Patent classifications
C08K5/5399
CROSS-LINKED POLYMERIC MATERIALS AND ARTICLES
Reprocessable materials are provided that include a product of cross-linking a glycidyl methacrylate grafted high-density polyethylene (HDPE-g-GMA) with a polymacrolactone of formula (II) to form a cross-linked polymer exhibiting vitrimer characteristics. Methods for preparing the cross-linked polymer materials include reacting the glycidyl methacrylate grafted high-density polyethylene of with the polymacrolactone in the presence of a first catalyst under conditions that initiate cross-linking of HDPE-g-GMA with the polymacrolactone. Mechanically reprocessable articles include a structural element that is or includes the cross-linked polymer material. Examples of the mechanically reprocessable articles include pallets or molded structures formed from the material and configured to support a load of at least 1000 kg without bending.
POLYCARBONATE/POLYESTER COMPOSITION AND ARTICLE PREPARED THEREFROM
A composition includes specific amounts of an aromatic polycarbonate, a polycarbonate-polysiloxane block copolymer, a poly(alkylene terephthalate), a flame retardant, and a drip retardant. The flame retardant includes an oligomeric or polymeric bis(aryloxy)phosphazene in combination with an organophosphine oxide, an oligomeric or polymeric aromatic phosphonate, or a combination thereof. The composition is useful for fabricating parts for electrical and electronic devices.
POLYCARBONATE/POLYESTER COMPOSITION AND ARTICLE PREPARED THEREFROM
A composition includes specific amounts of an aromatic polycarbonate, a polycarbonate-polysiloxane block copolymer, a poly(alkylene terephthalate), a flame retardant, and a drip retardant. The flame retardant includes an oligomeric or polymeric bis(aryloxy)phosphazene in combination with an organophosphine oxide, an oligomeric or polymeric aromatic phosphonate, or a combination thereof. The composition is useful for fabricating parts for electrical and electronic devices.
Halogen-free flame retardant resin composition and the use thereof
The present invention relates to a halogen-free flame retardant resin composition, according to parts by weight, the resin composition comprises: (A) a mixture of phenoxyphosphazene compound (A1) and compound (A2) having a dihydrobenzoxazine ring, the mixture comprising 45-90 parts by weight, and the weight ratio of the phenoxyphosphazene compound (A1) and the compound (A2) having a dihydrobenzoxazine ring is between 1:25-1:2; (B) an epoxy resin with epoxy equivalent of 500-2000, the epoxy resin comprising 10-45 parts by weight; (C) a phenolic resin comprising 10-25 parts by weight; and (D) an amine curing agent comprising 0.5-10 parts by weight. The prepreg, laminate, and metal-clad laminate for the printed circuit prepared using the halogen-free flame retardant resin composition, have the advantages of high glass transition temperature (T.sub.g), high thermal resistance, low dielectric dissipation factor, low water absorption as well as a low C.T.E.
Halogen-free flame retardant resin composition and the use thereof
The present invention relates to a halogen-free flame retardant resin composition, according to parts by weight, the resin composition comprises: (A) a mixture of phenoxyphosphazene compound (A1) and compound (A2) having a dihydrobenzoxazine ring, the mixture comprising 45-90 parts by weight, and the weight ratio of the phenoxyphosphazene compound (A1) and the compound (A2) having a dihydrobenzoxazine ring is between 1:25-1:2; (B) an epoxy resin with epoxy equivalent of 500-2000, the epoxy resin comprising 10-45 parts by weight; (C) a phenolic resin comprising 10-25 parts by weight; and (D) an amine curing agent comprising 0.5-10 parts by weight. The prepreg, laminate, and metal-clad laminate for the printed circuit prepared using the halogen-free flame retardant resin composition, have the advantages of high glass transition temperature (T.sub.g), high thermal resistance, low dielectric dissipation factor, low water absorption as well as a low C.T.E.
Non-halogenated flame retardant polycarbonate compounds
A flame retardant polycarbonate compound is disclosed. The compound comprises a polycarbonate and non-halogenated polyphosphazene as a flame retardant, along with talc, polytetrafluoroethylene, and optionally, a potassium salt of perfluorobutane sulfonic acid. The compound can achieve a UL 94 rating of V-0 at two different thicknesses of less than 1 mm.
Non-halogenated flame retardant polycarbonate compounds
A flame retardant polycarbonate compound is disclosed. The compound comprises a polycarbonate and non-halogenated polyphosphazene as a flame retardant, along with talc, polytetrafluoroethylene, and optionally, a potassium salt of perfluorobutane sulfonic acid. The compound can achieve a UL 94 rating of V-0 at two different thicknesses of less than 1 mm.
Halogen-free resin composition and use thereof
The present invention relates to a halogen-free resin composition, a prepreg and a laminate prepared therefrom. The halogen-free resin composition comprises, based on the weight parts of organic solids, (A) from 40 to 80 parts by weight of allyl-modified benzoxazine resin, (B) from 10 to 20 parts by weight of hydrocarbon resin, (C) from 10 to 40 parts by weight of allyl-modified polyphenyl ether resin, (D) from 10 to 20 parts by weight of allyl-modified bismaleimide resin, (E) from 0.01 to 3 parts by weight of an initiator, (F) from 10 to 100 parts by weight of a filler, and (G) from 0 to 80 parts by weight of a phosphorus-containing flame retardant. The prepreg and laminate prepared from the halogen-free resin composition have lower dielectric constant and dielectric loss tangent value, higher peel strength, high glass transition temperature, excellent thermal resistance and better flame retardant effect.
Halogen-free resin composition and use thereof
The present invention relates to a halogen-free resin composition, a prepreg and a laminate prepared therefrom. The halogen-free resin composition comprises, based on the weight parts of organic solids, (A) from 40 to 80 parts by weight of allyl-modified benzoxazine resin, (B) from 10 to 20 parts by weight of hydrocarbon resin, (C) from 10 to 40 parts by weight of allyl-modified polyphenyl ether resin, (D) from 10 to 20 parts by weight of allyl-modified bismaleimide resin, (E) from 0.01 to 3 parts by weight of an initiator, (F) from 10 to 100 parts by weight of a filler, and (G) from 0 to 80 parts by weight of a phosphorus-containing flame retardant. The prepreg and laminate prepared from the halogen-free resin composition have lower dielectric constant and dielectric loss tangent value, higher peel strength, high glass transition temperature, excellent thermal resistance and better flame retardant effect.
METHOD FOR THE SYNTHESIS OF HETEROCYCLIC HYDROGEN PHOSPHINE OXIDE
A method for the synthesis of a heterocyclic hydrogen phosphine oxide, having the general formula:
##STR00001##
wherein:
R is a aliphatic or aromatic divalent group optionally including one or more heteroatoms and optionally having one or more substituents and
X and Y are independently selected from —O—, —C(O)O— and —NR′—
wherein R′ is a monovalent group optionally having one or more heteroatoms including the steps of:
a) forming a reaction mixture by mixing a compound having the general formula HX—R—YH and tetraphosphorus hexaoxide; and
b) recovering the resulting compound comprising the heterocyclic hydrogen phosphine oxide.