Patent classifications
C08K5/50
ELECTROPHOTOGRAPHIC MEMBER AND ELECTROPHOTOGRAPHIC IMAGE FORMING APPARATUS
An electrophotographic member includes a base layer and an elastic layer on the base layer, wherein the elastic layer includes a matrix rubber, an ionic liquid including an anion and a cation, and an inorganic layered double hydroxide compound, wherein the anion is at least one selected from the group consisting of structural formulae (1) to (3), the cation is at least one selected from the group consisting of structural formulae (4) to (7), and the inorganic layered double hydroxide compound has an average value of interlayer distances of 4 Å or larger and 8 Å or smaller, which are measured by XRD.
ELECTROPHOTOGRAPHIC MEMBER AND ELECTROPHOTOGRAPHIC IMAGE FORMING APPARATUS
An electrophotographic member includes a base layer and an elastic layer on the base layer, wherein the elastic layer includes a matrix rubber, an ionic liquid including an anion and a cation, and an inorganic layered double hydroxide compound, wherein the anion is at least one selected from the group consisting of structural formulae (1) to (3), the cation is at least one selected from the group consisting of structural formulae (4) to (7), and the inorganic layered double hydroxide compound has an average value of interlayer distances of 4 Å or larger and 8 Å or smaller, which are measured by XRD.
ELECTROPHOTOGRAPHIC MEMBER AND ELECTROPHOTOGRAPHIC IMAGE FORMING APPARATUS
An electrophotographic member comprising a base layer and an elastic layer on the base layer. The elastic layer comprises a silicone rubber, at least one first cation selected from the group consisting of a cation of Structural Formula (1-1) and a cation of Structural Formula (1-2), at least one second cation selected from the group consisting of a cation of Structural Formula (2-1) and a cation of Structural Formula (2-2), and an anion.
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ELECTROPHOTOGRAPHIC MEMBER AND ELECTROPHOTOGRAPHIC IMAGE FORMING APPARATUS
An electrophotographic member comprising a base layer and an elastic layer on the base layer. The elastic layer comprises a silicone rubber, at least one first cation selected from the group consisting of a cation of Structural Formula (1-1) and a cation of Structural Formula (1-2), at least one second cation selected from the group consisting of a cation of Structural Formula (2-1) and a cation of Structural Formula (2-2), and an anion.
##STR00001##
ELECTROPHOTOGRAPHIC MEMBER AND ELECTROPHOTOGRAPHIC IMAGE FORMING APPARATUS
An electrophotographic member comprising a base layer and an elastic layer on the base layer. The elastic layer comprises a silicone rubber, at least one first cation selected from the group consisting of a cation of Structural Formula (1-1) and a cation of Structural Formula (1-2), at least one second cation selected from the group consisting of a cation of Structural Formula (2-1) and a cation of Structural Formula (2-2), and an anion.
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FILM-FORMING COMPOSITION
A film-forming composition for forming a resist underlayer film for a solvent development type resist that is capable of forming a good resist pattern which contains a hydrolysis-condensation product of a hydrolyzable silane compound, at least one substance that is selected from the group consisting of an aminoplast crosslinking agent and a phenoplast crosslinking agent, and a solvent, and wherein the hydrolyzable silane compound contains a hydrolyzable silane represented by formula (1).
Epoxy resin composition for encapsulating semiconductor device and semiconductor device prepared using the same
An epoxy resin composition for encapsulation of a semiconductor device and a semiconductor device encapsulated with the epoxy resin composition, the composition including an epoxy resin; a curing agent; an inorganic filler; a curing catalyst; and a compound containing at least one hydroxyl group, wherein the curing catalyst includes a phosphonium compound represented by Formula 4: ##STR00001##
Epoxy resin composition for encapsulating semiconductor device and semiconductor device prepared using the same
An epoxy resin composition for encapsulation of a semiconductor device and a semiconductor device encapsulated with the epoxy resin composition, the composition including an epoxy resin; a curing agent; an inorganic filler; a curing catalyst; and a compound containing at least one hydroxyl group, wherein the curing catalyst includes a phosphonium compound represented by Formula 4: ##STR00001##
Laminate
The invention provides a laminate including a fluoroelastomer layer and a fluororesin layer which are firmly bonded to each other. The laminate includes a fluoroelastomer layer (A) and a fluororesin layer (B) stacked on the fluoroelastomer layer (A). The fluoroelastomer layer (A) is a layer formed from a fluoroelastomer composition. The fluoroelastomer composition contains a fluoroelastomer, a basic multifunctional compound, and at least one compound (a) selected from the group consisting of a fluororesin (a1) and a phosphorus compound (a2). The compound (a) is present in an amount of 0.01 to 120 parts by mass relative to 100 parts by mass of the fluoroelastomer. The fluororesin layer (B) is formed from a fluororesin (b1) having a fuel permeability coefficient of 2.0 g.Math.mm/m.sup.2/day or lower.
Laminate
The invention provides a laminate including a fluoroelastomer layer and a fluororesin layer which are firmly bonded to each other. The laminate includes a fluoroelastomer layer (A) and a fluororesin layer (B) stacked on the fluoroelastomer layer (A). The fluoroelastomer layer (A) is a layer formed from a fluoroelastomer composition. The fluoroelastomer composition contains a fluoroelastomer, a basic multifunctional compound, and at least one compound (a) selected from the group consisting of a fluororesin (a1) and a phosphorus compound (a2). The compound (a) is present in an amount of 0.01 to 120 parts by mass relative to 100 parts by mass of the fluoroelastomer. The fluororesin layer (B) is formed from a fluororesin (b1) having a fuel permeability coefficient of 2.0 g.Math.mm/m.sup.2/day or lower.