An adhesive film for polarizing plates, a polarizing plate including the same, and an optical display apparatus including the same are provided. An adhesive film for polarizing plates is formed of an adhesive composition including a (meth)acrylic copolymer, an isocyanate curing agent, a metal chelate curing agent, and an antistatic agent, and has a surface resistance difference ΔSR of 1.0 (log(Ω/□)) or less, as calculated by Equation 1 and, in Equation 1, SR1 is 10 (log(Ω/□)) or less.

An adhesive film for polarizing plates, a polarizing plate including the same, and an optical display apparatus including the same are provided. An adhesive film for polarizing plates is formed of an adhesive composition including a (meth)acrylic copolymer, an isocyanate curing agent, a metal chelate curing agent, and an antistatic agent, and has a surface resistance difference ΔSR of 1.0 (log(Ω/□)) or less, as calculated by Equation 1 and, in Equation 1, SR1 is 10 (log(Ω/□)) or less.

A resin composition for forming a phase-separated structure, including a block copolymer, and an ion liquid containing a compound having a cation moiety and an anion moiety, the anion moiety being represented by general formula (a1), (a2) or (a3), in which X″ represents an alkylene group of 2 to 6 carbon atoms in which at least one hydrogen atom is substituted with a fluorine atom; Y″ and Z″ each independently represents an alkyl group of 1 to 10 carbon atoms in which at least one hydrogen atom is substituted with a fluorine atom; R″ represents an alkyl group of 1 to 5 carbon atoms in which at least one hydrogen atom is optionally substituted with a fluorine atom, m represents an integer of 1 to 6, and n represents an integer of 0 to 5, provided that m+n=6.

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The present application refers to a process for the modification of polypropylene, wherein amount, size and configuration of the branches are controlled, the process comprising the steps of (A) preparing a bis(sulphonazide) (BSA) masterbatch by dispersing BSA in polyolefin; (B) adding (i) at least one fatty acid salt with metal cation having valence of 1.sup.+ to 3.sup.+; and (ii) the BSA masterbatch prepared in step (A) to the polypropylene to be modified. Said modified polypropylene of the present invention possesses properties suitable for use in foaming, blowing, thermoforming, recoating, film extrusion, BOPP, spinning processes and other processes and applications, and it is also suitable to be in contact with food products.

The present application refers to a process for the modification of polypropylene, wherein amount, size and configuration of the branches are controlled, the process comprising the steps of (A) preparing a bis(sulphonazide) (BSA) masterbatch by dispersing BSA in polyolefin; (B) adding (i) at least one fatty acid salt with metal cation having valence of 1.sup.+ to 3.sup.+; and (ii) the BSA masterbatch prepared in step (A) to the polypropylene to be modified. Said modified polypropylene of the present invention possesses properties suitable for use in foaming, blowing, thermoforming, recoating, film extrusion, BOPP, spinning processes and other processes and applications, and it is also suitable to be in contact with food products.

The present application refers to a process for the modification of polypropylene, wherein amount, size and configuration of the branches are controlled, the process comprising the steps of (A) preparing a bis(sulphonazide) (BSA) masterbatch by dispersing BSA in polyolefin; (B) adding (i) at least one fatty acid salt with metal cation having valence of 1.sup.+ to 3.sup.+; and (ii) the BSA masterbatch prepared in step (A) to the polypropylene to be modified. Said modified polypropylene of the present invention possesses properties suitable for use in foaming, blowing, thermoforming, recoating, film extrusion, BOPP, spinning processes and other processes and applications, and it is also suitable to be in contact with food products.

To provide a film which is excellent in releasing property with respect to a resin sealed portion and excellent in low migration property and peeling property with respect to a semiconductor chip, a source electrode or a sealing glass and which is suitable as a mold release film for producing a semiconductor element having a part of the surface of a semiconductor chip, source electrode or sealing glass exposed. A film 1 which comprises a substrate 3 and an adhesive layer 5, wherein the storage elastic modulus at 180° C. of the substrate 3 is from 10 to 100 MPa, and the adhesive layer 5 is a reaction cured product of a composition for adhesive layer comprising a specific acrylic polymer and a polyfunctional isocyanate compound, wherein the number of moles M.sub.OH of hydroxy groups and the number of moles M.sub.COOH of carboxy groups, derived from the acrylic polymer, and the number of moles M.sub.NCO of isocyanate groups derived from the polyfunctional isocyanate compound, satisfy a specific relation, and which is suitable as a mold release film for producing a semiconductor element.

To provide a film which is excellent in releasing property with respect to a resin sealed portion and excellent in low migration property and peeling property with respect to a semiconductor chip, a source electrode or a sealing glass and which is suitable as a mold release film for producing a semiconductor element having a part of the surface of a semiconductor chip, source electrode or sealing glass exposed. A film 1 which comprises a substrate 3 and an adhesive layer 5, wherein the storage elastic modulus at 180° C. of the substrate 3 is from 10 to 100 MPa, and the adhesive layer 5 is a reaction cured product of a composition for adhesive layer comprising a specific acrylic polymer and a polyfunctional isocyanate compound, wherein the number of moles M.sub.OH of hydroxy groups and the number of moles M.sub.COOH of carboxy groups, derived from the acrylic polymer, and the number of moles M.sub.NCO of isocyanate groups derived from the polyfunctional isocyanate compound, satisfy a specific relation, and which is suitable as a mold release film for producing a semiconductor element.

A matrix resin composition for fiber reinforced composite materials is described. The resin is thermosetting and achieves a glass transition temperature of at least 177° C. (Tg), obtained by curing under anaerobic conditions at room temperature. The matrix resin will streamline composite fabrication processes by eliminating the need for heating during the cure process. The implications of this development are significant in terms of the ease of use and elimination of procedural steps. While the resin system was developed specifically for vacuum bagging, it is expected to be viable for other composite fabrication methods including resin transfer molding (RTM) and vacuum-assisted resin transfer molding (VARTM). The resin system is viable for use with carbon fiber reinforcements to fabricate laminates at least 0.20 inches thick. The resulting laminates have low porosity and mechanical properties equivalent to those prepared with common epoxy matrix resins.

A matrix resin composition for fiber reinforced composite materials is described. The resin is thermosetting and achieves a glass transition temperature of at least 177° C. (Tg), obtained by curing under anaerobic conditions at room temperature. The matrix resin will streamline composite fabrication processes by eliminating the need for heating during the cure process. The implications of this development are significant in terms of the ease of use and elimination of procedural steps. While the resin system was developed specifically for vacuum bagging, it is expected to be viable for other composite fabrication methods including resin transfer molding (RTM) and vacuum-assisted resin transfer molding (VARTM). The resin system is viable for use with carbon fiber reinforcements to fabricate laminates at least 0.20 inches thick. The resulting laminates have low porosity and mechanical properties equivalent to those prepared with common epoxy matrix resins.