymerisation accelerator. A method is described for coating a polymerization accelerator to obtain a microencapsulated polymerisation accelerator.