Patent classifications
C08K5/51
Method for producing polyether carbonate polyols
The invention relates to a method for producing polyether carbonate polyols, (i) one or more alkylene oxide(s) and carbon dioxide being added to one or more H-functional starter substance(s) in the presence of a double metal cyanide catalyst or in the presence of a metal complex catalyst based on the metals zinc and/or cobalt, a reaction mixture containing the polyether carbonate polyol being obtained, characterized in that (ii) at least one component K is added to the obtained reaction mixture containing the polyether carbonate polyol, wherein component K is selected from at least one compound that contains a phosphorus-oxygen bond or a compound of phosphorus that can form one or more P—O bonds by reaction with OH-functional compounds.
Method for producing polyether carbonate polyols
The invention relates to a method for producing polyether carbonate polyols, (i) one or more alkylene oxide(s) and carbon dioxide being added to one or more H-functional starter substance(s) in the presence of a double metal cyanide catalyst or in the presence of a metal complex catalyst based on the metals zinc and/or cobalt, a reaction mixture containing the polyether carbonate polyol being obtained, characterized in that (ii) at least one component K is added to the obtained reaction mixture containing the polyether carbonate polyol, wherein component K is selected from at least one compound that contains a phosphorus-oxygen bond or a compound of phosphorus that can form one or more P—O bonds by reaction with OH-functional compounds.
Fire-retardant composition of an alloy of polyamide and polyester resins
The present invention relates to a composition comprising at least a thermoplastic polyamide resin, a thermoplastic polyester resin, a reinforcing or bulking filler and a fire retardant. Said composition does not comprise any compatibilizer for the polyamide and the polyester, such as an agent of polymeric type, and especially no epoxy resin. Such a fire-retardant polyamide/polyester composition shows good compatibility and good mechanical and fire-retardant properties, especially a good capacity not to form flames in the presence of glowing agents, for example in the field of domestic electrical appliances, electrics and electronics.
Fire-retardant composition of an alloy of polyamide and polyester resins
The present invention relates to a composition comprising at least a thermoplastic polyamide resin, a thermoplastic polyester resin, a reinforcing or bulking filler and a fire retardant. Said composition does not comprise any compatibilizer for the polyamide and the polyester, such as an agent of polymeric type, and especially no epoxy resin. Such a fire-retardant polyamide/polyester composition shows good compatibility and good mechanical and fire-retardant properties, especially a good capacity not to form flames in the presence of glowing agents, for example in the field of domestic electrical appliances, electrics and electronics.
Polyamide composition and molded article
The present invention provides a polyamide composition containing 50 to 99 parts by mass of an aliphatic polyamide (1A) formed from a diamine and a dicarboxylic acid, and 1 to 50 parts by mass of a semi-aromatic polyamide (1B) containing a dicarboxylic acid unit that includes at least 75 mol % of isophthalic acid and a diamine unit that includes at least 50 mol % of a diamine of 4 to 10 carbon atoms, wherein the tan δ peak temperature of the polyamide composition is at least 90° C., and the weight average molecular weight Mw of the polyamide composition satisfies 15,000≤Mw≤35,000. The invention also provides a molded article or the like formed using the polyamide composition.
Polyamide composition and molded article
The present invention provides a polyamide composition containing 50 to 99 parts by mass of an aliphatic polyamide (1A) formed from a diamine and a dicarboxylic acid, and 1 to 50 parts by mass of a semi-aromatic polyamide (1B) containing a dicarboxylic acid unit that includes at least 75 mol % of isophthalic acid and a diamine unit that includes at least 50 mol % of a diamine of 4 to 10 carbon atoms, wherein the tan δ peak temperature of the polyamide composition is at least 90° C., and the weight average molecular weight Mw of the polyamide composition satisfies 15,000≤Mw≤35,000. The invention also provides a molded article or the like formed using the polyamide composition.
Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board
Provided are a thermosetting resin composition having especially good compatibility and having dielectric properties (low dielectric constant and low dielectric dissipation factor) in a high frequency range, high adhesion to conductor, excellent heat resistance, high glass transition temperature, low thermal expansion coefficient and high flame retardancy, and a prepreg, a laminate and a multilayer printed wiring board using the resin composition. Specifically, the thermosetting resin composition contains (A) a polyphenylene ether derivative having an N-substituted maleimide structure-containing group and a structural unit represented by the following general formula (I) in one molecule, (B) at least one thermosetting resin selected from the group consisting of epoxy resins, cyanate resins and maleimide compounds, and (C) a phosphorus flame retardant: ##STR00001##
wherein R.sup.1 each independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and x represents an integer of 0 to 4.
Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board
Provided are a thermosetting resin composition having especially good compatibility and having dielectric properties (low dielectric constant and low dielectric dissipation factor) in a high frequency range, high adhesion to conductor, excellent heat resistance, high glass transition temperature, low thermal expansion coefficient and high flame retardancy, and a prepreg, a laminate and a multilayer printed wiring board using the resin composition. Specifically, the thermosetting resin composition contains (A) a polyphenylene ether derivative having an N-substituted maleimide structure-containing group and a structural unit represented by the following general formula (I) in one molecule, (B) at least one thermosetting resin selected from the group consisting of epoxy resins, cyanate resins and maleimide compounds, and (C) a phosphorus flame retardant: ##STR00001##
wherein R.sup.1 each independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and x represents an integer of 0 to 4.
Polymer emulsion as binder for conductive composition
Provided herein are metal conductive compositions with improved conductivity. The improved conductivity is attributable to the addition of a sintering agent and a polymer emulsion.
Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the same
A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I): ##STR00001##
wherein m, n, l, R.sub.1, and R.sub.2 are as defined in the specification.